CN115152098A - 连接器装置 - Google Patents
连接器装置 Download PDFInfo
- Publication number
- CN115152098A CN115152098A CN202180016995.9A CN202180016995A CN115152098A CN 115152098 A CN115152098 A CN 115152098A CN 202180016995 A CN202180016995 A CN 202180016995A CN 115152098 A CN115152098 A CN 115152098A
- Authority
- CN
- China
- Prior art keywords
- housing
- molded resin
- protrusion
- resin portion
- connector device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
- H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Laser Beam Processing (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-039412 | 2020-03-06 | ||
| JP2020039412A JP7319594B2 (ja) | 2020-03-06 | 2020-03-06 | コネクタ装置 |
| PCT/JP2021/008562 WO2021177426A1 (ja) | 2020-03-06 | 2021-03-04 | コネクタ装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115152098A true CN115152098A (zh) | 2022-10-04 |
Family
ID=77614064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180016995.9A Pending CN115152098A (zh) | 2020-03-06 | 2021-03-04 | 连接器装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230092720A1 (enExample) |
| JP (1) | JP7319594B2 (enExample) |
| CN (1) | CN115152098A (enExample) |
| WO (1) | WO2021177426A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023111736A (ja) * | 2022-01-31 | 2023-08-10 | イリソ電子工業株式会社 | 電子機器 |
| DE102024201563B3 (de) * | 2024-02-21 | 2025-07-03 | Schaeffler Technologies AG & Co. KG | Partiell umspritze Leiterplatte, Verwendung der Leiterplatte und Herstellung der Leiterplatte |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19755497C1 (de) * | 1997-12-13 | 1999-07-08 | Hella Kg Hueck & Co | Steuergerätegehäuse aus Kunststoff für ein Kraftfahrzeug |
| CN105164504A (zh) * | 2013-04-26 | 2015-12-16 | 日立汽车系统株式会社 | 流量传感器及树脂制构造体的制造方法 |
| WO2019039244A1 (ja) * | 2017-08-25 | 2019-02-28 | 日立オートモティブシステムズ株式会社 | 樹脂封止型車載電子制御装置 |
| CN110800093A (zh) * | 2017-07-12 | 2020-02-14 | 株式会社自动网络技术研究所 | 电路装置、电路装置的制造方法以及连接器 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0359673U (enExample) * | 1989-10-17 | 1991-06-12 | ||
| JPH1076528A (ja) * | 1996-09-03 | 1998-03-24 | Fujitsu Ten Ltd | 金型構造及びコネクタの構造 |
| JP4281178B2 (ja) * | 1999-10-06 | 2009-06-17 | 株式会社デンソー | 半導体圧力センサ |
| JP4196546B2 (ja) * | 2001-04-23 | 2008-12-17 | 株式会社デンソー | 空気流量測定装置 |
| CN2585308Y (zh) * | 2002-10-25 | 2003-11-05 | 互亿科技股份有限公司 | 兼具防水和导光性能的资讯装置 |
| JP2010040992A (ja) * | 2008-08-08 | 2010-02-18 | Hitachi Ltd | 電子制御装置の製造方法とそのトランスファーモールド装置および電子制御装置 |
| JP5056717B2 (ja) * | 2008-10-16 | 2012-10-24 | 株式会社デンソー | モールドパッケージの製造方法 |
| JP5907113B2 (ja) * | 2012-10-24 | 2016-04-20 | 株式会社オートネットワーク技術研究所 | 防水電子回路ユニットの製造方法及び電子回路ユニット |
| JP2014177051A (ja) * | 2013-03-15 | 2014-09-25 | Denso Corp | 溶着体のレーザー溶着方法 |
| JP2014194899A (ja) * | 2013-03-29 | 2014-10-09 | Yazaki Corp | 防水コネクタ |
| JP6442527B2 (ja) * | 2014-11-25 | 2018-12-19 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
| JP2020202010A (ja) * | 2019-06-05 | 2020-12-17 | 株式会社オートネットワーク技術研究所 | コネクタ装置 |
| JP7319595B2 (ja) * | 2020-03-06 | 2023-08-02 | 株式会社オートネットワーク技術研究所 | コネクタ装置、及びコネクタ装置の製造方法 |
-
2020
- 2020-03-06 JP JP2020039412A patent/JP7319594B2/ja active Active
-
2021
- 2021-03-04 WO PCT/JP2021/008562 patent/WO2021177426A1/ja not_active Ceased
- 2021-03-04 US US17/802,706 patent/US20230092720A1/en active Pending
- 2021-03-04 CN CN202180016995.9A patent/CN115152098A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19755497C1 (de) * | 1997-12-13 | 1999-07-08 | Hella Kg Hueck & Co | Steuergerätegehäuse aus Kunststoff für ein Kraftfahrzeug |
| CN105164504A (zh) * | 2013-04-26 | 2015-12-16 | 日立汽车系统株式会社 | 流量传感器及树脂制构造体的制造方法 |
| CN110800093A (zh) * | 2017-07-12 | 2020-02-14 | 株式会社自动网络技术研究所 | 电路装置、电路装置的制造方法以及连接器 |
| WO2019039244A1 (ja) * | 2017-08-25 | 2019-02-28 | 日立オートモティブシステムズ株式会社 | 樹脂封止型車載電子制御装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021141001A (ja) | 2021-09-16 |
| WO2021177426A1 (ja) | 2021-09-10 |
| US20230092720A1 (en) | 2023-03-23 |
| JP7319594B2 (ja) | 2023-08-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |