JP7283407B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP7283407B2
JP7283407B2 JP2020017158A JP2020017158A JP7283407B2 JP 7283407 B2 JP7283407 B2 JP 7283407B2 JP 2020017158 A JP2020017158 A JP 2020017158A JP 2020017158 A JP2020017158 A JP 2020017158A JP 7283407 B2 JP7283407 B2 JP 7283407B2
Authority
JP
Japan
Prior art keywords
electronic component
fill
solder
mounted member
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020017158A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021125523A5 (enExample
JP2021125523A (ja
Inventor
啓太郎 伊藤
照久 明石
英己 寺澤
卓 宝地
直記 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2020017158A priority Critical patent/JP7283407B2/ja
Priority to CN202180012063.7A priority patent/CN115024026B/zh
Priority to PCT/JP2021/003999 priority patent/WO2021157629A1/ja
Publication of JP2021125523A publication Critical patent/JP2021125523A/ja
Publication of JP2021125523A5 publication Critical patent/JP2021125523A5/ja
Priority to US17/878,319 priority patent/US12349279B2/en
Application granted granted Critical
Publication of JP7283407B2 publication Critical patent/JP7283407B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Gyroscopes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2020017158A 2020-02-04 2020-02-04 電子装置 Active JP7283407B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020017158A JP7283407B2 (ja) 2020-02-04 2020-02-04 電子装置
CN202180012063.7A CN115024026B (zh) 2020-02-04 2021-02-03 电子装置
PCT/JP2021/003999 WO2021157629A1 (ja) 2020-02-04 2021-02-03 電子装置
US17/878,319 US12349279B2 (en) 2020-02-04 2022-08-01 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020017158A JP7283407B2 (ja) 2020-02-04 2020-02-04 電子装置

Publications (3)

Publication Number Publication Date
JP2021125523A JP2021125523A (ja) 2021-08-30
JP2021125523A5 JP2021125523A5 (enExample) 2022-02-03
JP7283407B2 true JP7283407B2 (ja) 2023-05-30

Family

ID=77199617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020017158A Active JP7283407B2 (ja) 2020-02-04 2020-02-04 電子装置

Country Status (4)

Country Link
US (1) US12349279B2 (enExample)
JP (1) JP7283407B2 (enExample)
CN (1) CN115024026B (enExample)
WO (1) WO2021157629A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7310598B2 (ja) * 2019-12-25 2023-07-19 株式会社デンソー 電子装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308145A (ja) 2000-04-25 2001-11-02 Fujitsu Ltd 半導体チップの実装方法
JP2005502187A (ja) 2001-05-04 2005-01-20 ノキア コーポレイション 電子部品組立体の熱機械的信頼性を向上するためにパッケージレベルで予め塗布されるアンダーフィル
US20100077080A1 (en) 2008-09-23 2010-03-25 Tai-Yeon Ku Communication terminal, service kiosk, and service providing system and method
WO2010122757A1 (ja) 2009-04-24 2010-10-28 パナソニック株式会社 半導体パッケージ部品の実装方法と実装構造体
JP2010283085A (ja) 2009-06-03 2010-12-16 Toshiba Corp 電子機器
JP2016530723A (ja) 2013-09-03 2016-09-29 チザラ リヒトシステーメ ゲーエムベーハーＺｉｚａｌａ Ｌｉｃｈｔｓｙｓｔｅｍｅ ＧｍｂＨ 位置安定的はんだ付け方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0870063A (ja) * 1994-08-29 1996-03-12 Toshiba Lighting & Technol Corp 混成集積回路およびこれを含む回路装置
JP2007035692A (ja) * 2005-07-22 2007-02-08 Matsushita Electric Ind Co Ltd 電子部品実装構造および電子部品実装方法
JP2009021465A (ja) * 2007-07-13 2009-01-29 Panasonic Corp 半導体装置実装構造体およびその製造方法ならびに半導体装置の剥離方法
JP5115524B2 (ja) * 2009-07-08 2013-01-09 パナソニック株式会社 電子部品ユニット及び補強用接着剤
CN103518424B (zh) * 2011-05-26 2017-05-17 松下知识产权经营株式会社 电子部件安装方法、电子部件搭载装置以及电子部件安装系统
JP2014110369A (ja) * 2012-12-04 2014-06-12 Seiko Epson Corp ベース基板、振動子、発振器、センサー、電子デバイス、電子機器、および移動体
JP5608211B2 (ja) * 2012-12-10 2014-10-15 パナソニック株式会社 半導体装置
JP2015210161A (ja) * 2014-04-25 2015-11-24 日立オートモティブシステムズ株式会社 慣性力センサ装置
KR102530537B1 (ko) * 2016-04-11 2023-05-10 삼성전자주식회사 반도체 패키지
JP2018152500A (ja) 2017-03-14 2018-09-27 株式会社デンソー プリント基板および電子装置
JP2019176056A (ja) * 2018-03-29 2019-10-10 富士通株式会社 電子装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308145A (ja) 2000-04-25 2001-11-02 Fujitsu Ltd 半導体チップの実装方法
JP2005502187A (ja) 2001-05-04 2005-01-20 ノキア コーポレイション 電子部品組立体の熱機械的信頼性を向上するためにパッケージレベルで予め塗布されるアンダーフィル
US20100077080A1 (en) 2008-09-23 2010-03-25 Tai-Yeon Ku Communication terminal, service kiosk, and service providing system and method
WO2010122757A1 (ja) 2009-04-24 2010-10-28 パナソニック株式会社 半導体パッケージ部品の実装方法と実装構造体
JP2010283085A (ja) 2009-06-03 2010-12-16 Toshiba Corp 電子機器
JP2016530723A (ja) 2013-09-03 2016-09-29 チザラ リヒトシステーメ ゲーエムベーハーＺｉｚａｌａ Ｌｉｃｈｔｓｙｓｔｅｍｅ ＧｍｂＨ 位置安定的はんだ付け方法

Also Published As

Publication number Publication date
US12349279B2 (en) 2025-07-01
US20220369463A1 (en) 2022-11-17
WO2021157629A1 (ja) 2021-08-12
CN115024026B (zh) 2024-11-08
CN115024026A (zh) 2022-09-06
JP2021125523A (ja) 2021-08-30

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