JP7323293B2 - 導電性フィルムおよびタッチパネル - Google Patents
導電性フィルムおよびタッチパネル Download PDFInfo
- Publication number
- JP7323293B2 JP7323293B2 JP2019022260A JP2019022260A JP7323293B2 JP 7323293 B2 JP7323293 B2 JP 7323293B2 JP 2019022260 A JP2019022260 A JP 2019022260A JP 2019022260 A JP2019022260 A JP 2019022260A JP 7323293 B2 JP7323293 B2 JP 7323293B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- copper
- oxide film
- conductive film
- hard coat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019022260A JP7323293B2 (ja) | 2019-02-12 | 2019-02-12 | 導電性フィルムおよびタッチパネル |
| KR1020200003288A KR102807196B1 (ko) | 2019-02-12 | 2020-01-09 | 도전성 필름 및 터치 패널 |
| CN202010085809.4A CN111554431A (zh) | 2019-02-12 | 2020-02-11 | 导电性薄膜和触摸面板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019022260A JP7323293B2 (ja) | 2019-02-12 | 2019-02-12 | 導電性フィルムおよびタッチパネル |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020128054A JP2020128054A (ja) | 2020-08-27 |
| JP2020128054A5 JP2020128054A5 (https=) | 2022-01-06 |
| JP7323293B2 true JP7323293B2 (ja) | 2023-08-08 |
Family
ID=72005526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019022260A Active JP7323293B2 (ja) | 2019-02-12 | 2019-02-12 | 導電性フィルムおよびタッチパネル |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7323293B2 (https=) |
| KR (1) | KR102807196B1 (https=) |
| CN (1) | CN111554431A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023173028A (ja) * | 2022-05-25 | 2023-12-07 | 日東電工株式会社 | 導電層付フィルムおよびフィルムアンテナ用積層フィルム |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002263834A (ja) | 2001-03-14 | 2002-09-17 | Mori Engineering:Kk | ワイヤボンディング、はんだづけ前処理方法 |
| JP2013130129A (ja) | 2011-12-21 | 2013-07-04 | Kawasaki Heavy Ind Ltd | エンジンのピストンの冷却構造 |
| JP2013139129A (ja) | 2012-01-05 | 2013-07-18 | Nitto Denko Corp | 導電性フィルム及び導電性フィルムロール |
| WO2017057262A1 (ja) | 2015-09-30 | 2017-04-06 | 住友金属鉱山株式会社 | 導電性基板 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5781428B2 (ja) | 2011-12-20 | 2015-09-24 | 日東電工株式会社 | 導電性フィルムおよび導電性フィルムロール |
| TWI550463B (zh) * | 2013-10-30 | 2016-09-21 | Lg化學股份有限公司 | 導電膜及其製造方法 |
| JP6953170B2 (ja) * | 2017-04-19 | 2021-10-27 | 日東電工株式会社 | 導電性フィルムおよびタッチパネル |
-
2019
- 2019-02-12 JP JP2019022260A patent/JP7323293B2/ja active Active
-
2020
- 2020-01-09 KR KR1020200003288A patent/KR102807196B1/ko active Active
- 2020-02-11 CN CN202010085809.4A patent/CN111554431A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002263834A (ja) | 2001-03-14 | 2002-09-17 | Mori Engineering:Kk | ワイヤボンディング、はんだづけ前処理方法 |
| JP2013130129A (ja) | 2011-12-21 | 2013-07-04 | Kawasaki Heavy Ind Ltd | エンジンのピストンの冷却構造 |
| JP2013139129A (ja) | 2012-01-05 | 2013-07-18 | Nitto Denko Corp | 導電性フィルム及び導電性フィルムロール |
| WO2017057262A1 (ja) | 2015-09-30 | 2017-04-06 | 住友金属鉱山株式会社 | 導電性基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020128054A (ja) | 2020-08-27 |
| KR102807196B1 (ko) | 2025-05-13 |
| KR20200098389A (ko) | 2020-08-20 |
| CN111554431A (zh) | 2020-08-18 |
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