TW201936034A - 熱成形具有表面曲率的電子裝置之技術 - Google Patents

熱成形具有表面曲率的電子裝置之技術 Download PDF

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Publication number
TW201936034A
TW201936034A TW108102936A TW108102936A TW201936034A TW 201936034 A TW201936034 A TW 201936034A TW 108102936 A TW108102936 A TW 108102936A TW 108102936 A TW108102936 A TW 108102936A TW 201936034 A TW201936034 A TW 201936034A
Authority
TW
Taiwan
Prior art keywords
support
circuit
substrate
pattern
lines
Prior art date
Application number
TW108102936A
Other languages
English (en)
Chinese (zh)
Inventor
艾斯葛 Ｃ Ｐ 史密茲
珍艾利克 Ｊ Ｍ 魯賓合
馬可 巴應克
Original Assignee
荷蘭商荷蘭Ｔｎｏ自然科學組織公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荷蘭商荷蘭Ｔｎｏ自然科學組織公司 filed Critical 荷蘭商荷蘭Ｔｎｏ自然科學組織公司
Publication of TW201936034A publication Critical patent/TW201936034A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW108102936A 2018-02-19 2019-01-25 熱成形具有表面曲率的電子裝置之技術 TW201936034A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18157378.3A EP3528602A1 (en) 2018-02-19 2018-02-19 Thermoforming an electronic device with surface curvature
??18157378.3 2018-02-19

Publications (1)

Publication Number Publication Date
TW201936034A true TW201936034A (zh) 2019-09-01

Family

ID=61258143

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108102936A TW201936034A (zh) 2018-02-19 2019-01-25 熱成形具有表面曲率的電子裝置之技術

Country Status (6)

Country Link
US (1) US11310915B2 (https=)
EP (2) EP3528602A1 (https=)
JP (1) JP7232837B2 (https=)
CN (1) CN111727667B (https=)
TW (1) TW201936034A (https=)
WO (1) WO2019160417A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI871659B (zh) * 2022-08-31 2025-02-01 財團法人工業技術研究院 模塑電子裝置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3787381A1 (en) * 2019-08-30 2021-03-03 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Electronic device with multilayer laminate
DE102019127108A1 (de) * 2019-10-09 2021-04-15 Leonhard Kurz Stiftung & Co. Kg Verfahren und Vorrichtung zur Herstellung eines Kunststoffbauteils sowie ein Kunststoffbauteil
FI130084B (en) * 2019-12-13 2023-01-31 Canatu Oy MOLDABLE FILM AND METHOD FOR MANUFACTURE OF MOLDABLE FILM
KR102680894B1 (ko) * 2021-08-18 2024-07-04 한국성전(주) 입체가공형 터치패드 및 그 형성방법
TWI789171B (zh) * 2021-12-21 2023-01-01 財團法人工業技術研究院 電子裝置
TWI872486B (zh) * 2022-03-23 2025-02-11 美商阿爾發金屬化工公司 可成形及可撓性觸覺材料及結構
WO2023208262A1 (de) * 2022-04-26 2023-11-02 Gentherm Gmbh Dreidimensional konturiertes funktionselement mit flachigem elektrischen leiter und verfahren zur herstellung dasselbe
CN115406341B (zh) * 2022-08-30 2025-04-15 中国核动力研究设计院 一种电涡流位移传感器可靠性分析方法及系统
EP4642173A4 (en) * 2023-01-27 2026-04-22 Samsung Electronics Co Ltd PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING IT
EP4472362A1 (en) * 2023-05-30 2024-12-04 Fundació Eurecat Manufacturing method of an electronic device comprising a non-flat laminar item with a non-flat electronic circuit thereon

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3982895B2 (ja) * 1997-04-09 2007-09-26 三井化学株式会社 金属ベース半導体回路基板
JP2004356144A (ja) * 2003-05-27 2004-12-16 Fujikura Ltd 部品実装フレキシブル回路基板
GB2412247B (en) * 2004-03-16 2007-08-22 In2Tec Ltd Contoured circuit boards
JP5195422B2 (ja) * 2006-03-31 2013-05-08 日本電気株式会社 配線基板、実装基板及び電子装置
JP5743037B2 (ja) * 2013-03-26 2015-07-01 株式会社村田製作所 樹脂多層基板および電子機器
WO2015101494A1 (en) * 2014-01-02 2015-07-09 Koninklijke Philips N.V. Method for manufacturing a non-planar printed circuit board assembly
JP6574576B2 (ja) * 2015-02-02 2019-09-11 株式会社フジクラ 伸縮性配線基板
JP6340378B2 (ja) * 2015-05-11 2018-06-06 富士フイルム株式会社 導電性積層体の製造方法、導電性積層体、タッチセンサー
WO2017167875A1 (en) * 2016-03-30 2017-10-05 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Laminated component carrier with a thermoplastic structure
JP6544488B2 (ja) * 2016-06-22 2019-07-17 株式会社村田製作所 インダクタブリッジおよび電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI871659B (zh) * 2022-08-31 2025-02-01 財團法人工業技術研究院 模塑電子裝置

Also Published As

Publication number Publication date
US20210368627A1 (en) 2021-11-25
EP3528602A1 (en) 2019-08-21
JP2021514114A (ja) 2021-06-03
US11310915B2 (en) 2022-04-19
WO2019160417A1 (en) 2019-08-22
CN111727667A (zh) 2020-09-29
JP7232837B2 (ja) 2023-03-03
EP3756426B1 (en) 2022-04-27
CN111727667B (zh) 2022-08-19
EP3756426A1 (en) 2020-12-30

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