JP7291704B2 - 洗浄方法 - Google Patents

洗浄方法 Download PDF

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Publication number
JP7291704B2
JP7291704B2 JP2020532506A JP2020532506A JP7291704B2 JP 7291704 B2 JP7291704 B2 JP 7291704B2 JP 2020532506 A JP2020532506 A JP 2020532506A JP 2020532506 A JP2020532506 A JP 2020532506A JP 7291704 B2 JP7291704 B2 JP 7291704B2
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Japan
Prior art keywords
component
mass
less
cleaning
resin mask
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JP2020532506A
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English (en)
Japanese (ja)
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JPWO2020022491A1 (ja
Inventor
晃平 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
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Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of JPWO2020022491A1 publication Critical patent/JPWO2020022491A1/ja
Application granted granted Critical
Publication of JP7291704B2 publication Critical patent/JP7291704B2/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Detergent Compositions (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2020532506A 2018-07-27 2019-07-26 洗浄方法 Active JP7291704B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018141673 2018-07-27
JP2018141673 2018-07-27
PCT/JP2019/029464 WO2020022491A1 (ja) 2018-07-27 2019-07-26 洗浄方法

Publications (2)

Publication Number Publication Date
JPWO2020022491A1 JPWO2020022491A1 (ja) 2021-08-19
JP7291704B2 true JP7291704B2 (ja) 2023-06-15

Family

ID=69180534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020532506A Active JP7291704B2 (ja) 2018-07-27 2019-07-26 洗浄方法

Country Status (4)

Country Link
JP (1) JP7291704B2 (zh)
CN (1) CN112470079A (zh)
TW (1) TW202012062A (zh)
WO (1) WO2020022491A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113985712A (zh) * 2020-07-27 2022-01-28 山东浪潮华光光电子股份有限公司 一种led芯片的常温去胶方法
CN113502480B (zh) * 2021-09-13 2021-11-23 深圳市板明科技股份有限公司 一种含有加速剂的无机体系退膜液及其使用方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001215735A (ja) 2000-02-04 2001-08-10 Jsr Corp レジスト用剥離液組成物、剥離方法及び回路基板
JP2005284257A (ja) 2004-03-03 2005-10-13 Daicel Chem Ind Ltd リソグラフィー用洗浄剤及びリンス液
US20130099260A1 (en) 2011-10-25 2013-04-25 Dongwoo Fine-Chem Co., Ltd. Resist stripping composition and method of stripping resist using the same
WO2018047631A1 (ja) 2016-09-09 2018-03-15 花王株式会社 樹脂マスク剥離用洗浄剤組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339127A (en) * 1976-09-21 1978-04-10 Fuji Yakuhin Kogyo Kk Photo resist frilling agent
JPH0862610A (ja) * 1994-08-16 1996-03-08 Toshiba Corp 液晶表示装置用レジスト剥離液
KR101328097B1 (ko) * 2006-01-11 2013-11-13 주식회사 동진쎄미켐 티에프티 엘시디용 칼라 레지스트 박리액 조성물
JP2007254555A (ja) * 2006-03-22 2007-10-04 Sanyo Chem Ind Ltd 洗浄剤組成物
KR101333779B1 (ko) * 2007-08-20 2013-11-29 주식회사 동진쎄미켐 티에프티 엘시디용 칼라 레지스트 박리액 조성물
JP2015018957A (ja) * 2013-07-11 2015-01-29 株式会社日立ハイテクノロジーズ 半導体処理液、及びそれを用いた処理方法
KR20160016179A (ko) * 2014-08-04 2016-02-15 동우 화인켐 주식회사 칼라 레지스트 및 유기막 박리액 조성물
KR102347618B1 (ko) * 2015-04-02 2022-01-05 동우 화인켐 주식회사 레지스트 박리액 조성물

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001215735A (ja) 2000-02-04 2001-08-10 Jsr Corp レジスト用剥離液組成物、剥離方法及び回路基板
JP2005284257A (ja) 2004-03-03 2005-10-13 Daicel Chem Ind Ltd リソグラフィー用洗浄剤及びリンス液
US20130099260A1 (en) 2011-10-25 2013-04-25 Dongwoo Fine-Chem Co., Ltd. Resist stripping composition and method of stripping resist using the same
WO2018047631A1 (ja) 2016-09-09 2018-03-15 花王株式会社 樹脂マスク剥離用洗浄剤組成物

Also Published As

Publication number Publication date
TW202012062A (zh) 2020-04-01
JPWO2020022491A1 (ja) 2021-08-19
CN112470079A (zh) 2021-03-09
WO2020022491A1 (ja) 2020-01-30

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