JP7232837B2 - 表面曲率を有する電子デバイスの熱成形 - Google Patents

表面曲率を有する電子デバイスの熱成形 Download PDF

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Publication number
JP7232837B2
JP7232837B2 JP2020543524A JP2020543524A JP7232837B2 JP 7232837 B2 JP7232837 B2 JP 7232837B2 JP 2020543524 A JP2020543524 A JP 2020543524A JP 2020543524 A JP2020543524 A JP 2020543524A JP 7232837 B2 JP7232837 B2 JP 7232837B2
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Japan
Prior art keywords
support
substrate
pattern
islands
circuit
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JP2020543524A
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English (en)
Japanese (ja)
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JP2021514114A (ja
JP2021514114A5 (https=
JPWO2019160417A5 (https=
Inventor
コンスタン ピーター スミッツ，エドガー
ジャック マルテイン ルービング，ヤン―エリック
バーリンク，マルコ
Original Assignee
ネーデルランドセ オルガニサティエ フォール トエゲパスト－ナトールヴェテンシャッペリク オンデルゾエク ティエヌオー
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Publication of JP2021514114A publication Critical patent/JP2021514114A/ja
Publication of JP2021514114A5 publication Critical patent/JP2021514114A5/ja
Publication of JPWO2019160417A5 publication Critical patent/JPWO2019160417A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2020543524A 2018-02-19 2019-02-18 表面曲率を有する電子デバイスの熱成形 Active JP7232837B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18157378.3A EP3528602A1 (en) 2018-02-19 2018-02-19 Thermoforming an electronic device with surface curvature
EP18157378.3 2018-02-19
PCT/NL2019/050104 WO2019160417A1 (en) 2018-02-19 2019-02-18 Thermoforming an electronic device with surface curvature

Publications (4)

Publication Number Publication Date
JP2021514114A JP2021514114A (ja) 2021-06-03
JP2021514114A5 JP2021514114A5 (https=) 2022-02-21
JPWO2019160417A5 JPWO2019160417A5 (https=) 2022-02-21
JP7232837B2 true JP7232837B2 (ja) 2023-03-03

Family

ID=61258143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020543524A Active JP7232837B2 (ja) 2018-02-19 2019-02-18 表面曲率を有する電子デバイスの熱成形

Country Status (6)

Country Link
US (1) US11310915B2 (https=)
EP (2) EP3528602A1 (https=)
JP (1) JP7232837B2 (https=)
CN (1) CN111727667B (https=)
TW (1) TW201936034A (https=)
WO (1) WO2019160417A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3787381A1 (en) * 2019-08-30 2021-03-03 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Electronic device with multilayer laminate
DE102019127108A1 (de) * 2019-10-09 2021-04-15 Leonhard Kurz Stiftung & Co. Kg Verfahren und Vorrichtung zur Herstellung eines Kunststoffbauteils sowie ein Kunststoffbauteil
FI130084B (en) * 2019-12-13 2023-01-31 Canatu Oy MOLDABLE FILM AND METHOD FOR MANUFACTURE OF MOLDABLE FILM
KR102680894B1 (ko) * 2021-08-18 2024-07-04 한국성전(주) 입체가공형 터치패드 및 그 형성방법
TWI789171B (zh) * 2021-12-21 2023-01-01 財團法人工業技術研究院 電子裝置
TWI872486B (zh) * 2022-03-23 2025-02-11 美商阿爾發金屬化工公司 可成形及可撓性觸覺材料及結構
WO2023208262A1 (de) * 2022-04-26 2023-11-02 Gentherm Gmbh Dreidimensional konturiertes funktionselement mit flachigem elektrischen leiter und verfahren zur herstellung dasselbe
CN115406341B (zh) * 2022-08-30 2025-04-15 中国核动力研究设计院 一种电涡流位移传感器可靠性分析方法及系统
TWI871659B (zh) * 2022-08-31 2025-02-01 財團法人工業技術研究院 模塑電子裝置
EP4642173A4 (en) * 2023-01-27 2026-04-22 Samsung Electronics Co Ltd PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING IT
EP4472362A1 (en) * 2023-05-30 2024-12-04 Fundació Eurecat Manufacturing method of an electronic device comprising a non-flat laminar item with a non-flat electronic circuit thereon

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007119608A1 (ja) 2006-03-31 2007-10-25 Nec Corporation 配線基板、実装基板及び電子装置
JP2016143557A (ja) 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性配線基板
JP2016213435A (ja) 2015-05-11 2016-12-15 富士フイルム株式会社 導電性積層体の製造方法、導電性積層体、タッチセンサー

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3982895B2 (ja) * 1997-04-09 2007-09-26 三井化学株式会社 金属ベース半導体回路基板
JP2004356144A (ja) * 2003-05-27 2004-12-16 Fujikura Ltd 部品実装フレキシブル回路基板
GB2412247B (en) * 2004-03-16 2007-08-22 In2Tec Ltd Contoured circuit boards
JP5743037B2 (ja) * 2013-03-26 2015-07-01 株式会社村田製作所 樹脂多層基板および電子機器
WO2015101494A1 (en) * 2014-01-02 2015-07-09 Koninklijke Philips N.V. Method for manufacturing a non-planar printed circuit board assembly
WO2017167875A1 (en) * 2016-03-30 2017-10-05 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Laminated component carrier with a thermoplastic structure
JP6544488B2 (ja) * 2016-06-22 2019-07-17 株式会社村田製作所 インダクタブリッジおよび電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007119608A1 (ja) 2006-03-31 2007-10-25 Nec Corporation 配線基板、実装基板及び電子装置
JP2016143557A (ja) 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性配線基板
JP2016213435A (ja) 2015-05-11 2016-12-15 富士フイルム株式会社 導電性積層体の製造方法、導電性積層体、タッチセンサー

Also Published As

Publication number Publication date
US20210368627A1 (en) 2021-11-25
EP3528602A1 (en) 2019-08-21
JP2021514114A (ja) 2021-06-03
US11310915B2 (en) 2022-04-19
WO2019160417A1 (en) 2019-08-22
CN111727667A (zh) 2020-09-29
EP3756426B1 (en) 2022-04-27
CN111727667B (zh) 2022-08-19
TW201936034A (zh) 2019-09-01
EP3756426A1 (en) 2020-12-30

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