KR102742244B1 - 알칼리 가용성 수지, 감광성 수지 조성물, 감광성 시트, 경화막, 층간 절연막 또는 반도체 보호막, 경화막의 릴리프 패턴의 제조 방법, 전자 부품 또는 반도체 장치 - Google Patents

알칼리 가용성 수지, 감광성 수지 조성물, 감광성 시트, 경화막, 층간 절연막 또는 반도체 보호막, 경화막의 릴리프 패턴의 제조 방법, 전자 부품 또는 반도체 장치 Download PDF

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KR102742244B1
KR102742244B1 KR1020207025476A KR20207025476A KR102742244B1 KR 102742244 B1 KR102742244 B1 KR 102742244B1 KR 1020207025476 A KR1020207025476 A KR 1020207025476A KR 20207025476 A KR20207025476 A KR 20207025476A KR 102742244 B1 KR102742244 B1 KR 102742244B1
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mol
film
cured film
resin composition
resin
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KR20200135318A (ko
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유타로 고야마
유키 마스다
마사오 도미카와
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도레이 카부시키가이샤
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    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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    • H10P72/7424—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates
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    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/921—Structures or relative sizes of bond pads
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    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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  • Formation Of Insulating Films (AREA)
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