JP7319594B2 - コネクタ装置 - Google Patents

コネクタ装置 Download PDF

Info

Publication number
JP7319594B2
JP7319594B2 JP2020039412A JP2020039412A JP7319594B2 JP 7319594 B2 JP7319594 B2 JP 7319594B2 JP 2020039412 A JP2020039412 A JP 2020039412A JP 2020039412 A JP2020039412 A JP 2020039412A JP 7319594 B2 JP7319594 B2 JP 7319594B2
Authority
JP
Japan
Prior art keywords
housing
resin portion
mold resin
connector device
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020039412A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021141001A (ja
JP2021141001A5 (enExample
Inventor
卓也 山下
辰雄 平林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2020039412A priority Critical patent/JP7319594B2/ja
Priority to US17/802,706 priority patent/US20230092720A1/en
Priority to PCT/JP2021/008562 priority patent/WO2021177426A1/ja
Priority to CN202180016995.9A priority patent/CN115152098A/zh
Publication of JP2021141001A publication Critical patent/JP2021141001A/ja
Publication of JP2021141001A5 publication Critical patent/JP2021141001A5/ja
Application granted granted Critical
Publication of JP7319594B2 publication Critical patent/JP7319594B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laser Beam Processing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2020039412A 2020-03-06 2020-03-06 コネクタ装置 Active JP7319594B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020039412A JP7319594B2 (ja) 2020-03-06 2020-03-06 コネクタ装置
US17/802,706 US20230092720A1 (en) 2020-03-06 2021-03-04 Connector device
PCT/JP2021/008562 WO2021177426A1 (ja) 2020-03-06 2021-03-04 コネクタ装置
CN202180016995.9A CN115152098A (zh) 2020-03-06 2021-03-04 连接器装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020039412A JP7319594B2 (ja) 2020-03-06 2020-03-06 コネクタ装置

Publications (3)

Publication Number Publication Date
JP2021141001A JP2021141001A (ja) 2021-09-16
JP2021141001A5 JP2021141001A5 (enExample) 2022-08-24
JP7319594B2 true JP7319594B2 (ja) 2023-08-02

Family

ID=77614064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020039412A Active JP7319594B2 (ja) 2020-03-06 2020-03-06 コネクタ装置

Country Status (4)

Country Link
US (1) US20230092720A1 (enExample)
JP (1) JP7319594B2 (enExample)
CN (1) CN115152098A (enExample)
WO (1) WO2021177426A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023111736A (ja) * 2022-01-31 2023-08-10 イリソ電子工業株式会社 電子機器
DE102024201563B3 (de) * 2024-02-21 2025-07-03 Schaeffler Technologies AG & Co. KG Partiell umspritze Leiterplatte, Verwendung der Leiterplatte und Herstellung der Leiterplatte

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103091A (ja) 2012-10-24 2014-06-05 Auto Network Gijutsu Kenkyusho:Kk 防水電子回路ユニットの製造方法及び電子回路ユニット
JP2014177051A (ja) 2013-03-15 2014-09-25 Denso Corp 溶着体のレーザー溶着方法
JP2014194899A (ja) 2013-03-29 2014-10-09 Yazaki Corp 防水コネクタ
WO2016084537A1 (ja) 2014-11-25 2016-06-02 日立オートモティブシステムズ株式会社 電子制御装置
WO2019039244A1 (ja) 2017-08-25 2019-02-28 日立オートモティブシステムズ株式会社 樹脂封止型車載電子制御装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0359673U (enExample) * 1989-10-17 1991-06-12
JPH1076528A (ja) * 1996-09-03 1998-03-24 Fujitsu Ten Ltd 金型構造及びコネクタの構造
DE19755497C1 (de) * 1997-12-13 1999-07-08 Hella Kg Hueck & Co Steuergerätegehäuse aus Kunststoff für ein Kraftfahrzeug
JP4281178B2 (ja) * 1999-10-06 2009-06-17 株式会社デンソー 半導体圧力センサ
JP4196546B2 (ja) * 2001-04-23 2008-12-17 株式会社デンソー 空気流量測定装置
CN2585308Y (zh) * 2002-10-25 2003-11-05 互亿科技股份有限公司 兼具防水和导光性能的资讯装置
JP2010040992A (ja) * 2008-08-08 2010-02-18 Hitachi Ltd 電子制御装置の製造方法とそのトランスファーモールド装置および電子制御装置
JP5056717B2 (ja) * 2008-10-16 2012-10-24 株式会社デンソー モールドパッケージの製造方法
EP2990769B1 (en) * 2013-04-26 2018-07-25 Hitachi Automotive Systems, Ltd. Flow sensor and method for producing a flow sensor as well as use of a flow sensor
JP6798436B2 (ja) * 2017-07-12 2020-12-09 株式会社オートネットワーク技術研究所 回路装置、回路装置の製造方法、およびコネクタ
JP2020202010A (ja) * 2019-06-05 2020-12-17 株式会社オートネットワーク技術研究所 コネクタ装置
JP7319595B2 (ja) * 2020-03-06 2023-08-02 株式会社オートネットワーク技術研究所 コネクタ装置、及びコネクタ装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103091A (ja) 2012-10-24 2014-06-05 Auto Network Gijutsu Kenkyusho:Kk 防水電子回路ユニットの製造方法及び電子回路ユニット
JP2014177051A (ja) 2013-03-15 2014-09-25 Denso Corp 溶着体のレーザー溶着方法
JP2014194899A (ja) 2013-03-29 2014-10-09 Yazaki Corp 防水コネクタ
WO2016084537A1 (ja) 2014-11-25 2016-06-02 日立オートモティブシステムズ株式会社 電子制御装置
WO2019039244A1 (ja) 2017-08-25 2019-02-28 日立オートモティブシステムズ株式会社 樹脂封止型車載電子制御装置

Also Published As

Publication number Publication date
JP2021141001A (ja) 2021-09-16
CN115152098A (zh) 2022-10-04
WO2021177426A1 (ja) 2021-09-10
US20230092720A1 (en) 2023-03-23

Similar Documents

Publication Publication Date Title
JP5969405B2 (ja) 車載用電子モジュール
KR100868842B1 (ko) 전자 제어 장치
JP5333436B2 (ja) 電気接続箱
JP7319594B2 (ja) コネクタ装置
JP5380749B2 (ja) ワイヤハーネス及びその製造方法
US11202373B2 (en) Connector device
JP2005080370A (ja) 回路構成体及び防水処理された回路構成体の製造方法
US11251553B2 (en) Connector device that includes welded portion
JP6034029B2 (ja) 接続構造体
WO2019039244A1 (ja) 樹脂封止型車載電子制御装置
JP6349365B2 (ja) コネクタ及びその製造方法
JP7319595B2 (ja) コネクタ装置、及びコネクタ装置の製造方法
JP2008288116A (ja) コネクタ、その製造方法及び接続装置
US20200313345A1 (en) Connector device
JP2018181522A (ja) 電気コネクタ
CN109476091B (zh) 形成激光焊接连接的方法和复合部件
JPH0139181B2 (enExample)
US6018127A (en) Wire connection structure
JP5532825B2 (ja) 電気接続箱
JP2007335254A (ja) 電子制御装置
JP2008192359A (ja) フラットケーブル
US20240145124A1 (en) Water-proof structure for electric wire and water-proof method for electric wire
JP2010178428A (ja) 電気接続箱
JP4740747B2 (ja) 電気接続箱
JP2013246397A (ja) 光ユニットおよび光ユニットの製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220816

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220930

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230621

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230704

R150 Certificate of patent or registration of utility model

Ref document number: 7319594

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150