JP7289681B2 - 表示装置 - Google Patents
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- JP7289681B2 JP7289681B2 JP2019052169A JP2019052169A JP7289681B2 JP 7289681 B2 JP7289681 B2 JP 7289681B2 JP 2019052169 A JP2019052169 A JP 2019052169A JP 2019052169 A JP2019052169 A JP 2019052169A JP 7289681 B2 JP7289681 B2 JP 7289681B2
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- 239000000758 substrate Substances 0.000 claims description 46
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- 230000000052 comparative effect Effects 0.000 description 12
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- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 3
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- 238000012986 modification Methods 0.000 description 3
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
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- 101100171186 Phyllomedusa sauvagei DRT-S gene Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
- G09G3/3233—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Control Of El Displays (AREA)
Description
なお、式(1)において、Coxは単位面積当たりのゲート静電容量、μはキャリア移動度、Wは駆動トランジスタDRTのチャネル幅、Lは駆動トランジスタDRTのチャネル長である。また、Vsigは、上記した画像信号Vsigを表しており、副画素SPに書き込まれる書き込み電圧値である。Viniは、上記した初期化電位を表しており、オフセットキャンセル(Vth補正)時の駆動トランジスタDRTのゲート電圧値である。また、Csは上記した保持容量Csの値であり、Cadは上記した補助容量(追加容量)Cadの値であり、Cledは上記した素子容量Cledの値である。
で表される。
この場合、図18に示すように、式(3)によって表される駆動トランジスタDRTのソース電極の電位が上昇し、発光素子LEDに電流が流れ始めた後、Idrt=Iledとなったところで、当該駆動トランジスタDRTのソース電極の電位上昇が止まり、定常状態となる。詳細については省略するが、この電流Iled(Idrt)は上記した式(1)によって表されるため、発光素子LEDにはVthに依存しない電流が流れることになる。
Claims (9)
- 基板と、
前記基板上に形成された複数の画素と、を有し、
前記複数の画素はそれぞれ、
前記基板上に配置された画素電極と、
前記画素電極上に実装された発光素子と、
前記画素電極を介して前記発光素子に対して供給される電流を制御する駆動トランジスタと、
前記画素電極と前記駆動トランジスタとの間に、平面視において当該画素電極と少なくとも一部が重畳するように形成された導電層と
を具備し、
前記導電層は、前記複数の画素に亘って形成されており、平面視において前記発光素子が実装されている前記画素電極の領域と重畳する位置に形成された開口部を有し、前記平面視において前記発光素子が実装されている前記画素電極の領域と重畳しない
表示装置。 - 前記導電層の端部は、前記発光素子が実装されている前記画素電極の領域の端部と平面視において交差しない請求項1記載の表示装置。
- 前記複数の画素の各々に含まれる前記画素電極のうちの少なくとも1つは、平面視において非矩形状に形成されており、
前記複数の画素の各々に含まれる前記画素電極と前記駆動トランジスタとを電気的に接続するコンタクト部は、平面視において第1方向に延在する直線状に配置されており、
前記複数の画素の各々に含まれる前記画素電極の前記発光素子が実装されている領域のうちの少なくとも1つは、平面視において他の画素電極の前記発光素子が実装されている領域が配置されている第2方向に延在する直線状に配置されない
請求項1記載の表示装置。 - 前記複数の画素の各々に含まれる前記画素電極は、平面視において矩形状に形成されており、
前記複数の画素の各々に含まれる前記画素電極と前記駆動トランジスタとを電気的に接続するコンタクト部は、平面視において第1方向に延在する直線状に配置されており、
前記複数の画素の各々に含まれる前記画素電極の前記発光素子が実装されている領域は、平面視において第2方向に延在する直線状に配置されている
請求項1記載の表示装置。 - 前記発光素子を介して前記画素電極と対向する位置に配置された対向電極を具備する請求項1~4のいずれか一項に記載の表示装置。
- 基板と、
前記基板上に形成された複数の画素と、を有し、
前記複数の画素はそれぞれ、
前記基板上に配置された画素電極と、
前記画素電極と同じ層に配置された共通電極と、
前記画素電極及び前記共通電極上に実装された発光素子と、
前記画素電極を介して前記発光素子に対して供給される電流を制御する駆動トランジスタと、
前記画素電極及び前記共通電極が配置されている層と前記駆動トランジスタとの間に、平面視において当該画素電極及び当該共通電極と少なくとも一部が重畳するように形成された導電層と
を具備し、
前記導電層は、平面視において前記発光素子が実装されている前記画素電極及び前記共通電極の領域と重畳せず、
前記共通電極は、前記複数の画素に亘って形成されており、
前記複数の画素の各々に含まれる画素電極は、前記共通電極に形成された開口部に配置されている
表示装置。 - 前記導電層は、前記複数の画素に亘って形成されており、前記平面視において前記発光素子が実装されている前記画素電極及び前記共通電極の領域と重畳しない位置に形成された開口部を有する
請求項6記載の表示装置。 - 前記導電層の端部は、前記発光素子が実装されている前記画素電極及び前記共通電極の領域の端部と平面視において交差しない請求項6または7記載の表示装置。
- 前記複数の画素の各々に含まれる前記画素電極は、平面視において矩形状に形成されており、
前記複数の画素の各々に含まれる前記画素電極と前記駆動トランジスタとを電気的に接続するコンタクト部は、平面視において第1方向に延在する直線状に配置されており、
前記複数の画素の各々に含まれる前記画素電極及び前記共通電極の前記発光素子が実装されている領域は、平面視において第2方向に延在する直線状に配置されている
請求項6記載の表示装置。
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JP2019052169A JP7289681B2 (ja) | 2019-03-20 | 2019-03-20 | 表示装置 |
PCT/JP2020/003536 WO2020189047A1 (ja) | 2019-03-20 | 2020-01-30 | 表示装置 |
US17/476,953 US20220005994A1 (en) | 2019-03-20 | 2021-09-16 | Display device |
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JP7341742B2 (ja) * | 2019-06-17 | 2023-09-11 | キヤノン株式会社 | 発光素子 |
KR20210125220A (ko) * | 2020-04-08 | 2021-10-18 | 엘지디스플레이 주식회사 | 투명 마이크로 디스플레이 장치 |
KR20210148505A (ko) * | 2020-05-28 | 2021-12-08 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 |
CN114446187B (zh) | 2020-11-03 | 2023-06-27 | 成都辰显光电有限公司 | 驱动背板、显示面板及其制备方法 |
JP2022105856A (ja) * | 2021-01-05 | 2022-07-15 | 株式会社ジャパンディスプレイ | 表示装置の製造方法および表示装置 |
EP4391766A1 (en) * | 2021-09-09 | 2024-06-26 | Sony Semiconductor Solutions Corporation | Light-emitting element array, light-emitting device, electronic apparatus, and photonic crystal structure |
KR20230050545A (ko) * | 2021-10-07 | 2023-04-17 | 삼성디스플레이 주식회사 | 표시 장치 |
Citations (5)
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---|---|---|---|---|
JP2008102214A (ja) | 2006-10-17 | 2008-05-01 | Toshiba Matsushita Display Technology Co Ltd | アクティブマトリクス型表示装置 |
US20170336690A1 (en) | 2016-05-20 | 2017-11-23 | Innolux Corporation | Display apparatus |
US20170358503A1 (en) | 2016-06-14 | 2017-12-14 | Innolux Corporation | Display device and method of manufacturing the display device |
WO2019049360A1 (ja) | 2017-09-11 | 2019-03-14 | 凸版印刷株式会社 | 表示装置及び表示装置基板 |
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JP2008102214A (ja) | 2006-10-17 | 2008-05-01 | Toshiba Matsushita Display Technology Co Ltd | アクティブマトリクス型表示装置 |
US20170336690A1 (en) | 2016-05-20 | 2017-11-23 | Innolux Corporation | Display apparatus |
US20170358503A1 (en) | 2016-06-14 | 2017-12-14 | Innolux Corporation | Display device and method of manufacturing the display device |
WO2019049360A1 (ja) | 2017-09-11 | 2019-03-14 | 凸版印刷株式会社 | 表示装置及び表示装置基板 |
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