JP5969405B2 - 車載用電子モジュール - Google Patents
車載用電子モジュール Download PDFInfo
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- JP5969405B2 JP5969405B2 JP2013014919A JP2013014919A JP5969405B2 JP 5969405 B2 JP5969405 B2 JP 5969405B2 JP 2013014919 A JP2013014919 A JP 2013014919A JP 2013014919 A JP2013014919 A JP 2013014919A JP 5969405 B2 JP5969405 B2 JP 5969405B2
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
- H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/26—Connectors or connections adapted for particular applications for vehicles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Casings For Electric Apparatus (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Connection Or Junction Boxes (AREA)
Description
Claims (6)
- 電子部品が実装された実装領域と基板端子が形成された端子形成領域とを有する回路基板と、前記回路基板の前記実装領域を収容するケースと、を備え、
前記ケースは、前記実装領域を収容するケース内空間を形成する壁面と、メス型コネクタが装着されるオス型コネクタハウジングと、前記壁面及び前記オス型コネクタハウジングと共に一体成型され前記ケース内空間と前記オス型コネクタハウジングのハウジング空間とを仕切る隔壁とが一体成型されたケース部材を備え、
前記回路基板は、前記ケース部材を貫通して、前記端子形成領域を前記オス型コネクタハウジングのハウジング空間側に露出させた構造を有すると共に、前記実装領域と前記端子形成領域との間に、前記回路基板を前記ケース部材に固定する絶縁樹脂部材を一体的に備え、
前記絶縁樹脂部材を前記隔壁に固定した車載用電子モジュール。 - 請求項1に記載の車載用電子モジュールにおいて、
前記ケース部材は、前記隔壁と相対する面が開放された樹脂部材で構成され、
前記ケースは、前記ケース部材と、前記隔壁と相対する前記ケース部材の開放面に組み付けられた樹脂製の蓋部材とを備えて構成された車載用電子モジュール。 - 請求項1に記載の車載用電子モジュールにおいて、
前記絶縁樹脂部材は前記回路基板の両面に設けられ、前記回路基板の両面に設けられた前記絶縁樹脂部材が前記回路基板に形成された貫通孔を通じて連結した構造を有する車載用電子モジュール。 - 請求項1に記載の車載用電子モジュールにおいて、
前記ケース部材は、前記回路基板が前記ケース部材を貫通する方向に対して垂直な方向に位置する両側壁に、前記回路基板を保持するガイドを備え、
前記ガイドで前記回路基板の側方両端部を保持した車載用電子モジュール。 - 請求項1に記載の車載用電子モジュールにおいて、
前記端子形成領域に、内層配線と表層配線を接続するためのスルーホールが形成され、スルーホールの側壁にCuめっきが形成された構造を有する車載用電子モジュール。 - 請求項1に記載の車載用電子モジュールにおいて、
前記端子形成領域の基板端子間に前記回路基板の端面からスリットが形成され、前記スリット内を埋め前記回路基板の表裏にスリット幅より広い頭部を有するリベット形状の絶縁樹脂が設けられている車載用電子モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013014919A JP5969405B2 (ja) | 2013-01-30 | 2013-01-30 | 車載用電子モジュール |
PCT/JP2014/050729 WO2014119379A1 (ja) | 2013-01-30 | 2014-01-17 | 車載用電子モジュール |
US14/764,001 US9736952B2 (en) | 2013-01-30 | 2014-01-17 | Vehicle-mounted electronic module |
EP14746243.6A EP2953210B1 (en) | 2013-01-30 | 2014-01-17 | Vehicle-mounted electronic module |
CN201480006001.5A CN104956547B (zh) | 2013-01-30 | 2014-01-17 | 车载用电子组件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013014919A JP5969405B2 (ja) | 2013-01-30 | 2013-01-30 | 車載用電子モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014146522A JP2014146522A (ja) | 2014-08-14 |
JP5969405B2 true JP5969405B2 (ja) | 2016-08-17 |
Family
ID=51262093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013014919A Active JP5969405B2 (ja) | 2013-01-30 | 2013-01-30 | 車載用電子モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US9736952B2 (ja) |
EP (1) | EP2953210B1 (ja) |
JP (1) | JP5969405B2 (ja) |
CN (1) | CN104956547B (ja) |
WO (1) | WO2014119379A1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014217552A1 (de) * | 2014-09-03 | 2016-03-03 | Conti Temic Microelectronic Gmbh | Steuergerätevorrichtung für ein Kraftfahrzeug sowie Verfahren zum Herstellen einer solchen |
CN104394666B (zh) * | 2014-11-17 | 2017-02-22 | 安徽飞凯电子技术有限公司 | 一种机柜生产工艺 |
DE102015112446A1 (de) * | 2015-07-30 | 2017-02-02 | Valeo Klimasysteme Gmbh | Vorrichtung zur Steuerung und/oder Regelung eines Lüftermotors |
CN107393739B (zh) * | 2016-05-16 | 2019-07-16 | 浙江春生电子有限公司 | 防水开关及安装其上的本体成型方法 |
KR101927120B1 (ko) * | 2016-08-19 | 2018-12-10 | 현대오트론 주식회사 | 내부 격벽을 구비한 전자 제어 장치 |
DE102016224795A1 (de) * | 2016-12-13 | 2018-06-14 | Robert Bosch Gmbh | Getriebesteuerungseinrichtung, insbesondere für ein Kraftfahrzeug, und Verfahren zum Herstellen eines Steckergehäuses |
JP6838787B2 (ja) * | 2016-12-22 | 2021-03-03 | 日立Astemo株式会社 | 電子制御装置 |
JP6798436B2 (ja) * | 2017-07-12 | 2020-12-09 | 株式会社オートネットワーク技術研究所 | 回路装置、回路装置の製造方法、およびコネクタ |
WO2019017237A1 (ja) * | 2017-07-19 | 2019-01-24 | パナソニックIpマネジメント株式会社 | チップ抵抗器 |
JP2019122193A (ja) * | 2018-01-10 | 2019-07-22 | 住友電装株式会社 | 電気接続箱 |
JP2019165043A (ja) * | 2018-03-19 | 2019-09-26 | 日立オートモティブシステムズ株式会社 | 電子回路装置および回路基板の製造方法 |
US11063382B2 (en) * | 2018-05-22 | 2021-07-13 | Flowserve Management Company | Waterproof and explosion-proof circuit board and electronic valve actuator for flow control applications |
CN110572975B (zh) * | 2018-06-05 | 2020-12-15 | 台达电子工业股份有限公司 | 具有定位内部电路基板功能的电源供应器及其制作方法 |
US11183792B2 (en) * | 2018-06-06 | 2021-11-23 | SK Hynix Inc. | Drive loading jig for memory drives |
JP7119991B2 (ja) * | 2018-12-27 | 2022-08-17 | 株式会社デンソー | 硬化性組成物及び電子機器 |
JP7049277B2 (ja) * | 2019-01-11 | 2022-04-06 | 日立Astemo株式会社 | 物理量検出装置 |
JP2020202036A (ja) * | 2019-06-06 | 2020-12-17 | 株式会社オートネットワーク技術研究所 | シールドコネクタ |
US10828852B1 (en) * | 2019-08-20 | 2020-11-10 | Honeywell International Inc. | Embedding electronics in housing using additive manufacturing |
US10893604B1 (en) * | 2020-03-03 | 2021-01-12 | Goodrich Corporation | Potted printed circuit board module and methods thereof |
DE102022101839A1 (de) * | 2022-01-27 | 2023-07-27 | Schaeffler Technologies AG & Co. KG | Elektrische und verschmutzungsdichte Verbindung zwischen zwei Bauräumen |
DE102022112190A1 (de) * | 2022-05-16 | 2023-11-16 | Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Coburg | Stecker mit einer Leiterplatte |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60118874U (ja) | 1984-01-19 | 1985-08-10 | 大同特殊鋼株式会社 | プリント基板コネクタの密閉構造 |
JPH077184A (ja) * | 1993-06-14 | 1995-01-10 | Omron Corp | 半導体発光素子、並びに当該発光素子を用いた投光器、光学検知装置及び光学的情報処理装置 |
JP2583978Y2 (ja) * | 1993-06-29 | 1998-10-27 | ナイルス部品株式会社 | 回路基板の収納ハウジングの構造 |
JP2822855B2 (ja) * | 1993-08-06 | 1998-11-11 | 住友電装株式会社 | 基板保持構造 |
US5632638A (en) * | 1993-08-06 | 1997-05-27 | Sumitomo Wiring Systems, Ltd. | Card edge connector |
EP0650315A3 (de) * | 1993-10-23 | 1995-06-21 | Leonische Drahtwerke Ag | Elektrisches Steuergerät, insbesondere zum Einbau in Kraftfahrzeuge. |
JPH09237665A (ja) * | 1996-02-28 | 1997-09-09 | Kansei Corp | 回路基板用コネクタ |
DE19841467A1 (de) * | 1998-09-10 | 2000-04-13 | Siemens Ag | Platinen-Steckkontakt-Anordnung |
JP2002203614A (ja) | 2000-12-28 | 2002-07-19 | Fujikura Ltd | エンジンコントロールユニットのコネクタ接続構造 |
JP2005038975A (ja) * | 2003-07-18 | 2005-02-10 | Hitachi Ltd | 電子制御装置 |
CN100550180C (zh) * | 2005-09-16 | 2009-10-14 | 株式会社东芝 | 半导体存储装置及使用它的usb存储器装置 |
WO2009107480A1 (ja) * | 2008-02-29 | 2009-09-03 | 住友電気工業株式会社 | 細径同軸ケーブルハーネスおよびその接続構造 |
JP4832469B2 (ja) | 2008-06-04 | 2011-12-07 | 日立オートモティブシステムズ株式会社 | 箱形電子モジュール |
ES2369840T3 (es) * | 2009-03-30 | 2011-12-07 | Eberspächer Catem Gmbh & Co. Kg | Dispositivo calefactor eléctrico para un automóvil. |
JP5672158B2 (ja) * | 2011-06-03 | 2015-02-18 | 株式会社オートネットワーク技術研究所 | コネクタの製造方法 |
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WO2014119379A1 (ja) | 2014-08-07 |
EP2953210A4 (en) | 2016-10-19 |
EP2953210B1 (en) | 2021-06-23 |
US9736952B2 (en) | 2017-08-15 |
CN104956547B (zh) | 2017-10-03 |
CN104956547A (zh) | 2015-09-30 |
US20150366086A1 (en) | 2015-12-17 |
EP2953210A1 (en) | 2015-12-09 |
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