JP7288481B2 - ワーク容器システム - Google Patents
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Packaging Frangible Articles (AREA)
- Manipulator (AREA)
Description
本出願は、2021年2月05日に出願された米国特許出願第17168207号及び2020年9月30日に出願された台湾特許出願第109134304号の利益を主張し、これらは参照により本明細書に組み込まれ、本明細書の一部をなす。
Claims (18)
- 保管アセンブリを備えるワーク容器システムであって、
前記保管アセンブリは、
ワークを受け入れるように構成された、その幾何学的中心領域を包含するワーク受け入れ領域を画定するシート部材と、
前記ワークを受け入れるためのエンクロージャを協働的に形成するように、前記ワーク受け入れ領域の周辺領域で前記シート部材と係合するように構成されたシートカバーと、を含み、
前記ワークの平面投影内で前記シート部材上に、下部拡散誘導構成要素が前記幾何学的中心領域をオフセットするように設けられ、
前記ワークの平面投影上で前記シートカバー上に、円形パターンで配置された複数のポートを備える上部拡散誘導構成要素が前記シート部材の前記幾何学的中心領域に投影的に重なるように設けられ、
前記円形パターンは、前記シートカバーの幾何学的中心と整列した幾何学的中心を有し、
前記上部拡散誘導構成要素は、上部フィルタカバーと、前記シートカバー上で前記上部フィルタカバーによって保持されるように構成された上部フィルタ膜と、を含み、
前記上部フィルタカバーは、前記上部フィルタ膜への流体アクセスを可能にするように配置され、
前記上部フィルタカバーの中心領域の高さは、前記シートカバーの外面の高さ以下である、ワーク容器システム。 - 前記上部フィルタカバーは、上部カバー保持部材を受け入れるように構成されたリテーナシートをさらに含み、
前記リテーナシートは、前記シートカバーの前記外面よりも高い上面を有する、請求項1に記載のワーク容器システム。 - 前記リテーナシートは、前記シートカバーの2つの対称軸を含む領域を同時にオフセットするように配置される、請求項2に記載のワーク容器システム。
- 前記対称軸のうちの1つは、前記シートカバーの垂直二等分線を含む、請求項3に記載のワーク容器システム。
- 前記対称軸のうちの1つは、前記シートカバーの対角線を含む、請求項3に記載のワーク容器システム。
- 前記上部フィルタ膜のサイズは、前記ワークの平面面積の少なくとも25%である、請求項1に記載のワーク容器システム。
- 前記下部拡散誘導構成要素は、前記シート部材の前記幾何学的中心領域の周囲の前記ワーク受け入れ領域に配置された拡散ポートアセンブリを含み、
前記拡散ポートアセンブリは、下部フィルタカバーと、前記下部フィルタカバーによって保持されるように構成された下部フィルタ膜と、下部カバー保持部材とを含み、
前記上部フィルタ膜は、前記下部フィルタ膜と異なる材料組成を有する、請求項1に記載のワーク容器システム。 - 前記複数のポートが同心円状に配置され、前記複数のポートの同心中心が前記シートカバーの前記幾何学的中心と整列している、請求項1に記載のワーク容器システム。
- 保管アセンブリを備えるワーク容器システムであって、
前記保管アセンブリは、
ワークを受け入れるように構成された、その幾何学的中心領域を包含するワーク受け入れ領域を画定するシート部材と、
前記ワークを受け入れるためのエンクロージャを協働的に形成するように、前記ワーク受け入れ領域の周辺領域で前記シート部材と係合するように構成されたシートカバーと、を含み、
前記ワークの平面投影上で前記シートカバー上に、円形パターンで配置された複数のポートを備える上部拡散誘導構成要素が設けられ、
前記上部拡散誘導構成要素は、前記シートカバーの幾何学的中心と整列した幾何学的中心を有し、
前記上部拡散誘導構成要素は、上部フィルタカバーと、前記シートカバー上で前記上部フィルタカバーによって保持されるように構成された上部フィルタ膜と、を含み、
前記上部フィルタカバーは、前記上部フィルタ膜への流体アクセスを可能にするように配置され、
前記上部フィルタカバーの中心領域の高さは、前記シートカバーの外面の高さ以下である、ワーク容器システム。 - 前記上部フィルタカバーは、前記シートカバーとの保持係合を確立するように構成されたリテーナシートをさらに含み、
前記リテーナシートは、前記シートカバーの2つの対称軸を含む領域を同時にオフセットするように配置される、請求項9に記載のワーク容器システム。 - 前記対称軸のうちの1つは、前記シートカバーの垂直二等分線を含む、請求項10に記載のワーク容器システム。
- 前記対称軸のうちの1つは、前記シートカバーの対角線を含む、請求項10に記載のワーク容器システム。
- 前記リテーナシートは、前記シートカバーの前記外面よりも高い上面を有する、請求項10に記載のワーク容器システム。
- 前記上部フィルタ膜のサイズは、前記ワークの平面面積の少なくとも25%である、請求項10に記載のワーク容器システム。
- 前記ワークの平面投影内で前記シート部材上に、下部拡散誘導構成要素が前記幾何学的中心領域をオフセットするように設けられ、
前記下部拡散誘導構成要素は、前記シート部材の前記幾何学的中心領域の周囲の前記ワーク受け入れ領域に配置された拡散ポートアセンブリを含み、
前記拡散ポートアセンブリは、下部フィルタカバーと、前記下部フィルタカバーによって保持されるように構成された下部フィルタ膜と、下部カバー保持部材とを含み、
前記上部フィルタ膜は、前記下部フィルタ膜と異なる材料組成を有する、請求項9に記載のワーク容器システム。 - 前記シートカバーは、
その中心領域を貫通して配置された複数のポートを有する本体と、
前記複数のポートの上に配置された上部フィルタ膜と、
前記上部フィルタ膜を覆い、前記上部フィルタ膜への流体アクセスを可能にする複数の孔を有する上部フィルタカバーと、をさらに含む、請求項9に記載のワーク容器システム。 - 前記複数の孔のそれぞれは、前記上部拡散誘導構成要素における前記複数のポートのうちの1つと整列している、請求項16に記載のワーク容器システム。
- 前記上部拡散誘導構成要素は、前記上部フィルタカバーと前記シートカバーとの間に配置されたシールリングをさらに備え、
前記上部フィルタカバーは、前記シールリングを受け入れるための下向きの環状溝をさらに備える、請求項9に記載のワーク容器システム。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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TW109134304 | 2020-09-30 | ||
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US17/216,724 US11874596B2 (en) | 2020-09-30 | 2021-03-30 | Workpiece container system |
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JP2003257852A (ja) | 2002-02-22 | 2003-09-12 | Asml Netherlands Bv | レチクルを保護する2部分カバーを用いるシステムおよび方法 |
JP2006526432A (ja) | 2003-06-02 | 2006-11-24 | ホリスター・インコーポレイテッド | ストーマ装具用粘着性面板、ストーマ装具、および面板の清浄化方法 |
JP2008535283A (ja) | 2005-04-04 | 2008-08-28 | インテグリス・インコーポレーテッド | 制御環境を有するレチクルsmifポッド |
JP2010151551A (ja) | 2008-12-24 | 2010-07-08 | Hitachi High-Technologies Corp | 試料前処理装置 |
JP2019528578A (ja) | 2016-08-27 | 2019-10-10 | インテグリス・インコーポレーテッド | レチクルの側面抑制を有するレチクルポッド |
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