JP7274929B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
- Publication number
- JP7274929B2 JP7274929B2 JP2019090813A JP2019090813A JP7274929B2 JP 7274929 B2 JP7274929 B2 JP 7274929B2 JP 2019090813 A JP2019090813 A JP 2019090813A JP 2019090813 A JP2019090813 A JP 2019090813A JP 7274929 B2 JP7274929 B2 JP 7274929B2
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- light emitting
- cathode
- terminal
- emitting element
- display device
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- 239000000758 substrate Substances 0.000 claims description 19
- 239000007769 metal material Substances 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 86
- 239000010408 film Substances 0.000 description 50
- 239000010936 titanium Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 101100448208 Human herpesvirus 6B (strain Z29) U69 gene Proteins 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 238000000605 extraction Methods 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 101100383295 Human herpesvirus 6B (strain Z29) U71 gene Proteins 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 101100108967 Human herpesvirus 6B (strain Z29) U70 gene Proteins 0.000 description 3
- -1 acryl Chemical group 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 241000750042 Vini Species 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
Description
なお、開示はあくまで一例に過ぎず、当業者において、発明の主旨を保っての適宜変更について容易に想到し得るものについては、当然に本発明の範囲に含有される。また、図面は、説明をより明確にするため、実施の態様に比べて模式的に表される場合があるが、あくまで一例であって、本発明の解釈を限定するものではない。各図において、連続して配置される同一または類似の要素については符号を省略することがある。また、本明細書と各図において、既出の図に関して前述したものと同一または類似した機能を発揮する構成要素には同一の参照符号を付し、重複する詳細な説明を省略することがある。
なお、上記したTFTおよび画素電極37を纏めてアノード配線と称しても良い。
さらに、画素電極37及び共通電極38は透明導電材料により形成されるものに限らず、Al(アルミ)、Ti(チタン)、Mo(モリブデン)、W(タングステン)などの遮光性の金属材料およびこれら金属材料の積層構造により形成されるものであってもよい。
Claims (6)
- 基板と、
前記基板上に実装される発光素子と、
前記発光素子の底部に配置されるアノード端子と、
前記アノード端子とは反対側の前記発光素子の出射面に配置されるカソード端子と、
透明導電層と、
を具備し、
前記カソード端子は、金属材料により形成され、
前記カソード端子は、前記出射面の端部と重畳し、前記出射面の中央部分とは重畳せず、
前記透明導電層は、前記カソード端子、および、前記出射面の中央部分の上に配置される、
表示装置。 - 前記発光素子、前記アノード端子および前記カソード端子をそれぞれ含む複数の画素を具備し、
前記カソード端子に印加される電圧を供給するためのカソード配線が、前記画素毎に設けられる、
請求項1に記載の表示装置。 - 前記アノード端子に印加される電圧を供給するためのアノード配線を具備し、
前記カソード端子は、カソード中継電極を介して前記カソード配線と電気的に接続され、
前記アノード端子は、アノード中継電極を介して前記アノード配線と電気的に接続され、
前記アノード中継電極と前記カソード中継電極とは、同層に配置され、かつ、平面視において重畳しない、
請求項2に記載の表示装置。 - 前記カソード端子は、
前記出射面の端部と、前記表示装置の短辺と平行な第1方向に隣接する発光素子の出射面の端部とを接続し、かつ、前記カソード中継電極とコンタクトされるコンタクト部と平面視において重畳するように、前記第1方向に延在する、
請求項3に記載の表示装置。 - 前記カソード端子は、
前記出射面の端部と、前記表示装置の長辺と平行な第2方向に隣接する発光素子の出射面の端部とを接続し、かつ、前記カソード中継電極とコンタクトされるコンタクト部と平面視において重畳するように、前記第2方向に延在する、
請求項3に記載の表示装置。 - 前記画素は、矩形状であり、
前記矩形の4つの頂点のうちの3つの頂点に対応する位置に赤色、緑色および青色の発光素子が三角形状に配置され、前記3つの頂点とは異なる1つの頂点に対応する位置に前記カソード端子と前記カソード中継電極とを電気的に接続するためのコンタクト部が配置される、
請求項3に記載の表示装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019090813A JP7274929B2 (ja) | 2019-05-13 | 2019-05-13 | 表示装置 |
PCT/JP2020/016341 WO2020230497A1 (ja) | 2019-05-13 | 2020-04-13 | 表示装置 |
TW109115858A TWI750656B (zh) | 2019-05-13 | 2020-05-13 | 顯示裝置 |
US17/454,535 US20220068902A1 (en) | 2019-05-13 | 2021-11-11 | Display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019090813A JP7274929B2 (ja) | 2019-05-13 | 2019-05-13 | 表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020187234A JP2020187234A (ja) | 2020-11-19 |
JP7274929B2 true JP7274929B2 (ja) | 2023-05-17 |
Family
ID=73222491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019090813A Active JP7274929B2 (ja) | 2019-05-13 | 2019-05-13 | 表示装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220068902A1 (ja) |
JP (1) | JP7274929B2 (ja) |
TW (1) | TWI750656B (ja) |
WO (1) | WO2020230497A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113224225A (zh) * | 2021-05-08 | 2021-08-06 | 厦门技师学院(厦门市高级技工学校、厦门市高技能人才公共实训服务中心、厦门市劳动保护宣传教育中心) | 一种led显示面板 |
JP2023005830A (ja) * | 2021-06-29 | 2023-01-18 | 株式会社ジャパンディスプレイ | 表示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006019142A (ja) | 2004-07-01 | 2006-01-19 | Casio Comput Co Ltd | 発光素子及び画像表示装置 |
JP2007073499A (ja) | 2005-08-08 | 2007-03-22 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
JP2010245365A (ja) | 2009-04-08 | 2010-10-28 | Sony Corp | 半導体発光素子組立体の製造方法、半導体発光素子、電子機器、及び、画像表示装置 |
JP2013021175A (ja) | 2011-07-12 | 2013-01-31 | Toshiba Corp | 半導体発光素子 |
JP2019204823A (ja) | 2018-05-21 | 2019-11-28 | シャープ株式会社 | マイクロ発光素子、画像表示素子およびその形成方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5317396B2 (ja) * | 1973-04-18 | 1978-06-08 | ||
JPS63120287U (ja) * | 1986-12-29 | 1988-08-03 | ||
JP2001052858A (ja) * | 1999-08-05 | 2001-02-23 | Futaba Corp | 有機el表示装置 |
JP2002318556A (ja) * | 2001-04-20 | 2002-10-31 | Toshiba Corp | アクティブマトリクス型平面表示装置およびその製造方法 |
JP4310984B2 (ja) * | 2002-02-06 | 2009-08-12 | 株式会社日立製作所 | 有機発光表示装置 |
JP2004304161A (ja) * | 2003-03-14 | 2004-10-28 | Sony Corp | 発光素子、発光装置、画像表示装置、発光素子の製造方法及び画像表示装置の製造方法 |
JP4852660B2 (ja) * | 2008-12-18 | 2012-01-11 | パナソニック株式会社 | 有機エレクトロルミネッセンス表示装置及びその製造方法 |
US20130069067A1 (en) * | 2011-09-20 | 2013-03-21 | Keun Chun Youn | Organic light emitting diode (oled) display device and method for manufacturing the same |
EP3207570A4 (en) * | 2014-10-17 | 2018-03-14 | Intel Corporation | Microled display&assembly |
CN109065597B (zh) * | 2018-08-17 | 2020-12-04 | 京东方科技集团股份有限公司 | 有机发光显示基板 |
-
2019
- 2019-05-13 JP JP2019090813A patent/JP7274929B2/ja active Active
-
2020
- 2020-04-13 WO PCT/JP2020/016341 patent/WO2020230497A1/ja active Application Filing
- 2020-05-13 TW TW109115858A patent/TWI750656B/zh active
-
2021
- 2021-11-11 US US17/454,535 patent/US20220068902A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006019142A (ja) | 2004-07-01 | 2006-01-19 | Casio Comput Co Ltd | 発光素子及び画像表示装置 |
JP2007073499A (ja) | 2005-08-08 | 2007-03-22 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
JP2010245365A (ja) | 2009-04-08 | 2010-10-28 | Sony Corp | 半導体発光素子組立体の製造方法、半導体発光素子、電子機器、及び、画像表示装置 |
JP2013021175A (ja) | 2011-07-12 | 2013-01-31 | Toshiba Corp | 半導体発光素子 |
JP2019204823A (ja) | 2018-05-21 | 2019-11-28 | シャープ株式会社 | マイクロ発光素子、画像表示素子およびその形成方法 |
Also Published As
Publication number | Publication date |
---|---|
US20220068902A1 (en) | 2022-03-03 |
TW202101415A (zh) | 2021-01-01 |
WO2020230497A1 (ja) | 2020-11-19 |
TWI750656B (zh) | 2021-12-21 |
JP2020187234A (ja) | 2020-11-19 |
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