JP7300842B2 - 被洗浄物の洗浄方法 - Google Patents

被洗浄物の洗浄方法 Download PDF

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Publication number
JP7300842B2
JP7300842B2 JP2019020796A JP2019020796A JP7300842B2 JP 7300842 B2 JP7300842 B2 JP 7300842B2 JP 2019020796 A JP2019020796 A JP 2019020796A JP 2019020796 A JP2019020796 A JP 2019020796A JP 7300842 B2 JP7300842 B2 JP 7300842B2
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JP
Japan
Prior art keywords
cleaning
cutting
water
chuck table
cleaning liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019020796A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020129580A (ja
Inventor
博光 植山
圭 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2019020796A priority Critical patent/JP7300842B2/ja
Priority to TW109103394A priority patent/TWI811522B/zh
Priority to CN202010080346.2A priority patent/CN111530649A/zh
Priority to KR1020200014302A priority patent/KR20200097217A/ko
Publication of JP2020129580A publication Critical patent/JP2020129580A/ja
Application granted granted Critical
Publication of JP7300842B2 publication Critical patent/JP7300842B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B23Q11/005—Devices for removing chips by blowing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02076—Cleaning after the substrates have been singulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
JP2019020796A 2019-02-07 2019-02-07 被洗浄物の洗浄方法 Active JP7300842B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019020796A JP7300842B2 (ja) 2019-02-07 2019-02-07 被洗浄物の洗浄方法
TW109103394A TWI811522B (zh) 2019-02-07 2020-02-04 被洗淨物的洗淨方法
CN202010080346.2A CN111530649A (zh) 2019-02-07 2020-02-05 清洗喷嘴以及被清洗物的清洗方法
KR1020200014302A KR20200097217A (ko) 2019-02-07 2020-02-06 세정 노즐 및 피세정물의 세정 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019020796A JP7300842B2 (ja) 2019-02-07 2019-02-07 被洗浄物の洗浄方法

Publications (2)

Publication Number Publication Date
JP2020129580A JP2020129580A (ja) 2020-08-27
JP7300842B2 true JP7300842B2 (ja) 2023-06-30

Family

ID=71969197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019020796A Active JP7300842B2 (ja) 2019-02-07 2019-02-07 被洗浄物の洗浄方法

Country Status (4)

Country Link
JP (1) JP7300842B2 (zh)
KR (1) KR20200097217A (zh)
CN (1) CN111530649A (zh)
TW (1) TWI811522B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000157939A (ja) 1998-11-30 2000-06-13 Isuzu Motors Ltd 洗浄方法及び装置
JP2016159376A (ja) 2015-02-27 2016-09-05 株式会社ディスコ 切削装置
JP2018113373A (ja) 2017-01-12 2018-07-19 株式会社ディスコ 加工装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0984800A (ja) * 1995-09-25 1997-03-31 Toru Kikawada 手術用アクアウォッシャー装置
JP2006187834A (ja) * 2005-01-06 2006-07-20 Disco Abrasive Syst Ltd 切削装置
JP4535900B2 (ja) * 2005-02-14 2010-09-01 花王株式会社 湿式電気掃除機
JP6118653B2 (ja) 2013-06-19 2017-04-19 株式会社ディスコ 切削装置
JP6317941B2 (ja) * 2014-02-07 2018-04-25 株式会社ディスコ 切削装置
JP6498020B2 (ja) * 2015-04-14 2019-04-10 株式会社ディスコ チャックテーブルの洗浄方法
JP6909621B2 (ja) * 2017-04-24 2021-07-28 株式会社ディスコ ウォータージェット加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000157939A (ja) 1998-11-30 2000-06-13 Isuzu Motors Ltd 洗浄方法及び装置
JP2016159376A (ja) 2015-02-27 2016-09-05 株式会社ディスコ 切削装置
JP2018113373A (ja) 2017-01-12 2018-07-19 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
TWI811522B (zh) 2023-08-11
JP2020129580A (ja) 2020-08-27
KR20200097217A (ko) 2020-08-18
TW202030784A (zh) 2020-08-16
CN111530649A (zh) 2020-08-14

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