JP7255765B1 - 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂シート、および、プリント配線板 - Google Patents

樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂シート、および、プリント配線板 Download PDF

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JP7255765B1
JP7255765B1 JP2023501827A JP2023501827A JP7255765B1 JP 7255765 B1 JP7255765 B1 JP 7255765B1 JP 2023501827 A JP2023501827 A JP 2023501827A JP 2023501827 A JP2023501827 A JP 2023501827A JP 7255765 B1 JP7255765 B1 JP 7255765B1
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resin composition
mass
group
formula
compound
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JPWO2023026829A5 (https=
JPWO2023026829A1 (https=
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祐司 中島
宇志 小林
俊介 平野
恵一 長谷部
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
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  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2023501827A 2021-08-25 2022-08-05 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂シート、および、プリント配線板 Active JP7255765B1 (ja)

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JP2023046140A JP7327698B2 (ja) 2021-08-25 2023-03-23 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂シート、および、プリント配線板

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JP2021136790 2021-08-25
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PCT/JP2022/030138 WO2023026829A1 (ja) 2021-08-25 2022-08-05 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂シート、および、プリント配線板

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JP2023046140A Active JP7327698B2 (ja) 2021-08-25 2023-03-23 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂シート、および、プリント配線板

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US (1) US12325770B2 (https=)
EP (1) EP4386022A4 (https=)
JP (2) JP7255765B1 (https=)
KR (2) KR102728882B1 (https=)
CN (1) CN117836341A (https=)
TW (2) TWI836545B (https=)
WO (1) WO2023026829A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2025187616A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12325770B2 (en) * 2021-08-25 2025-06-10 Mitsubishi Gas Chemical Company, Inc. Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
KR20250158018A (ko) * 2023-03-06 2025-11-05 나믹스 가부시끼가이샤 수지 조성물, 그리고 이것을 사용한 층간 절연용의 접착 필름, 적층 기판, 전자 부품 및 반도체 장치
TW202442431A (zh) * 2023-03-20 2024-11-01 日商Ｍｇｃ 電子科技股份有限公司 印刷配線板之製造方法
TW202532485A (zh) * 2023-09-13 2025-08-16 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置
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