JP7280036B2 - 導電性フィルムの製造方法 - Google Patents

導電性フィルムの製造方法 Download PDF

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Publication number
JP7280036B2
JP7280036B2 JP2018235820A JP2018235820A JP7280036B2 JP 7280036 B2 JP7280036 B2 JP 7280036B2 JP 2018235820 A JP2018235820 A JP 2018235820A JP 2018235820 A JP2018235820 A JP 2018235820A JP 7280036 B2 JP7280036 B2 JP 7280036B2
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Japan
Prior art keywords
film
conductive layer
conductive
layer
roll
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JP2018235820A
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English (en)
Japanese (ja)
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JP2020097761A (ja
Inventor
浩史 別府
直樹 小石
寛行 鷹尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
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Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2018235820A priority Critical patent/JP7280036B2/ja
Priority to KR1020190154618A priority patent/KR20200074861A/ko
Priority to CN201911275576.8A priority patent/CN111326291B/zh
Priority to TW108146164A priority patent/TW202031497A/zh
Publication of JP2020097761A publication Critical patent/JP2020097761A/ja
Application granted granted Critical
Publication of JP7280036B2 publication Critical patent/JP7280036B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2018235820A 2018-12-17 2018-12-17 導電性フィルムの製造方法 Active JP7280036B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018235820A JP7280036B2 (ja) 2018-12-17 2018-12-17 導電性フィルムの製造方法
KR1020190154618A KR20200074861A (ko) 2018-12-17 2019-11-27 도전성 필름의 제조 방법
CN201911275576.8A CN111326291B (zh) 2018-12-17 2019-12-12 导电性薄膜的制造方法
TW108146164A TW202031497A (zh) 2018-12-17 2019-12-17 導電性膜之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018235820A JP7280036B2 (ja) 2018-12-17 2018-12-17 導電性フィルムの製造方法

Publications (2)

Publication Number Publication Date
JP2020097761A JP2020097761A (ja) 2020-06-25
JP7280036B2 true JP7280036B2 (ja) 2023-05-23

Family

ID=71105760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018235820A Active JP7280036B2 (ja) 2018-12-17 2018-12-17 導電性フィルムの製造方法

Country Status (4)

Country Link
JP (1) JP7280036B2 (zh)
KR (1) KR20200074861A (zh)
CN (1) CN111326291B (zh)
TW (1) TW202031497A (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002350612A (ja) 2001-05-25 2002-12-04 Dainippon Ink & Chem Inc 遮光性フィルム、遮光性粘着シート、およびそれを使用した表示パネル
JP2003124605A (ja) 2001-10-18 2003-04-25 Toray Ind Inc 回路基板の製造方法
JP2010053447A (ja) 2008-07-31 2010-03-11 Sumitomo Metal Mining Co Ltd 成膜方法及び成膜装置
JP2010248619A (ja) 2009-03-26 2010-11-04 Hitachi Metals Ltd 酸素含有Ｃｕ合金膜の製造方法
JP2013225105A (ja) 2012-03-19 2013-10-31 Sumitomo Metal Mining Co Ltd 光学薄膜の製造方法及び吸収型多層膜ｎｄフィルター
WO2016140073A1 (ja) 2015-03-04 2016-09-09 株式会社カネカ 導電層付き基板、タッチパネル用透明電極付き基板及びそれらの製造方法
JP2018135542A (ja) 2017-02-20 2018-08-30 住友金属鉱山株式会社 樹脂フィルムの表面処理法及びこれを有する銅張積層基板の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742572B2 (ja) * 1986-10-03 1995-05-10 旭硝子株式会社 透明電導膜
JPH1098292A (ja) * 1996-09-20 1998-04-14 Idemitsu Kosan Co Ltd 電磁波シールド材
WO2009057637A1 (ja) * 2007-10-31 2009-05-07 Sumitomo Metal Mining Co., Ltd. フレキシブル透明導電フィルム及びこれを用いたフレキシブル機能性素子
JP5526691B2 (ja) 2009-10-08 2014-06-18 東レ株式会社 平面アンテナ用金属積層樹脂フィルム
JP5782345B2 (ja) * 2010-09-29 2015-09-24 日東電工株式会社 積層フィルムの製造方法
JP5848565B2 (ja) * 2010-09-29 2016-01-27 日東電工株式会社 粘着剤層付き樹脂フィルム、積層フィルムおよびタッチパネル
JP5543907B2 (ja) * 2010-12-24 2014-07-09 日東電工株式会社 透明導電性フィルムおよびその製造方法
JP6023402B2 (ja) * 2010-12-27 2016-11-09 日東電工株式会社 透明導電性フィルムおよびその製造方法
JP5914036B2 (ja) * 2011-04-20 2016-05-11 日東電工株式会社 導電性積層フィルムの製造方法
JP5844996B2 (ja) * 2011-05-11 2016-01-20 日東電工株式会社 透明導電性積層体及びタッチパネル
JP5781428B2 (ja) * 2011-12-20 2015-09-24 日東電工株式会社 導電性フィルムおよび導電性フィルムロール
JP6239330B2 (ja) * 2013-09-26 2017-11-29 日東電工株式会社 透明導電性フィルムの製造方法
KR20170008196A (ko) * 2014-05-20 2017-01-23 닛토덴코 가부시키가이샤 투명 도전성 필름 및 그 제조 방법
JP5957133B2 (ja) * 2014-11-20 2016-07-27 日東電工株式会社 保護フィルム付き透明導電性フィルム
JP6495635B2 (ja) * 2014-12-05 2019-04-03 日東電工株式会社 透明導電性フィルム積層体及びそれを用いて得られるタッチパネル、並びに透明導電性フィルムの製造方法
JP6801952B2 (ja) * 2015-11-16 2020-12-16 日東電工株式会社 導電性フィルム
JP6650770B2 (ja) * 2016-01-29 2020-02-19 日東電工株式会社 導電性積層フィルム
TWI633563B (zh) * 2016-12-15 2018-08-21 日商日東電工股份有限公司 Transparent conductive film with carrier film and touch panel using the same
JP2018116542A (ja) * 2017-01-19 2018-07-26 日東電工株式会社 タッチパネル用フィルム積層体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002350612A (ja) 2001-05-25 2002-12-04 Dainippon Ink & Chem Inc 遮光性フィルム、遮光性粘着シート、およびそれを使用した表示パネル
JP2003124605A (ja) 2001-10-18 2003-04-25 Toray Ind Inc 回路基板の製造方法
JP2010053447A (ja) 2008-07-31 2010-03-11 Sumitomo Metal Mining Co Ltd 成膜方法及び成膜装置
JP2010248619A (ja) 2009-03-26 2010-11-04 Hitachi Metals Ltd 酸素含有Ｃｕ合金膜の製造方法
JP2013225105A (ja) 2012-03-19 2013-10-31 Sumitomo Metal Mining Co Ltd 光学薄膜の製造方法及び吸収型多層膜ｎｄフィルター
WO2016140073A1 (ja) 2015-03-04 2016-09-09 株式会社カネカ 導電層付き基板、タッチパネル用透明電極付き基板及びそれらの製造方法
JP2018135542A (ja) 2017-02-20 2018-08-30 住友金属鉱山株式会社 樹脂フィルムの表面処理法及びこれを有する銅張積層基板の製造方法

Also Published As

Publication number Publication date
TW202031497A (zh) 2020-09-01
CN111326291B (zh) 2023-05-05
KR20200074861A (ko) 2020-06-25
JP2020097761A (ja) 2020-06-25
CN111326291A (zh) 2020-06-23

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