JP7302784B2 - インターポーザ及びこれを含むパッケージ構造物 - Google Patents

インターポーザ及びこれを含むパッケージ構造物 Download PDF

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Publication number
JP7302784B2
JP7302784B2 JP2019100770A JP2019100770A JP7302784B2 JP 7302784 B2 JP7302784 B2 JP 7302784B2 JP 2019100770 A JP2019100770 A JP 2019100770A JP 2019100770 A JP2019100770 A JP 2019100770A JP 7302784 B2 JP7302784 B2 JP 7302784B2
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Japan
Prior art keywords
substrate
interposer
metal
metal pin
package structure
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JP2019100770A
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Japanese (ja)
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JP2020088375A (ja
Inventor
キム、ヒョン－ジュン
キム、ハン
キム、チョル－キュ
シム、ジュン－ホ
Original Assignee
サムソン エレクトロ－メカニックス カンパニーリミテッド．
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2019100770A 2018-11-14 2019-05-29 インターポーザ及びこれを含むパッケージ構造物 Active JP7302784B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180139746A KR102580836B1 (ko) 2018-11-14 2018-11-14 인터포저와 이를 포함하는 패키지 구조물
KR10-2018-0139746 2018-11-14

Publications (2)

Publication Number Publication Date
JP2020088375A JP2020088375A (ja) 2020-06-04
JP7302784B2 true JP7302784B2 (ja) 2023-07-04

Family

ID=70909181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019100770A Active JP7302784B2 (ja) 2018-11-14 2019-05-29 インターポーザ及びこれを含むパッケージ構造物

Country Status (3)

Country Link
JP (1) JP7302784B2 (zh)
KR (1) KR102580836B1 (zh)
TW (1) TW202019246A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112839437B (zh) * 2020-12-31 2022-04-15 广州金升阳科技有限公司 一种双面塑封电源产品
CN115151016A (zh) * 2021-03-30 2022-10-04 广州金升阳科技有限公司 一种塑封电源产品及其塑封方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017163A (ja) 2001-06-27 2003-01-17 Gunma Denki Kk サブ基板搭載用多ピンコネクタ及びプリント基板の部品実装方法
JP2004158700A (ja) 2002-11-07 2004-06-03 Denso Corp 電子制御装置およびその製造方法
JP2004311574A (ja) 2003-04-03 2004-11-04 Shinko Electric Ind Co Ltd インターポーザー及びその製造方法ならびに電子装置
JP2013251303A (ja) 2012-05-30 2013-12-12 Canon Inc 半導体パッケージ及び積層型半導体パッケージ
US20140168909A1 (en) 2012-12-19 2014-06-19 Tieyu Zheng Gapped attachment structures

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101324595B1 (ko) 2013-08-07 2013-11-01 (주)드림텍 조립성 및 유동성이 우수한 휴대 단말기용 메인 보드
JP2016062916A (ja) * 2014-09-12 2016-04-25 イビデン株式会社 電子部品搭載用基板及び電子部品搭載用基板の製造方法
KR102420148B1 (ko) * 2016-03-22 2022-07-13 에스케이하이닉스 주식회사 반도체 패키지

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017163A (ja) 2001-06-27 2003-01-17 Gunma Denki Kk サブ基板搭載用多ピンコネクタ及びプリント基板の部品実装方法
JP2004158700A (ja) 2002-11-07 2004-06-03 Denso Corp 電子制御装置およびその製造方法
JP2004311574A (ja) 2003-04-03 2004-11-04 Shinko Electric Ind Co Ltd インターポーザー及びその製造方法ならびに電子装置
JP2013251303A (ja) 2012-05-30 2013-12-12 Canon Inc 半導体パッケージ及び積層型半導体パッケージ
US20140168909A1 (en) 2012-12-19 2014-06-19 Tieyu Zheng Gapped attachment structures

Also Published As

Publication number Publication date
JP2020088375A (ja) 2020-06-04
KR102580836B1 (ko) 2023-09-20
TW202019246A (zh) 2020-05-16
KR20200055982A (ko) 2020-05-22

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