JP7261882B2 - 熱硬化性感光性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス - Google Patents

熱硬化性感光性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Download PDF

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JP7261882B2
JP7261882B2 JP2021530661A JP2021530661A JP7261882B2 JP 7261882 B2 JP7261882 B2 JP 7261882B2 JP 2021530661 A JP2021530661 A JP 2021530661A JP 2021530661 A JP2021530661 A JP 2021530661A JP 7261882 B2 JP7261882 B2 JP 7261882B2
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group
cured film
thermosetting photosensitive
photosensitive composition
free energy
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JPWO2021006181A1 (https=
Inventor
雄一郎 榎本
俊栄 青島
健太 山▲ざき▼
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Fujifilm Corp
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Fujifilm Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
JP2021530661A 2019-07-05 2020-07-02 熱硬化性感光性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Active JP7261882B2 (ja)

Applications Claiming Priority (3)

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JP2019126114 2019-07-05
JP2019126114 2019-07-05
PCT/JP2020/026066 WO2021006181A1 (ja) 2019-07-05 2020-07-02 熱硬化性感光性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

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JPWO2021006181A1 JPWO2021006181A1 (https=) 2021-01-14
JP7261882B2 true JP7261882B2 (ja) 2023-04-20

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JP (1) JP7261882B2 (https=)
TW (1) TWI857090B (https=)
WO (1) WO2021006181A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022196804A1 (ja) * 2021-03-18 2022-09-22 ダイキン工業株式会社 フッ素樹脂の製造方法、フッ素樹脂および水性分散液
US20240176239A1 (en) * 2021-03-23 2024-05-30 Toray Industries, Inc. Negative photosensitive resin composition, negative photosensitive resin composition film, cured product, preparation method of cured product, hollow structure, and electronic component
WO2024004462A1 (ja) * 2022-06-30 2024-01-04 Jsr株式会社 ネガ型感光性樹脂組成物、パターンを有する樹脂膜の製造方法、パターンを有する樹脂膜、および半導体回路基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007122929A1 (ja) 2006-03-30 2007-11-01 Jsr Corporation 感放射線性絶縁樹脂組成物
JP2012073600A (ja) 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板
JP2015052770A (ja) 2013-08-08 2015-03-19 Jsr株式会社 感放射線性樹脂組成物、絶縁膜及びその形成方法並びに有機ｅｌ素子
WO2015087830A1 (ja) 2013-12-11 2015-06-18 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
JP2018159920A (ja) 2017-03-22 2018-10-11 Jnc株式会社 感光性組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015137281A1 (ja) * 2014-03-14 2017-04-06 東レ株式会社 感光性樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007122929A1 (ja) 2006-03-30 2007-11-01 Jsr Corporation 感放射線性絶縁樹脂組成物
JP2012073600A (ja) 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板
JP2015052770A (ja) 2013-08-08 2015-03-19 Jsr株式会社 感放射線性樹脂組成物、絶縁膜及びその形成方法並びに有機ｅｌ素子
WO2015087830A1 (ja) 2013-12-11 2015-06-18 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
JP2018159920A (ja) 2017-03-22 2018-10-11 Jnc株式会社 感光性組成物

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TW202110955A (zh) 2021-03-16
JPWO2021006181A1 (https=) 2021-01-14
WO2021006181A1 (ja) 2021-01-14
TWI857090B (zh) 2024-10-01

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