CN111727667B - 热成形具有表面曲率的电子装置的技术 - Google Patents

热成形具有表面曲率的电子装置的技术 Download PDF

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Publication number
CN111727667B
CN111727667B CN201980013747.1A CN201980013747A CN111727667B CN 111727667 B CN111727667 B CN 111727667B CN 201980013747 A CN201980013747 A CN 201980013747A CN 111727667 B CN111727667 B CN 111727667B
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China
Prior art keywords
support
circuit
pattern
substrate
islands
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CN201980013747.1A
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English (en)
Chinese (zh)
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CN111727667A (zh
Inventor
艾德斯格尔·康斯坦·彼得·斯米茨
简-埃里克·杰克·马丁·鲁宾厄
马尔科·鲍林
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Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201980013747.1A 2018-02-19 2019-02-18 热成形具有表面曲率的电子装置的技术 Active CN111727667B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18157378.3A EP3528602A1 (en) 2018-02-19 2018-02-19 Thermoforming an electronic device with surface curvature
EP18157378.3 2018-02-19
PCT/NL2019/050104 WO2019160417A1 (en) 2018-02-19 2019-02-18 Thermoforming an electronic device with surface curvature

Publications (2)

Publication Number Publication Date
CN111727667A CN111727667A (zh) 2020-09-29
CN111727667B true CN111727667B (zh) 2022-08-19

Family

ID=61258143

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980013747.1A Active CN111727667B (zh) 2018-02-19 2019-02-18 热成形具有表面曲率的电子装置的技术

Country Status (6)

Country Link
US (1) US11310915B2 (https=)
EP (2) EP3528602A1 (https=)
JP (1) JP7232837B2 (https=)
CN (1) CN111727667B (https=)
TW (1) TW201936034A (https=)
WO (1) WO2019160417A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3787381A1 (en) * 2019-08-30 2021-03-03 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Electronic device with multilayer laminate
DE102019127108A1 (de) * 2019-10-09 2021-04-15 Leonhard Kurz Stiftung & Co. Kg Verfahren und Vorrichtung zur Herstellung eines Kunststoffbauteils sowie ein Kunststoffbauteil
FI130084B (en) * 2019-12-13 2023-01-31 Canatu Oy MOLDABLE FILM AND METHOD FOR MANUFACTURE OF MOLDABLE FILM
KR102680894B1 (ko) * 2021-08-18 2024-07-04 한국성전(주) 입체가공형 터치패드 및 그 형성방법
TWI789171B (zh) * 2021-12-21 2023-01-01 財團法人工業技術研究院 電子裝置
TWI872486B (zh) * 2022-03-23 2025-02-11 美商阿爾發金屬化工公司 可成形及可撓性觸覺材料及結構
WO2023208262A1 (de) * 2022-04-26 2023-11-02 Gentherm Gmbh Dreidimensional konturiertes funktionselement mit flachigem elektrischen leiter und verfahren zur herstellung dasselbe
CN115406341B (zh) * 2022-08-30 2025-04-15 中国核动力研究设计院 一种电涡流位移传感器可靠性分析方法及系统
TWI871659B (zh) * 2022-08-31 2025-02-01 財團法人工業技術研究院 模塑電子裝置
EP4642173A4 (en) * 2023-01-27 2026-04-22 Samsung Electronics Co Ltd PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING IT
EP4472362A1 (en) * 2023-05-30 2024-12-04 Fundació Eurecat Manufacturing method of an electronic device comprising a non-flat laminar item with a non-flat electronic circuit thereon

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW419796B (en) * 1997-04-09 2001-01-21 Mitsui Chemicals Inc Metal-based semiconductor circuit substrates
JP2004356144A (ja) * 2003-05-27 2004-12-16 Fujikura Ltd 部品実装フレキシブル回路基板
CN105027687A (zh) * 2014-01-02 2015-11-04 皇家飞利浦有限公司 用于制造非平面印刷电路板组件的方法
WO2017167875A1 (en) * 2016-03-30 2017-10-05 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Laminated component carrier with a thermoplastic structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2412247B (en) * 2004-03-16 2007-08-22 In2Tec Ltd Contoured circuit boards
JP5195422B2 (ja) * 2006-03-31 2013-05-08 日本電気株式会社 配線基板、実装基板及び電子装置
JP5743037B2 (ja) * 2013-03-26 2015-07-01 株式会社村田製作所 樹脂多層基板および電子機器
JP6574576B2 (ja) * 2015-02-02 2019-09-11 株式会社フジクラ 伸縮性配線基板
JP6340378B2 (ja) * 2015-05-11 2018-06-06 富士フイルム株式会社 導電性積層体の製造方法、導電性積層体、タッチセンサー
JP6544488B2 (ja) * 2016-06-22 2019-07-17 株式会社村田製作所 インダクタブリッジおよび電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW419796B (en) * 1997-04-09 2001-01-21 Mitsui Chemicals Inc Metal-based semiconductor circuit substrates
JP2004356144A (ja) * 2003-05-27 2004-12-16 Fujikura Ltd 部品実装フレキシブル回路基板
CN105027687A (zh) * 2014-01-02 2015-11-04 皇家飞利浦有限公司 用于制造非平面印刷电路板组件的方法
WO2017167875A1 (en) * 2016-03-30 2017-10-05 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Laminated component carrier with a thermoplastic structure

Also Published As

Publication number Publication date
US20210368627A1 (en) 2021-11-25
EP3528602A1 (en) 2019-08-21
JP2021514114A (ja) 2021-06-03
US11310915B2 (en) 2022-04-19
WO2019160417A1 (en) 2019-08-22
CN111727667A (zh) 2020-09-29
JP7232837B2 (ja) 2023-03-03
EP3756426B1 (en) 2022-04-27
TW201936034A (zh) 2019-09-01
EP3756426A1 (en) 2020-12-30

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