JP7314163B2 - 測定装置 - Google Patents

測定装置 Download PDF

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Publication number
JP7314163B2
JP7314163B2 JP2020550952A JP2020550952A JP7314163B2 JP 7314163 B2 JP7314163 B2 JP 7314163B2 JP 2020550952 A JP2020550952 A JP 2020550952A JP 2020550952 A JP2020550952 A JP 2020550952A JP 7314163 B2 JP7314163 B2 JP 7314163B2
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Japan
Prior art keywords
oxide
transistor
insulator
signal
conductor
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JP2020550952A
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English (en)
Japanese (ja)
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JPWO2020075001A1 (ja
JPWO2020075001A5 (https=
Inventor
英明 宍戸
隆之 池田
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4472—Mathematical theories or simulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/341—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with time characteristics
    • G01N29/343—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with time characteristics pulse waves, e.g. particular sequence of pulses, bursts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4427—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with stored values, e.g. threshold values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/044—Internal reflections (echoes), e.g. on walls or defects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Engineering & Computer Science (AREA)
  • Algebra (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Mathematical Physics (AREA)
  • Pure & Applied Mathematics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP2020550952A 2018-10-11 2019-10-01 測定装置 Active JP7314163B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018192526 2018-10-11
JP2018192526 2018-10-11
PCT/IB2019/058320 WO2020075001A1 (ja) 2018-10-11 2019-10-01 測定装置

Publications (3)

Publication Number Publication Date
JPWO2020075001A1 JPWO2020075001A1 (ja) 2021-10-14
JPWO2020075001A5 JPWO2020075001A5 (https=) 2022-09-13
JP7314163B2 true JP7314163B2 (ja) 2023-07-25

Family

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Family Applications (1)

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JP2020550952A Active JP7314163B2 (ja) 2018-10-11 2019-10-01 測定装置

Country Status (4)

Country Link
US (1) US12066409B2 (https=)
JP (1) JP7314163B2 (https=)
CN (1) CN112840208B (https=)
WO (1) WO2020075001A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018152399A (ja) 2017-03-10 2018-09-27 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53120874A (en) * 1977-03-28 1978-10-21 Tokyo Shibaura Electric Co Ultrasonic diagnosing device
JPH04301559A (ja) * 1991-03-29 1992-10-26 Fujitsu Ltd 超音波影像装置
US6128092A (en) * 1999-07-13 2000-10-03 National Research Council Of Canada Method and system for high resolution ultrasonic imaging of small defects or anomalies.
EP1905073A4 (en) 2005-06-24 2011-05-11 Semiconductor Energy Lab SEMICONDUCTOR DEVICE AND WIRELESS COMMUNICATION SYSTEM
DE102008042278A1 (de) 2008-06-13 2009-12-24 Ge Inspection Technologies Gmbh Verfahren zur zerstörungsfreien Ultraschalluntersuchung sowie Vorrichtung zur Durchführung des Verfahrens
WO2011122280A1 (en) 2010-03-31 2011-10-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device
US9638671B2 (en) * 2012-05-25 2017-05-02 Fbs, Inc. Systems and methods for damage detection in structures using guided wave phased arrays
JP6000197B2 (ja) * 2012-09-27 2016-09-28 富士フイルム株式会社 超音波診断装置、超音波画像生成方法およびプログラム
US10613206B2 (en) 2014-02-26 2020-04-07 Hitachi, Ltd. Ultrasound probe and ultrasound imaging apparatus using the same
KR102267237B1 (ko) 2014-03-07 2021-06-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 전자 기기
US9689844B2 (en) * 2015-07-27 2017-06-27 The Boeing Company Ultrasonic inspection using flexible two-dimensional array applied on surface of article
KR20170084020A (ko) 2015-10-23 2017-07-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 전자 기기
WO2018172881A1 (ja) 2017-03-24 2018-09-27 株式会社半導体エネルギー研究所 半導体装置、表示システム及び電子機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018152399A (ja) 2017-03-10 2018-09-27 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法

Also Published As

Publication number Publication date
CN112840208A (zh) 2021-05-25
US20220034851A1 (en) 2022-02-03
JPWO2020075001A1 (ja) 2021-10-14
KR20210074292A (ko) 2021-06-21
US12066409B2 (en) 2024-08-20
CN112840208B (zh) 2024-04-09
WO2020075001A1 (ja) 2020-04-16

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