JPWO2021014610A1 - - Google Patents

Info

Publication number
JPWO2021014610A1
JPWO2021014610A1 JP2021534482A JP2021534482A JPWO2021014610A1 JP WO2021014610 A1 JPWO2021014610 A1 JP WO2021014610A1 JP 2021534482 A JP2021534482 A JP 2021534482A JP 2021534482 A JP2021534482 A JP 2021534482A JP WO2021014610 A1 JPWO2021014610 A1 JP WO2021014610A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021534482A
Other versions
JP7312486B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021014610A1 publication Critical patent/JPWO2021014610A1/ja
Application granted granted Critical
Publication of JP7312486B2 publication Critical patent/JP7312486B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/34—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/08—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape of pulsating nature, e.g. delivering liquid in successive separate quantities ; Fluidic oscillators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • B05B9/0423—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material for supplying liquid or other fluent material to several spraying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
    • B05B12/006—Pressure or flow rate sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/027—Pump details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021534482A 2019-07-24 2019-07-24 液体噴射装置 Active JP7312486B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/029014 WO2021014610A1 (ja) 2019-07-24 2019-07-24 ノズル、および液体噴射装置

Publications (2)

Publication Number Publication Date
JPWO2021014610A1 true JPWO2021014610A1 (ja) 2021-01-28
JP7312486B2 JP7312486B2 (ja) 2023-07-21

Family

ID=74192538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021534482A Active JP7312486B2 (ja) 2019-07-24 2019-07-24 液体噴射装置

Country Status (6)

Country Link
US (1) US20220351985A1 (ja)
JP (1) JP7312486B2 (ja)
KR (1) KR102658632B1 (ja)
CN (1) CN114126764A (ja)
TW (1) TWI711488B (ja)
WO (1) WO2021014610A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55153150U (ja) * 1979-04-17 1980-11-05
JPH05212317A (ja) * 1992-02-05 1993-08-24 Sugino Mach Ltd 急拡大型液中ジェット噴射用ノズル
JP2001044602A (ja) * 1999-07-30 2001-02-16 Kyocera Corp 描画装置
EP1306136A1 (en) * 2001-10-23 2003-05-02 Theodorus Alphonsius Niemeijer Method and arrangement for treating surfaces
JP2005205397A (ja) * 2003-12-24 2005-08-04 Matsushita Electric Ind Co Ltd 流体供給ノズル、基板処理装置及び基板処理方法
JP2010129840A (ja) * 2008-11-28 2010-06-10 Asahi Sunac Corp 洗浄用ノズル
JP2014064979A (ja) * 2012-09-25 2014-04-17 Sugino Machine Ltd キャビテーションノズル

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56141860A (en) * 1980-04-07 1981-11-05 Nippon Steel Corp Liquid injector
JP3320105B2 (ja) * 1992-07-30 2002-09-03 バブコック日立株式会社 キヤビテーシヨン噴流用ノズル
JPH11204480A (ja) 1998-01-20 1999-07-30 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US20060118495A1 (en) * 2004-12-08 2006-06-08 Ilia Kondratalv Nozzle for generating high-energy cavitation
ES2370158T3 (es) * 2005-04-19 2011-12-13 Special Coating Laboratory International Unidad de lavado para una máquina de limpieza de cristales oftálmicos u otros sustratos.
JP2012170849A (ja) * 2011-02-18 2012-09-10 Panasonic Corp 微細気泡生成ノズル
CN202238396U (zh) * 2011-09-09 2012-05-30 海南绿航水下清洗科技有限公司 水下清洗枪用喷头
CN102513237B (zh) * 2011-12-28 2014-03-12 天津海源流体工程技术有限公司 空化型超高压水锤式水枪喷头
CN102941172B (zh) * 2012-11-26 2015-06-10 宁波恒瑞机械有限公司 一种混液发泡装置
CN107960075B (zh) * 2015-05-01 2019-12-31 Ok工程有限公司 具备环流式气泡产生喷嘴的液体供给装置
CN105275702B (zh) * 2015-11-18 2017-12-26 武汉科技大学 一种空燃比自适应调节的喷油器雾化装置
CN105642456A (zh) * 2016-01-04 2016-06-08 湖南工业大学 一种高压低频自振脉冲气液射流喷嘴
JP6865952B2 (ja) * 2016-12-07 2021-04-28 旭サナック株式会社 １流体ノズル
CN207254577U (zh) * 2017-09-01 2018-04-20 西安东仪海博机电科技有限责任公司 一种清洗剥离用脉冲水射流喷头装置
CN207745859U (zh) * 2017-12-13 2018-08-21 广东药科大学 一种制备低聚壳聚糖的自振空化装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55153150U (ja) * 1979-04-17 1980-11-05
JPH05212317A (ja) * 1992-02-05 1993-08-24 Sugino Mach Ltd 急拡大型液中ジェット噴射用ノズル
JP2001044602A (ja) * 1999-07-30 2001-02-16 Kyocera Corp 描画装置
EP1306136A1 (en) * 2001-10-23 2003-05-02 Theodorus Alphonsius Niemeijer Method and arrangement for treating surfaces
JP2005205397A (ja) * 2003-12-24 2005-08-04 Matsushita Electric Ind Co Ltd 流体供給ノズル、基板処理装置及び基板処理方法
JP2010129840A (ja) * 2008-11-28 2010-06-10 Asahi Sunac Corp 洗浄用ノズル
JP2014064979A (ja) * 2012-09-25 2014-04-17 Sugino Machine Ltd キャビテーションノズル

Also Published As

Publication number Publication date
CN114126764A (zh) 2022-03-01
WO2021014610A1 (ja) 2021-01-28
TW202103800A (zh) 2021-02-01
JP7312486B2 (ja) 2023-07-21
US20220351985A1 (en) 2022-11-03
TWI711488B (zh) 2020-12-01
KR102658632B1 (ko) 2024-04-19
KR20220020389A (ko) 2022-02-18

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