TWI836545B - 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂片、及印刷配線板 - Google Patents

樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂片、及印刷配線板 Download PDF

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TWI836545B
TWI836545B TW111129687A TW111129687A TWI836545B TW I836545 B TWI836545 B TW I836545B TW 111129687 A TW111129687 A TW 111129687A TW 111129687 A TW111129687 A TW 111129687A TW I836545 B TWI836545 B TW I836545B
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resin composition
mass
compound
formula
parts
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TW111129687A
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TW202323425A (zh
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中島祐司
小林宇志
平野俊介
長谷部恵一
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日商三菱瓦斯化學股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
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  • Chemical & Material Sciences (AREA)
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  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW111129687A 2021-08-25 2022-08-08 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂片、及印刷配線板 TWI836545B (zh)

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JP2021136790 2021-08-25
JP2021-136790 2021-08-25

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TW202323425A TW202323425A (zh) 2023-06-16
TWI836545B true TWI836545B (zh) 2024-03-21

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TW111129687A TWI836545B (zh) 2021-08-25 2022-08-08 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂片、及印刷配線板
TW113105758A TWI847951B (zh) 2021-08-25 2022-08-08 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂片、及印刷配線板

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US (1) US12325770B2 (https=)
EP (1) EP4386022A4 (https=)
JP (2) JP7255765B1 (https=)
KR (2) KR102728882B1 (https=)
CN (1) CN117836341A (https=)
TW (2) TWI836545B (https=)
WO (1) WO2023026829A1 (https=)

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Publication number Priority date Publication date Assignee Title
US12325770B2 (en) * 2021-08-25 2025-06-10 Mitsubishi Gas Chemical Company, Inc. Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
KR20250158018A (ko) * 2023-03-06 2025-11-05 나믹스 가부시끼가이샤 수지 조성물, 그리고 이것을 사용한 층간 절연용의 접착 필름, 적층 기판, 전자 부품 및 반도체 장치
TW202442431A (zh) * 2023-03-20 2024-11-01 日商Ｍｇｃ 電子科技股份有限公司 印刷配線板之製造方法
TW202532485A (zh) * 2023-09-13 2025-08-16 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置
WO2025058026A1 (ja) * 2023-09-13 2025-03-20 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
CN120005376A (zh) * 2023-11-09 2025-05-16 台光电子材料(昆山)股份有限公司 树脂组合物及其制品
WO2025173457A1 (ja) * 2024-02-16 2025-08-21 パナソニックＩｐマネジメント株式会社 難燃剤、樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
WO2025187617A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2025187616A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2025192017A1 (ja) * 2024-03-15 2025-09-18 パナソニックＩｐマネジメント株式会社 難燃剤、樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
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