JP7312486B2 - 液体噴射装置 - Google Patents
液体噴射装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/34—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/08—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape of pulsating nature, e.g. delivering liquid in successive separate quantities ; Fluidic oscillators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
- B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
- B05B9/0423—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material for supplying liquid or other fluent material to several spraying apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
- B05B12/006—Pressure or flow rate sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/027—Pump details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Nozzles (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
本明細書によって開示されるノズルは、液体が流れる流路を有し、処理対象物に向かって前記液体を噴射する部材であって、前記流路が、前記液体に振動流を発生させるための振動発生流路を備える。
本明細書によって開示される技術の具体例を、以下に図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
実施形態を、図1から図3を参照しつつ説明する。本実施形態の洗浄装置1(液体噴射装置に該当)は、液体(超純水)を高圧で噴射して処理対象物W(処理対象物に該当)を洗浄する装置である。処理対象物Wの例としては、フラットパネルディスプレイや半導体ウエハが挙げられる。
β=D3/D2・・・・・(1)
図4に示すように、段差面81と第2内周面44との角度α2は、は必ずしも90°でなくても構わない。段差面81と第2内周面44との角度は、90°以上150°以下であることが好ましい。150°以上になると、液体が第2供給流路33Bから絞り流路43に流入する時に流れの剥離が生じにくくなり、洗浄力を向上させるために十分な振動流を発生させにくくなってしまうためである。
1.振動周波数の測定
図5に示す試験装置100を準備した。一端に供給口102を有する供給流路103と、この供給流路103に連なり、他端に噴出口105を有する絞り流路104とを備えるキャビテータ101を準備した。キャビテータ101に、長さ10mの高圧ホース107を介して高圧ポンプ108を接続した。キャビテータ101において、噴出口105を有する噴出面106には、加速度センサ111を取り付けた。高圧ホース107には、キャビテータ101に近接する位置に、圧力センサ112を取り付けた。
上記実施形態の構成の振動発生流路を有するノズル(以下、「実施形態のノズル」という)と、振動発生流路を有しない従来のノズル(以下、「従来のノズル」という)とを用いて、洗浄試験を行った。シリコンウエハの表面に粒径3μm 程度のポリスチレン粒子を疑似汚れとして付着させた試料に対し、実施形態のノズルと従来のノズルを用いて、同様の条件で洗浄作業を行った。洗浄前後の試料の表面を専用のスキャナでスキャンして粒子数をカウントし、下記式(2)によって除去率を算出した。
除去率(%)=100×{(洗浄前の粒子数-洗浄後の粒子数)/洗浄前の粒子数}・・・・・(2)
実施形態のノズルと従来のノズルとを用いて、噴射圧力10MPaで水を噴射させ、シャドードップラー粒子分析計(SDPA) を用いて、ノズルの噴射口から100mm離れた位置における噴射液滴粒子の粒子径と速度とを測定した。
実施形態のノズルと従来のノズルとを用いて、ノズルの噴射口から100mm離れた位置に設置された面圧センサに向かって噴射圧力10MPaで水を噴射させ、噴射液の面圧分布を測定した。
(1)上記実施形態では、ノズル20が加速流路55を有していたが、例えば第3流路が、内径が一定の直管状の流路であっても構わない。
(2)上記実施形態では、配管接続部30とオリフィス部40と加速部50とが別体となっていたが、例えば、配管接続部とオリフィス部と加速部とが一体であってもよく、配管接続部とオリフィス部、またはオリフィス部と加速部が一体であっても構わない。
12…高圧ポンプ
20…ノズル
21…流路
22…振動発生流路
33B…第2供給流路(第1流路)
34…第1内周面
43…絞り流路(第2流路)
44…第2内周面
45…段差面
53…第3流入口(流入口)
55…加速流路
54…第3流出口(噴射口)
56…縮径部
56A…径大部(第3流路)
57…ストレート部
W…洗浄対象物(処理対象物)
Claims (5)
- 液体が流れる流路を有し、処理対象物に向かって前記液体を噴射するノズルと、前記液体を加圧して前記ノズルに供給する高圧ポンプと、を備える液体噴射装置であって、
前記流路が、前記液体に振動流を発生させるための振動発生流路を備え、
前記振動発生流路は、
第1流路と、
前記第1流路の下流側に連なり、前記第1流路よりも小さい内径を有する第2流路と、
前記第2流路の下流側に連なり、下流側に向けて内径が縮小する縮径部と、
を有し、
前記縮径部は、前記第2流路側に、前記第2流路よりも大きい内径の径大部を含み、
前記第2流路を区画する第2内周面と、前記第2内周面と前記第1流路を区画する第1内周面とを接続する段差面と、によって角部が形成されており、前記高圧ポンプから供給された前記液体の流れに対して、前記第1流路から前記第2流路に流入する時に前記角部から剥離を生じさせ、
前記第2流路が、前記角部から剥離した前記液体の流れが前記第2内周面に再付着する長さとされて前記角部と前記液体の流れが再付着する箇所との間において気泡を生じさせ、前記気泡の形成と放出とを断続的に繰り返し、
前記縮径部が、前記径大部において前記気泡を集めて雲状の気泡雲を生じさせ、前記気泡雲を周期的に下流側に流すことによって、前記液体に振動流を発生させる、液体噴射装置。 - 前記振動発生流路が、
前記第2流路の下流側に連なる加速流路を備え、
前記加速流路が、
前記液体を噴射する噴射口と、
前記噴射口側に位置し断面円形の直管状をなすストレート部と、
前記ストレート部に連なる前記縮径部とを備え、
前記ストレート部の軸方向の長さ寸法L1と直径寸法D1との比(L1/D1)が、7.8以上、15以下とされている、請求項1に記載の液体噴射装置。 - 前記第1流路において前記第2流路に隣接して配される部分の内径に対する前記第2流路の内径の比率が0.04以上0.8以下である、請求項1または請求項2に記載の液体噴射装置。
- 前記段差面と前記第2内周面との角度が90°以上150°以下である、請求項1から請求項3のいずれか1項に記載の液体噴射装置。
- 前記高圧ポンプの加圧による前記ノズルからの噴射圧力が1MPa以上30MPa以下である、請求項1から請求項4のいずれか1項に記載の液体噴射装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/029014 WO2021014610A1 (ja) | 2019-07-24 | 2019-07-24 | ノズル、および液体噴射装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2021014610A1 JPWO2021014610A1 (ja) | 2021-01-28 |
JP7312486B2 true JP7312486B2 (ja) | 2023-07-21 |
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JP2021534482A Active JP7312486B2 (ja) | 2019-07-24 | 2019-07-24 | 液体噴射装置 |
Country Status (6)
Country | Link |
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US (1) | US20220351985A1 (ja) |
JP (1) | JP7312486B2 (ja) |
KR (1) | KR102658632B1 (ja) |
CN (1) | CN114126764A (ja) |
TW (1) | TWI711488B (ja) |
WO (1) | WO2021014610A1 (ja) |
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JP2001044602A (ja) | 1999-07-30 | 2001-02-16 | Kyocera Corp | 描画装置 |
JP2005205397A (ja) | 2003-12-24 | 2005-08-04 | Matsushita Electric Ind Co Ltd | 流体供給ノズル、基板処理装置及び基板処理方法 |
JP2010129840A (ja) | 2008-11-28 | 2010-06-10 | Asahi Sunac Corp | 洗浄用ノズル |
JP2014064979A (ja) | 2012-09-25 | 2014-04-17 | Sugino Machine Ltd | キャビテーションノズル |
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JP3277214B2 (ja) * | 1992-02-05 | 2002-04-22 | 株式会社スギノマシン | 急拡大型液中ジェット噴射用ノズル |
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JPH11204480A (ja) | 1998-01-20 | 1999-07-30 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
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CN207745859U (zh) * | 2017-12-13 | 2018-08-21 | 广东药科大学 | 一种制备低聚壳聚糖的自振空化装置 |
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2019
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- 2019-07-24 US US17/619,020 patent/US20220351985A1/en active Pending
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JP2001044602A (ja) | 1999-07-30 | 2001-02-16 | Kyocera Corp | 描画装置 |
JP2005205397A (ja) | 2003-12-24 | 2005-08-04 | Matsushita Electric Ind Co Ltd | 流体供給ノズル、基板処理装置及び基板処理方法 |
JP2010129840A (ja) | 2008-11-28 | 2010-06-10 | Asahi Sunac Corp | 洗浄用ノズル |
JP2014064979A (ja) | 2012-09-25 | 2014-04-17 | Sugino Machine Ltd | キャビテーションノズル |
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TWI711488B (zh) | 2020-12-01 |
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CN114126764A (zh) | 2022-03-01 |
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