JP7288480B2 - ワーク容器システム - Google Patents
ワーク容器システム Download PDFInfo
- Publication number
- JP7288480B2 JP7288480B2 JP2021080201A JP2021080201A JP7288480B2 JP 7288480 B2 JP7288480 B2 JP 7288480B2 JP 2021080201 A JP2021080201 A JP 2021080201A JP 2021080201 A JP2021080201 A JP 2021080201A JP 7288480 B2 JP7288480 B2 JP 7288480B2
- Authority
- JP
- Japan
- Prior art keywords
- diffusion
- container system
- sheet member
- work container
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009792 diffusion process Methods 0.000 claims description 107
- 238000003860 storage Methods 0.000 claims description 77
- 230000003287 optical effect Effects 0.000 claims description 36
- 239000012528 membrane Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 23
- 230000000712 assembly Effects 0.000 claims description 22
- 238000000429 assembly Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 8
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 7
- 230000001939 inductive effect Effects 0.000 claims description 6
- 230000000717 retained effect Effects 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims 1
- 239000000356 contaminant Substances 0.000 description 16
- 238000007789 sealing Methods 0.000 description 12
- 238000003825 pressing Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 230000002209 hydrophobic effect Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000002829 reductive effect Effects 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 239000012808 vapor phase Substances 0.000 description 5
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000000670 limiting effect Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- -1 surface treatments Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/268—Drying gases or vapours by diffusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/02—Inorganic material
- B01D71/022—Metals
- B01D71/0223—Group 8, 9 or 10 metals
- B01D71/02232—Nickel
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Packaging Frangible Articles (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109134304 | 2020-09-30 | ||
TW109134304 | 2020-09-30 | ||
US17/168,207 | 2021-02-05 | ||
US17/168,207 US20220100106A1 (en) | 2020-09-30 | 2021-02-05 | Workpiece container system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022058128A JP2022058128A (ja) | 2022-04-11 |
JP7288480B2 true JP7288480B2 (ja) | 2023-06-07 |
Family
ID=80821157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021080201A Active JP7288480B2 (ja) | 2020-09-30 | 2021-05-11 | ワーク容器システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220100106A1 (zh) |
JP (1) | JP7288480B2 (zh) |
KR (1) | KR102509762B1 (zh) |
CN (1) | CN114313545A (zh) |
TW (1) | TWI778561B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003257852A (ja) | 2002-02-22 | 2003-09-12 | Asml Netherlands Bv | レチクルを保護する2部分カバーを用いるシステムおよび方法 |
JP2004071729A (ja) | 2002-08-05 | 2004-03-04 | Sendai Nikon:Kk | レチクル保持方法、レチクル保持装置及び露光装置 |
WO2007074757A1 (ja) | 2005-12-28 | 2007-07-05 | Nikon Corporation | レチクル搬送装置、露光装置、レチクル搬送方法、レチクルの処理方法、デバイス製造方法、及びレチクルカバーの管理方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7607543B2 (en) * | 2005-02-27 | 2009-10-27 | Entegris, Inc. | Reticle pod with isolation system |
WO2007038504A2 (en) * | 2005-09-27 | 2007-04-05 | Entegris, Inc. | Reticle pod |
US8776841B2 (en) * | 2006-06-19 | 2014-07-15 | Entegris, Inc. | System for purging reticle storage |
CN101726987A (zh) * | 2008-10-13 | 2010-06-09 | 家登精密工业股份有限公司 | 掩膜清洁装置 |
TWI411563B (zh) * | 2009-09-25 | 2013-10-11 | Gudeng Prec Industral Co Ltd | 光罩盒 |
GB2520989A (en) * | 2013-12-06 | 2015-06-10 | Mondelez Uk R & D Ltd | Packaging |
TWI542520B (zh) * | 2014-02-27 | 2016-07-21 | 耀連科技有限公司 | 隔離式搬運盒 |
US9828168B2 (en) * | 2014-07-03 | 2017-11-28 | Carefusion Germany 326 Gmbh | Storage container for automated dispensing of individual medicament portions |
EP3504591B1 (en) * | 2016-08-27 | 2022-05-11 | Entegris, Inc. | Reticle pod having side containment of reticle |
KR102127783B1 (ko) * | 2017-01-25 | 2020-06-30 | 구뎅 프리시젼 인더스트리얼 코포레이션 리미티드 | Euv 레티클 포드 |
JP6796741B2 (ja) * | 2017-07-21 | 2020-12-09 | インテグリス・インコーポレーテッド | レチクルを保持及び輸送するための、透明窓アセンブリを有する容器 |
CN108529012B (zh) * | 2018-04-09 | 2019-12-20 | 侯来勇 | 一种自体组织干细胞离体应用恒温保存装置 |
US20210300635A1 (en) * | 2020-03-24 | 2021-09-30 | Gudeng Precision Industrial Co., Ltd | Container system |
US20220404696A1 (en) * | 2021-06-18 | 2022-12-22 | Entegris, Inc. | Bonded layer on extreme ultraviolet plate |
-
2021
- 2021-02-05 US US17/168,207 patent/US20220100106A1/en active Pending
- 2021-03-30 TW TW110111699A patent/TWI778561B/zh active
- 2021-04-06 KR KR1020210044605A patent/KR102509762B1/ko active IP Right Grant
- 2021-04-14 CN CN202110402342.6A patent/CN114313545A/zh active Pending
- 2021-05-11 JP JP2021080201A patent/JP7288480B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003257852A (ja) | 2002-02-22 | 2003-09-12 | Asml Netherlands Bv | レチクルを保護する2部分カバーを用いるシステムおよび方法 |
JP2004071729A (ja) | 2002-08-05 | 2004-03-04 | Sendai Nikon:Kk | レチクル保持方法、レチクル保持装置及び露光装置 |
WO2007074757A1 (ja) | 2005-12-28 | 2007-07-05 | Nikon Corporation | レチクル搬送装置、露光装置、レチクル搬送方法、レチクルの処理方法、デバイス製造方法、及びレチクルカバーの管理方法 |
Also Published As
Publication number | Publication date |
---|---|
US20220100106A1 (en) | 2022-03-31 |
KR102509762B1 (ko) | 2023-03-14 |
KR20220044076A (ko) | 2022-04-06 |
JP2022058128A (ja) | 2022-04-11 |
TW202215146A (zh) | 2022-04-16 |
TWI778561B (zh) | 2022-09-21 |
CN114313545A (zh) | 2022-04-12 |
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