JP7270438B2 - 表示パネル及びそれを含む表示装置 - Google Patents
表示パネル及びそれを含む表示装置 Download PDFInfo
- Publication number
- JP7270438B2 JP7270438B2 JP2019058294A JP2019058294A JP7270438B2 JP 7270438 B2 JP7270438 B2 JP 7270438B2 JP 2019058294 A JP2019058294 A JP 2019058294A JP 2019058294 A JP2019058294 A JP 2019058294A JP 7270438 B2 JP7270438 B2 JP 7270438B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- pads
- sub
- pad group
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 57
- 230000007423 decrease Effects 0.000 claims description 17
- 239000011295 pitch Substances 0.000 description 34
- 101150008740 cpg-1 gene Proteins 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 241000239290 Araneae Species 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101000617550 Dictyostelium discoideum Presenilin-A Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13456—Cell terminals located on one side of the display only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
Landscapes
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Display Devices Of Pinball Game Machines (AREA)
Description
図1は、一実施例の表示装置の平面図である。図2は、一実施例の表示装置に含まれた表示パネルの一部を示す平面図である。図3は、図2に示した一実施例の表示パネルにおいて、表示領域に対応する部分をより詳細に示す図である。
d=Lxcosθ
BS1 第1基板
BS2 第2基板
CD1、CD2 連結パッド
CL 連結配線
CL1 第1連結配線
CL2 第2連結配線
CP 屈曲部分
CPG1 第1連結パッドグループ
CPG-L 第2サブ連結パッドグループ
CPG-R 第1サブ連結パッドグループ
DA 表示領域
DD 表示装置
DP、DP-1、DP-2 表示パネル
ED エッジ
EL-CL2、EL-PD1、EL-PD2 延長方向
FB 連結回路基板
G1 第1パッドグループ
G2-R 第1サブパッドグループ
G2-L 第2サブパッドグループ
G2-R 第1サブパッドグループ
IL1 第1仮想線
IL2 第2仮想線
NDA 非表示領域
PA パッド領域
PA-1、PA-2 パッド領域
PD パッド
PD1 第1パッド
PD2 第2パッド
PDG パッドグループ
PS 表示基板
RL 基準線
RL-B 下部基準線
RL-T 上部基準線
SL1 第1サブ配線部
SL2 第2サブ配線部
SL3 第3サブ配線部
SL4 第4サブ配線部
SL4-1 下部サブ配線部
SL4-2 上部サブ配線部
Claims (9)
- 映像を表示する表示領域、及び前記表示領域の少なくとも一側に配置されたパッド領域を含む表示基板と、
前記パッド領域の上に配置され、第1方向に沿って配列された複数のパッドグループと、を含み、
前記パッドグループは、
前記第1方向と垂直に交差する第2方向に延長される仮想の基準線に対して第1勾配を有し、第1間隔で離隔された複数の第1パッドを含む第1パッドグループと、
前記仮想の基準線に対して前記第1勾配とは異なる第2勾配を有し、前記第1間隔とは異なる第2間隔で離隔された複数の第2パッドを含む第2パッドグループと、を含み、
前記第1パッドグループは前記パッド領域の中心部に配置され、
前記第2パッドグループは前記第1パッドグループの両側に配置され、
前記第2パッドグループは複数のサブパッドグループを含み、
前記中心部から離隔されたサブパッドグループであるほど、前記基準線に対する前記第2パッドの勾配が増加し、
前記中心部からより離隔されたサブパッドグループであるほど、前記第2パッド間の離隔間隔、つまり、前記第2パッドのピッチが減少することを特徴とする表示パネル。 - 前記第2勾配は、0度超過50度以下であることを特徴とする請求項1に記載の表示パネル。
- 前記第1パッドグループから一側方向にn番目に配列された前記サブパッドグループに含まれた前記第2パッドと、前記第1パッドグループから他側方向にn番目に配列された前記サブパッドグループに含まれた前記第2パッドは、前記第1パッドグループを基準に対称に配置され、前記nは1以上の整数であることを特徴とする請求項1に記載の表示パネル。
- 前記第1パッド及び前記第2パッドの一側端部を連結する第1仮想線、及び前記第1パッド及び前記第2パッドの他側端部を連結する第2仮想線のうちいずれか一つは曲線であり、
前記第1仮想線は前記表示領域に隣接し、前記第2仮想線は前記表示基板のエッジに隣接することを特徴とする請求項1に記載の表示パネル。 - 前記第1仮想線は前記表示領域の方に膨らんだ曲線であり、
前記第2仮想線は前記表示基板のエッジと平行な直線であることを特徴とする請求項4に記載の表示パネル。 - 前記第1仮想線は前記表示基板のエッジと平行な直線であり、
前記第2仮想線は前記表示基板のエッジの方に膨らんだ曲線であることを特徴とする請求項4に記載の表示パネル。 - 平面上において、前記第1パッドと前記第2パッドは矩形であり、
前記第1パッドは第1長さと第1幅を有し、
前記第2パッドは前記第1長さより長い第2長さを有し、前記第1幅より小さい第2幅を有することを特徴とする請求項1に記載の表示パネル。 - 平面上において、前記第1パッドの第1面積は前記第2パッドの第2面積と同じであることを特徴とする請求項7に記載の表示パネル。
- 請求項1乃至請求項8のうちいずれか一項に記載の表示パネルと、
前記表示パネルの前記パッドグループに対応する複数の連結パッドグループを含む連結回路基板と、を含むことを特徴とする表示装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180055254A KR102505862B1 (ko) | 2018-05-15 | 2018-05-15 | 표시 패널 및 이를 포함하는 표시 장치 |
KR10-2018-0055254 | 2018-05-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019200416A JP2019200416A (ja) | 2019-11-21 |
JP7270438B2 true JP7270438B2 (ja) | 2023-05-10 |
Family
ID=66476489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019058294A Active JP7270438B2 (ja) | 2018-05-15 | 2019-03-26 | 表示パネル及びそれを含む表示装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US10880999B2 (ja) |
EP (1) | EP3570099B1 (ja) |
JP (1) | JP7270438B2 (ja) |
KR (2) | KR102505862B1 (ja) |
CN (1) | CN110488545A (ja) |
TW (1) | TWI811359B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020113384A1 (zh) * | 2018-12-03 | 2020-06-11 | 深圳市柔宇科技有限公司 | 显示装置 |
CN111564111B (zh) * | 2020-05-29 | 2023-03-31 | 上海中航光电子有限公司 | 一种显示面板和显示装置 |
KR20220001050A (ko) | 2020-06-26 | 2022-01-05 | 삼성디스플레이 주식회사 | 디스플레이 구동 장치, 디스플레이 패널 및 디스플레이 장치 |
CN111681554B (zh) * | 2020-06-30 | 2022-03-25 | 上海中航光电子有限公司 | 显示面板及显示装置 |
KR20220023913A (ko) * | 2020-08-21 | 2022-03-03 | 삼성디스플레이 주식회사 | 표시 패널 및 이를 포함하는 표시 장치 |
TWM605386U (zh) * | 2020-08-31 | 2020-12-11 | 奕力科技股份有限公司 | 晶片及顯示面板 |
CN114930237A (zh) * | 2020-10-22 | 2022-08-19 | 京东方科技集团股份有限公司 | 显示面板和显示设备 |
US11800642B2 (en) * | 2020-12-01 | 2023-10-24 | Tpk Advanced Solutions Inc. | Bonding pad structure for electronic device and manufacturing method thereof |
CN112867244B (zh) * | 2021-02-26 | 2022-07-15 | 厦门天马微电子有限公司 | 一种显示面板和显示装置 |
CN113820892A (zh) * | 2021-09-28 | 2021-12-21 | 惠科股份有限公司 | 阵列基板及显示面板 |
KR20230117018A (ko) * | 2022-01-28 | 2023-08-07 | 삼성디스플레이 주식회사 | 표시 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110193239A1 (en) | 2008-09-01 | 2011-08-11 | Sharp Kabushiki Kaisha | Semiconductor element and display device provided with the same |
US20140321088A1 (en) | 2013-04-29 | 2014-10-30 | Samsung Display Co., Ltd. | Display panel, electronic device including the same, and bonding method thereof |
JP2015204458A (ja) | 2014-04-10 | 2015-11-16 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 電子部品 |
US20150366049A1 (en) | 2014-06-17 | 2015-12-17 | Samsung Display Co., Ltd. | Array substrate and method of mounting integrated circuit using the same |
US20180090442A1 (en) | 2016-02-04 | 2018-03-29 | Boe Technology Group Co., Ltd. | Chip-on-film, flexible display panel and display device |
WO2018077257A1 (zh) | 2016-10-31 | 2018-05-03 | 昆山工研院新型平板显示技术中心有限公司 | 驱动电路载体、显示面板、平板显示器及制造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5951304A (en) * | 1997-05-21 | 1999-09-14 | General Electric Company | Fanout interconnection pad arrays |
JP2000259091A (ja) | 1999-03-04 | 2000-09-22 | Casio Comput Co Ltd | 表示パネル、フレキシブル配線基板及びそれらを備えた表示装置 |
US7132735B2 (en) * | 2005-03-07 | 2006-11-07 | Agere Systems Inc. | Integrated circuit package with lead fingers extending into a slot of a die paddle |
JP5320270B2 (ja) * | 2009-11-25 | 2013-10-23 | 株式会社沖データ | 表示パネルの製造方法 |
JP2012118099A (ja) * | 2010-11-29 | 2012-06-21 | Optrex Corp | 駆動用ドライバ素子および表示装置 |
US9974175B2 (en) * | 2013-04-29 | 2018-05-15 | Samsung Display Co., Ltd. | Electronic component, electric device including the same, and bonding method thereof |
US9257763B2 (en) * | 2013-07-02 | 2016-02-09 | Gyrus Acmi, Inc. | Hybrid interconnect |
KR101551532B1 (ko) * | 2013-08-22 | 2015-09-08 | 하이디스 테크놀로지 주식회사 | 부채꼴 형태의 패드 및 범프 배열 구조를 가지는 디스플레이 패널, ic칩 및 액정표시장치 |
KR20150054454A (ko) * | 2013-11-12 | 2015-05-20 | 삼성디스플레이 주식회사 | 표시패널 및 이를 포함하는 전자기기 |
CN104201167B (zh) * | 2014-07-31 | 2017-03-15 | 京东方科技集团股份有限公司 | 一种焊垫结构及显示装置 |
US9544994B2 (en) | 2014-08-30 | 2017-01-10 | Lg Display Co., Ltd. | Flexible display device with side crack protection structure and manufacturing method for the same |
KR102330882B1 (ko) * | 2014-10-13 | 2021-11-25 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102562586B1 (ko) * | 2015-11-04 | 2023-08-03 | 삼성디스플레이 주식회사 | 인쇄회로기판 및 이를 포함하는 표시 장치 |
KR102464217B1 (ko) * | 2015-11-05 | 2022-11-08 | 삼성디스플레이 주식회사 | 가요성 인쇄 회로 기판 및 이를 포함하는 표시장치 |
CN105654856A (zh) * | 2016-02-04 | 2016-06-08 | 京东方科技集团股份有限公司 | 一种显示装置及其芯片邦定方法 |
CN106298862A (zh) * | 2016-10-31 | 2017-01-04 | 昆山工研院新型平板显示技术中心有限公司 | 显示模组 |
-
2018
- 2018-05-15 KR KR1020180055254A patent/KR102505862B1/ko active IP Right Grant
-
2019
- 2019-03-26 JP JP2019058294A patent/JP7270438B2/ja active Active
- 2019-05-01 US US16/401,070 patent/US10880999B2/en active Active
- 2019-05-09 EP EP19173508.3A patent/EP3570099B1/en active Active
- 2019-05-09 TW TW108116042A patent/TWI811359B/zh active
- 2019-05-14 CN CN201910397286.4A patent/CN110488545A/zh active Pending
-
2020
- 2020-12-16 US US17/124,383 patent/US11818839B2/en active Active
-
2023
- 2023-02-27 KR KR1020230025527A patent/KR102602525B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110193239A1 (en) | 2008-09-01 | 2011-08-11 | Sharp Kabushiki Kaisha | Semiconductor element and display device provided with the same |
US20140321088A1 (en) | 2013-04-29 | 2014-10-30 | Samsung Display Co., Ltd. | Display panel, electronic device including the same, and bonding method thereof |
JP2015204458A (ja) | 2014-04-10 | 2015-11-16 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 電子部品 |
US20150366049A1 (en) | 2014-06-17 | 2015-12-17 | Samsung Display Co., Ltd. | Array substrate and method of mounting integrated circuit using the same |
US20180090442A1 (en) | 2016-02-04 | 2018-03-29 | Boe Technology Group Co., Ltd. | Chip-on-film, flexible display panel and display device |
WO2018077257A1 (zh) | 2016-10-31 | 2018-05-03 | 昆山工研院新型平板显示技术中心有限公司 | 驱动电路载体、显示面板、平板显示器及制造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3570099B1 (en) | 2022-06-08 |
US20190357367A1 (en) | 2019-11-21 |
KR102602525B1 (ko) | 2023-11-17 |
TWI811359B (zh) | 2023-08-11 |
KR102505862B1 (ko) | 2023-03-07 |
JP2019200416A (ja) | 2019-11-21 |
US10880999B2 (en) | 2020-12-29 |
TW201947566A (zh) | 2019-12-16 |
US20210105896A1 (en) | 2021-04-08 |
US11818839B2 (en) | 2023-11-14 |
KR20190131156A (ko) | 2019-11-26 |
EP3570099A1 (en) | 2019-11-20 |
KR20230037017A (ko) | 2023-03-15 |
CN110488545A (zh) | 2019-11-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7270438B2 (ja) | 表示パネル及びそれを含む表示装置 | |
US11048132B2 (en) | Display panel and display apparatus | |
KR102457059B1 (ko) | 표시 장치 | |
KR102543916B1 (ko) | 플렉서블 전자 장치 | |
JP6479175B2 (ja) | フレキシブル基板の信号トレースパターン | |
CN110517590B (zh) | 一种显示装置及显示装置的制备方法 | |
KR102100440B1 (ko) | 플렉서블 터치 스크린 패널 | |
TWI515627B (zh) | 觸控電極結構及其應用之觸控面板 | |
KR102468327B1 (ko) | 표시 장치 | |
CN112860122B (zh) | 触控显示装置和显示系统 | |
CN112863341B (zh) | 可拉伸显示面板及显示装置 | |
WO2020087803A1 (zh) | 显示装置 | |
CN112673337B (zh) | 触控面板及触控显示面板 | |
JP2018155942A (ja) | 表示装置 | |
JP3194107U (ja) | 表示パネル | |
KR20160050196A (ko) | 표시장치 | |
CN114551513A (zh) | 显示装置 | |
CN110262148B (zh) | 一种阵列基板、显示面板和显示装置 | |
US11360623B2 (en) | Touch sensor and electronic device | |
KR20160140239A (ko) | 터치 내장형 디스플레이 패널 | |
US20240047442A1 (en) | Light-emitting diode panel and spliced panel | |
WO2023108847A1 (zh) | 显示面板及显示装置 | |
KR20240065496A (ko) | 표시 장치 | |
CN116774482A (zh) | 电子装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220301 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20221221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221227 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230327 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230404 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230425 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7270438 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |