JP7318530B2 - アルカリ可溶性樹脂、感光性樹脂組成物、感光性シート、硬化膜、層間絶縁膜または半導体保護膜、硬化膜のレリーフパターンの製造方法、電子部品または半導体装置 - Google Patents

アルカリ可溶性樹脂、感光性樹脂組成物、感光性シート、硬化膜、層間絶縁膜または半導体保護膜、硬化膜のレリーフパターンの製造方法、電子部品または半導体装置 Download PDF

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JP7318530B2
JP7318530B2 JP2019515562A JP2019515562A JP7318530B2 JP 7318530 B2 JP7318530 B2 JP 7318530B2 JP 2019515562 A JP2019515562 A JP 2019515562A JP 2019515562 A JP2019515562 A JP 2019515562A JP 7318530 B2 JP7318530 B2 JP 7318530B2
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mol
film
resin
cured film
photosensitive
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JPWO2019181782A1 (ja
JPWO2019181782A5 (https=
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祐太朗 小山
有希 増田
真佐夫 富川
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Toray Industries Inc
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    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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    • H10P72/7424—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates
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