JPWO2021006181A1 - - Google Patents
Info
- Publication number
- JPWO2021006181A1 JPWO2021006181A1 JP2021530661A JP2021530661A JPWO2021006181A1 JP WO2021006181 A1 JPWO2021006181 A1 JP WO2021006181A1 JP 2021530661 A JP2021530661 A JP 2021530661A JP 2021530661 A JP2021530661 A JP 2021530661A JP WO2021006181 A1 JPWO2021006181 A1 JP WO2021006181A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019126114 | 2019-07-05 | ||
| JP2019126114 | 2019-07-05 | ||
| PCT/JP2020/026066 WO2021006181A1 (ja) | 2019-07-05 | 2020-07-02 | 熱硬化性感光性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021006181A1 true JPWO2021006181A1 (https=) | 2021-01-14 |
| JP7261882B2 JP7261882B2 (ja) | 2023-04-20 |
Family
ID=74115296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021530661A Active JP7261882B2 (ja) | 2019-07-05 | 2020-07-02 | 熱硬化性感光性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7261882B2 (https=) |
| TW (1) | TWI857090B (https=) |
| WO (1) | WO2021006181A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022196804A1 (ja) * | 2021-03-18 | 2022-09-22 | ダイキン工業株式会社 | フッ素樹脂の製造方法、フッ素樹脂および水性分散液 |
| US20240176239A1 (en) * | 2021-03-23 | 2024-05-30 | Toray Industries, Inc. | Negative photosensitive resin composition, negative photosensitive resin composition film, cured product, preparation method of cured product, hollow structure, and electronic component |
| WO2024004462A1 (ja) * | 2022-06-30 | 2024-01-04 | Jsr株式会社 | ネガ型感光性樹脂組成物、パターンを有する樹脂膜の製造方法、パターンを有する樹脂膜、および半導体回路基板 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007122929A1 (ja) * | 2006-03-30 | 2007-11-01 | Jsr Corporation | 感放射線性絶縁樹脂組成物 |
| JP2012073600A (ja) * | 2010-08-31 | 2012-04-12 | Fujifilm Corp | 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板 |
| JP2015052770A (ja) * | 2013-08-08 | 2015-03-19 | Jsr株式会社 | 感放射線性樹脂組成物、絶縁膜及びその形成方法並びに有機ｅｌ素子 |
| WO2015087830A1 (ja) * | 2013-12-11 | 2015-06-18 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置 |
| JP2018159920A (ja) * | 2017-03-22 | 2018-10-11 | Jnc株式会社 | 感光性組成物 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2015137281A1 (ja) * | 2014-03-14 | 2017-04-06 | 東レ株式会社 | 感光性樹脂組成物 |
-
2020
- 2020-07-02 WO PCT/JP2020/026066 patent/WO2021006181A1/ja not_active Ceased
- 2020-07-02 JP JP2021530661A patent/JP7261882B2/ja active Active
- 2020-07-02 TW TW109122370A patent/TWI857090B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007122929A1 (ja) * | 2006-03-30 | 2007-11-01 | Jsr Corporation | 感放射線性絶縁樹脂組成物 |
| JP2012073600A (ja) * | 2010-08-31 | 2012-04-12 | Fujifilm Corp | 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板 |
| JP2015052770A (ja) * | 2013-08-08 | 2015-03-19 | Jsr株式会社 | 感放射線性樹脂組成物、絶縁膜及びその形成方法並びに有機ｅｌ素子 |
| WO2015087830A1 (ja) * | 2013-12-11 | 2015-06-18 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置 |
| JP2018159920A (ja) * | 2017-03-22 | 2018-10-11 | Jnc株式会社 | 感光性組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202110955A (zh) | 2021-03-16 |
| WO2021006181A1 (ja) | 2021-01-14 |
| TWI857090B (zh) | 2024-10-01 |
| JP7261882B2 (ja) | 2023-04-20 |
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