JP7287274B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

Info

Publication number
JP7287274B2
JP7287274B2 JP2019513669A JP2019513669A JP7287274B2 JP 7287274 B2 JP7287274 B2 JP 7287274B2 JP 2019513669 A JP2019513669 A JP 2019513669A JP 2019513669 A JP2019513669 A JP 2019513669A JP 7287274 B2 JP7287274 B2 JP 7287274B2
Authority
JP
Japan
Prior art keywords
resin composition
layer
less
mass
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019513669A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2018194099A1 (ja
Inventor
秀樹 大山
恵理 松村
栄一 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of JPWO2018194099A1 publication Critical patent/JPWO2018194099A1/ja
Application granted granted Critical
Publication of JP7287274B2 publication Critical patent/JP7287274B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Soft Magnetic Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2019513669A 2017-04-19 2018-04-18 樹脂組成物 Active JP7287274B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017083237 2017-04-19
JP2017083237 2017-04-19
PCT/JP2018/016029 WO2018194099A1 (ja) 2017-04-19 2018-04-18 樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2018194099A1 JPWO2018194099A1 (ja) 2020-03-05
JP7287274B2 true JP7287274B2 (ja) 2023-06-06

Family

ID=63856136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019513669A Active JP7287274B2 (ja) 2017-04-19 2018-04-18 樹脂組成物

Country Status (5)

Country Link
JP (1) JP7287274B2 (zh)
KR (1) KR102500417B1 (zh)
CN (1) CN110494493B (zh)
TW (1) TWI781166B (zh)
WO (1) WO2018194099A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7031206B2 (ja) * 2017-10-02 2022-03-08 味の素株式会社 樹脂組成物
JP7222228B2 (ja) * 2018-11-29 2023-02-15 味の素株式会社 基板の製造方法
TW202106503A (zh) * 2019-02-27 2021-02-16 日商味之素股份有限公司 磁性薄膜
JP7368693B2 (ja) * 2019-04-22 2023-10-25 イビデン株式会社 インダクタ内蔵基板
EP3730545A1 (en) * 2019-04-26 2020-10-28 SABIC Global Technologies B.V. Laser platable thermoplastic compositions
JP7078016B2 (ja) * 2019-06-17 2022-05-31 株式会社村田製作所 インダクタ部品
JP7354774B2 (ja) * 2019-11-01 2023-10-03 味の素株式会社 樹脂組成物
JP7463736B2 (ja) * 2020-01-24 2024-04-09 味の素株式会社 樹脂組成物
JP7387528B2 (ja) 2020-04-28 2023-11-28 株式会社豊田中央研究所 圧粉磁心及びその製造方法
CN111640567B (zh) * 2020-05-29 2022-02-11 深圳顺络电子股份有限公司 一种软磁合金材料的制备方法及软磁合金材料
WO2022065183A1 (ja) 2020-09-24 2022-03-31 富士フイルム株式会社 組成物、磁性粒子含有硬化物、磁性粒子導入基板、電子材料
CN114479417B (zh) * 2020-10-27 2023-09-12 广东生益科技股份有限公司 一种磁介电树脂组合物及包含其的预浸料和覆铜板
CN112652434B (zh) * 2020-12-28 2022-11-25 横店集团东磁股份有限公司 一种薄膜功率电感磁片及其制备方法与应用
CN112967856B (zh) * 2021-03-11 2022-11-08 横店集团东磁股份有限公司 一种软磁树脂浆料及其制备方法和应用
CN113234407A (zh) * 2021-04-02 2021-08-10 广东美信科技股份有限公司 导磁胶及其制备方法
CN113113223A (zh) * 2021-04-13 2021-07-13 横店集团东磁股份有限公司 一种软磁合金磁片及其制备方法和应用
WO2023181742A1 (ja) * 2022-03-22 2023-09-28 味の素株式会社 磁性基板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002363382A (ja) 2001-06-08 2002-12-18 Sony Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2007154041A (ja) 2005-12-05 2007-06-21 Nissan Motor Co Ltd 熱硬化性樹脂組成物およびこれを発泡、硬化させた熱硬化性樹脂発泡体
JP2015187260A (ja) 2014-03-11 2015-10-29 味の素株式会社 接着フィルム
JP2016172790A (ja) 2015-03-16 2016-09-29 パナソニックＩｐマネジメント株式会社 樹脂シート、樹脂シートの製造方法、インダクタ部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222425A (ja) * 1986-03-24 1987-09-30 Hitachi Ltd 磁気記録媒体
US20050007232A1 (en) * 2003-06-12 2005-01-13 Nec Tokin Corporation Magnetic core and coil component using the same
JP2016108561A (ja) * 2014-12-04 2016-06-20 日東電工株式会社 軟磁性樹脂組成物および軟磁性フィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002363382A (ja) 2001-06-08 2002-12-18 Sony Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2007154041A (ja) 2005-12-05 2007-06-21 Nissan Motor Co Ltd 熱硬化性樹脂組成物およびこれを発泡、硬化させた熱硬化性樹脂発泡体
JP2015187260A (ja) 2014-03-11 2015-10-29 味の素株式会社 接着フィルム
JP2016172790A (ja) 2015-03-16 2016-09-29 パナソニックＩｐマネジメント株式会社 樹脂シート、樹脂シートの製造方法、インダクタ部品

Also Published As

Publication number Publication date
CN110494493B (zh) 2022-03-11
TWI781166B (zh) 2022-10-21
KR102500417B1 (ko) 2023-02-20
TW201904759A (zh) 2019-02-01
WO2018194099A1 (ja) 2018-10-25
JPWO2018194099A1 (ja) 2020-03-05
CN110494493A (zh) 2019-11-22
KR20190133019A (ko) 2019-11-29

Similar Documents

Publication Publication Date Title
JP7287274B2 (ja) 樹脂組成物
JP6492801B2 (ja) 接着フィルム
WO2018194100A1 (ja) 樹脂組成物
JP2022113767A (ja) インダクタ基板の製造方法
JP7279319B2 (ja) 樹脂組成物
JP6866858B2 (ja) 樹脂組成物層
JP6350093B2 (ja) 部品内蔵基板の製造方法および半導体装置
JP6672953B2 (ja) 樹脂シート
JP7156433B2 (ja) 樹脂組成物
JP7272392B2 (ja) 樹脂組成物
JP2017059779A (ja) プリント配線板の製造方法
TWI780250B (zh) 樹脂組成物
TW202138591A (zh) 磁性組成物
JP6318690B2 (ja) 部品内蔵回路板の製造方法、および半導体装置
JP6176294B2 (ja) 支持体付き樹脂シート
JP6413444B2 (ja) 樹脂シート、積層シート、積層板及び半導体装置
JP7338413B2 (ja) 樹脂組成物
JP6776874B2 (ja) プリント配線板の製造方法
JP2017103332A (ja) 半導体チップパッケージの製造方法
JP2021120466A (ja) 樹脂シート、プリント配線板及び半導体装置
JP7247471B2 (ja) 樹脂組成物
JP6911311B2 (ja) 樹脂組成物
JP6610612B2 (ja) 支持体付き樹脂シート
KR102650250B1 (ko) 지지체, 접착 시트, 적층 구조체, 반도체 장치 및 프린트 배선판의 제조 방법
JP2022060293A (ja) プリント配線板の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210416

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220524

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220706

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220926

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230405

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230425

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230508

R150 Certificate of patent or registration of utility model

Ref document number: 7287274

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150