JP7265390B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP7265390B2
JP7265390B2 JP2019054965A JP2019054965A JP7265390B2 JP 7265390 B2 JP7265390 B2 JP 7265390B2 JP 2019054965 A JP2019054965 A JP 2019054965A JP 2019054965 A JP2019054965 A JP 2019054965A JP 7265390 B2 JP7265390 B2 JP 7265390B2
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Prior art keywords
substrate
rinse liquid
nozzle
organic solvent
center
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JP2019054965A
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English (en)
Japanese (ja)
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JP2020155709A (ja
Inventor
知浩 植村
崇 伊豆田
克栄 東
明日香 脇田
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2019054965A priority Critical patent/JP7265390B2/ja
Priority to PCT/JP2020/009606 priority patent/WO2020195695A1/ja
Priority to TW109107342A priority patent/TWI743696B/zh
Publication of JP2020155709A publication Critical patent/JP2020155709A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2019054965A 2019-03-22 2019-03-22 基板処理装置および基板処理方法 Active JP7265390B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019054965A JP7265390B2 (ja) 2019-03-22 2019-03-22 基板処理装置および基板処理方法
PCT/JP2020/009606 WO2020195695A1 (ja) 2019-03-22 2020-03-06 基板処理装置、基板処理方法および半導体製造方法
TW109107342A TWI743696B (zh) 2019-03-22 2020-03-06 基板處理裝置以及基板處理方法

Applications Claiming Priority (1)

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JP2019054965A JP7265390B2 (ja) 2019-03-22 2019-03-22 基板処理装置および基板処理方法

Publications (2)

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JP2020155709A JP2020155709A (ja) 2020-09-24
JP7265390B2 true JP7265390B2 (ja) 2023-04-26

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JP2019054965A Active JP7265390B2 (ja) 2019-03-22 2019-03-22 基板処理装置および基板処理方法

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JP (1) JP7265390B2 (zh)
TW (1) TWI743696B (zh)
WO (1) WO2020195695A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113471108B (zh) * 2021-07-06 2022-10-21 华海清科股份有限公司 一种基于马兰戈尼效应的晶圆竖直旋转处理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078329A (ja) 2006-09-20 2008-04-03 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2016082226A (ja) 2014-10-21 2016-05-16 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6865626B2 (ja) * 2017-04-21 2021-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078329A (ja) 2006-09-20 2008-04-03 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2016082226A (ja) 2014-10-21 2016-05-16 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

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TW202036703A (zh) 2020-10-01
WO2020195695A1 (ja) 2020-10-01
TWI743696B (zh) 2021-10-21
JP2020155709A (ja) 2020-09-24

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