TWI857090B - 熱硬化性感光性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件 - Google Patents

熱硬化性感光性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件 Download PDF

Info

Publication number
TWI857090B
TWI857090B TW109122370A TW109122370A TWI857090B TW I857090 B TWI857090 B TW I857090B TW 109122370 A TW109122370 A TW 109122370A TW 109122370 A TW109122370 A TW 109122370A TW I857090 B TWI857090 B TW I857090B
Authority
TW
Taiwan
Prior art keywords
group
thermosetting photosensitive
photosensitive composition
cured film
film
Prior art date
Application number
TW109122370A
Other languages
English (en)
Chinese (zh)
Other versions
TW202110955A (zh
Inventor
榎本雄一郎
青島俊栄
山﨑健太
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202110955A publication Critical patent/TW202110955A/zh
Application granted granted Critical
Publication of TWI857090B publication Critical patent/TWI857090B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
TW109122370A 2019-07-05 2020-07-02 熱硬化性感光性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件 TWI857090B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019126114 2019-07-05
JP2019-126114 2019-07-05

Publications (2)

Publication Number Publication Date
TW202110955A TW202110955A (zh) 2021-03-16
TWI857090B true TWI857090B (zh) 2024-10-01

Family

ID=74115296

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109122370A TWI857090B (zh) 2019-07-05 2020-07-02 熱硬化性感光性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件

Country Status (3)

Country Link
JP (1) JP7261882B2 (https=)
TW (1) TWI857090B (https=)
WO (1) WO2021006181A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022196804A1 (ja) * 2021-03-18 2022-09-22 ダイキン工業株式会社 フッ素樹脂の製造方法、フッ素樹脂および水性分散液
US20240176239A1 (en) * 2021-03-23 2024-05-30 Toray Industries, Inc. Negative photosensitive resin composition, negative photosensitive resin composition film, cured product, preparation method of cured product, hollow structure, and electronic component
WO2024004462A1 (ja) * 2022-06-30 2024-01-04 Jsr株式会社 ネガ型感光性樹脂組成物、パターンを有する樹脂膜の製造方法、パターンを有する樹脂膜、および半導体回路基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201543152A (zh) * 2014-03-14 2015-11-16 Toray Industries 感光性樹脂組成物
TW201835227A (zh) * 2017-03-22 2018-10-01 日商捷恩智股份有限公司 感光性組成物、硬化膜、彩色濾光片、顯示元件、固體攝像元件及發光二極體發光體

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007122929A1 (ja) 2006-03-30 2007-11-01 Jsr Corporation 感放射線性絶縁樹脂組成物
JP2012073600A (ja) 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板
JP6303588B2 (ja) 2013-08-08 2018-04-04 Jsr株式会社 感放射線性樹脂組成物、絶縁膜及びその形成方法並びに有機ｅｌ素子
JPWO2015087830A1 (ja) 2013-12-11 2017-03-16 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201543152A (zh) * 2014-03-14 2015-11-16 Toray Industries 感光性樹脂組成物
TW201835227A (zh) * 2017-03-22 2018-10-01 日商捷恩智股份有限公司 感光性組成物、硬化膜、彩色濾光片、顯示元件、固體攝像元件及發光二極體發光體

Also Published As

Publication number Publication date
TW202110955A (zh) 2021-03-16
JPWO2021006181A1 (https=) 2021-01-14
WO2021006181A1 (ja) 2021-01-14
JP7261882B2 (ja) 2023-04-20

Similar Documents

Publication Publication Date Title
TWI851752B (zh) 硬化性樹脂組成物、硬化性樹脂組成物的製造方法、硬化膜、積層體、硬化膜的製造方法及半導體器件
TWI841777B (zh) 硬化膜的製造方法、積層體的製造方法及電子元件的製造方法
TWI802640B (zh) 感光性樹脂組成物、樹脂、硬化膜、積層體、硬化膜之製造方法、半導體元件
TWI878445B (zh) 硬化性樹脂組成物、樹脂膜、硬化膜、積層體、硬化膜的製造方法及半導體元件
TWI875930B (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
JP7576617B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7470790B2 (ja) 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7492003B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
TW202112907A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件、樹脂及樹脂的製造方法
TW202116876A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件、樹脂及樹脂的製造方法
TWI857161B (zh) 圖案形成方法、感光性樹脂組成物、積層體的製造方法及半導體元件的製造方法
TWI835240B (zh) 硬化物之製造方法、積層體之製造方法及半導體元件之製造方法以及處理液
TWI859361B (zh) 圖案形成方法、光硬化性樹脂組成物、積層體的製造方法及電子元件的製造方法
TWI836067B (zh) 負型硬化性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TW202311240A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法、及半導體元件、以及化合物
JP2024045129A (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
TWI857090B (zh) 熱硬化性感光性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TW202337926A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件
TWI864226B (zh) 圖案形成方法、積層體的製造方法及電子元件的製造方法
TW202311307A (zh) 硬化物之製造方法、積層體之製造方法及半導體元件之製造方法以及處理液及樹脂組成物
TW202024786A (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體元件及熱鹼產生劑
TWI836111B (zh) 負型硬化性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
KR102933491B1 (ko) 감광성 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 적층체의 제조 방법, 반도체 디바이스의 제조 방법, 및, 반도체 디바이스
JP7454672B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱硬化性樹脂
TW202210557A (zh) 硬化物的製造方法、積層體的製造方法及電子元件的製造方法