JP7232280B2 - 電子部品製造用キットとその利用 - Google Patents

電子部品製造用キットとその利用 Download PDF

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Publication number
JP7232280B2
JP7232280B2 JP2021051086A JP2021051086A JP7232280B2 JP 7232280 B2 JP7232280 B2 JP 7232280B2 JP 2021051086 A JP2021051086 A JP 2021051086A JP 2021051086 A JP2021051086 A JP 2021051086A JP 7232280 B2 JP7232280 B2 JP 7232280B2
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JP
Japan
Prior art keywords
mass
glass
photosensitive
paste
conductive
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Application number
JP2021051086A
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English (en)
Japanese (ja)
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JP2022149102A (ja
Inventor
佑一朗 佐合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Original Assignee
Noritake Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Priority to JP2021051086A priority Critical patent/JP7232280B2/ja
Priority to TW111110169A priority patent/TWI922632B/zh
Priority to KR1020220036843A priority patent/KR20220133808A/ko
Priority to CN202210305888.4A priority patent/CN115128902A/zh
Priority to JP2022154472A priority patent/JP7627250B2/ja
Publication of JP2022149102A publication Critical patent/JP2022149102A/ja
Application granted granted Critical
Publication of JP7232280B2 publication Critical patent/JP7232280B2/ja
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Non-Insulated Conductors (AREA)
JP2021051086A 2021-03-25 2021-03-25 電子部品製造用キットとその利用 Active JP7232280B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021051086A JP7232280B2 (ja) 2021-03-25 2021-03-25 電子部品製造用キットとその利用
TW111110169A TWI922632B (zh) 2021-03-25 2022-03-18 電子部件製造用成套材料、包括玻璃固化膜及導電固化膜的複合體、包括玻璃層及導電層的複合體及電子部件的製造方法
KR1020220036843A KR20220133808A (ko) 2021-03-25 2022-03-24 전자 부품 제조용 키트와 그 이용
CN202210305888.4A CN115128902A (zh) 2021-03-25 2022-03-25 电子部件制造用成套材料和其应用
JP2022154472A JP7627250B2 (ja) 2021-03-25 2022-09-28 電子部品製造用キットとその利用

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021051086A JP7232280B2 (ja) 2021-03-25 2021-03-25 電子部品製造用キットとその利用

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022154472A Division JP7627250B2 (ja) 2021-03-25 2022-09-28 電子部品製造用キットとその利用

Publications (2)

Publication Number Publication Date
JP2022149102A JP2022149102A (ja) 2022-10-06
JP7232280B2 true JP7232280B2 (ja) 2023-03-02

Family

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JP2021051086A Active JP7232280B2 (ja) 2021-03-25 2021-03-25 電子部品製造用キットとその利用
JP2022154472A Active JP7627250B2 (ja) 2021-03-25 2022-09-28 電子部品製造用キットとその利用

Family Applications After (1)

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JP2022154472A Active JP7627250B2 (ja) 2021-03-25 2022-09-28 電子部品製造用キットとその利用

Country Status (3)

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JP (2) JP7232280B2 (https=)
KR (1) KR20220133808A (https=)
CN (1) CN115128902A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102940935B1 (ko) 2024-02-15 2026-03-17 이화여자대학교 산학협력단 고인지예비능 생체표지자로서의 snp 및 이의 이용

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003122017A (ja) 2001-10-19 2003-04-25 Murata Mfg Co Ltd 感光性ペースト、それを用いた回路基板およびセラミック多層基板の製造方法
JP2006285226A (ja) 2005-03-10 2006-10-19 Toray Ind Inc 感光性セラミックス組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165048A (ja) 1998-11-26 2000-06-16 Kyocera Corp 積層回路基板及びその製造方法
JP3674501B2 (ja) 2000-11-30 2005-07-20 株式会社村田製作所 感光性銅ペースト、銅パターンの形成方法、及びセラミック多層基板の製造方法
WO2008093669A1 (ja) 2007-01-30 2008-08-07 Murata Manufacturing Co., Ltd. 感光性ガラスペーストおよび多層配線チップ部品
JP6694099B1 (ja) 2019-07-10 2020-05-13 株式会社ノリタケカンパニーリミテド 感光性組成物の製造方法、ペースト状の感光性組成物、電子部品の製造方法および電子部品、ならびに感光性組成物中の有機成分の配合比決定装置、コンピュータプログラム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003122017A (ja) 2001-10-19 2003-04-25 Murata Mfg Co Ltd 感光性ペースト、それを用いた回路基板およびセラミック多層基板の製造方法
JP2006285226A (ja) 2005-03-10 2006-10-19 Toray Ind Inc 感光性セラミックス組成物

Also Published As

Publication number Publication date
TW202239727A (zh) 2022-10-16
KR20220133808A (ko) 2022-10-05
JP7627250B2 (ja) 2025-02-05
JP2022186715A (ja) 2022-12-15
CN115128902A (zh) 2022-09-30
JP2022149102A (ja) 2022-10-06

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