JP7215599B2 - 半導体装置および半導体装置の製造方法 - Google Patents
半導体装置および半導体装置の製造方法 Download PDFInfo
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- JP7215599B2 JP7215599B2 JP2021565541A JP2021565541A JP7215599B2 JP 7215599 B2 JP7215599 B2 JP 7215599B2 JP 2021565541 A JP2021565541 A JP 2021565541A JP 2021565541 A JP2021565541 A JP 2021565541A JP 7215599 B2 JP7215599 B2 JP 7215599B2
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- 239000004065 semiconductor Substances 0.000 title claims description 496
- 238000004519 manufacturing process Methods 0.000 title claims description 75
- 238000000034 method Methods 0.000 title claims description 70
- 239000000758 substrate Substances 0.000 claims description 385
- 239000000126 substance Substances 0.000 claims description 333
- 229910052760 oxygen Inorganic materials 0.000 claims description 329
- 239000001301 oxygen Substances 0.000 claims description 329
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 328
- 239000000386 donor Substances 0.000 claims description 204
- 229910052739 hydrogen Inorganic materials 0.000 claims description 201
- 239000001257 hydrogen Substances 0.000 claims description 201
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 188
- 229910052799 carbon Inorganic materials 0.000 claims description 188
- 239000002245 particle Substances 0.000 claims description 147
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 139
- 239000000852 hydrogen donor Substances 0.000 claims description 117
- 238000002347 injection Methods 0.000 claims description 117
- 239000007924 injection Substances 0.000 claims description 117
- 238000009826 distribution Methods 0.000 claims description 96
- 238000010438 heat treatment Methods 0.000 claims description 91
- -1 hydrogen ions Chemical class 0.000 claims description 77
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 claims description 62
- 238000002513 implantation Methods 0.000 claims description 49
- 229910052734 helium Inorganic materials 0.000 claims description 31
- 239000001307 helium Substances 0.000 claims description 31
- 239000012535 impurity Substances 0.000 claims description 16
- 238000005468 ion implantation Methods 0.000 claims description 16
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 11
- 230000007547 defect Effects 0.000 description 87
- 150000002500 ions Chemical class 0.000 description 65
- 238000010586 diagram Methods 0.000 description 63
- 125000004429 atom Chemical group 0.000 description 51
- 239000000370 acceptor Substances 0.000 description 28
- 238000005259 measurement Methods 0.000 description 23
- 230000007423 decrease Effects 0.000 description 22
- 239000011229 interlayer Substances 0.000 description 18
- 230000008569 process Effects 0.000 description 18
- 230000015556 catabolic process Effects 0.000 description 17
- 230000002093 peripheral effect Effects 0.000 description 16
- 238000009825 accumulation Methods 0.000 description 15
- 230000006870 function Effects 0.000 description 14
- 238000004364 calculation method Methods 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 10
- 239000002019 doping agent Substances 0.000 description 10
- 229910052698 phosphorus Inorganic materials 0.000 description 10
- 239000011574 phosphorus Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 230000003247 decreasing effect Effects 0.000 description 8
- 150000002431 hydrogen Chemical class 0.000 description 8
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 229920005591 polysilicon Polymers 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- 238000004566 IR spectroscopy Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001739 density measurement Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012886 linear function Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- KPSZQYZCNSCYGG-UHFFFAOYSA-N [B].[B] Chemical compound [B].[B] KPSZQYZCNSCYGG-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910021476 group 6 element Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
-
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
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- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
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- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
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- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
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- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
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- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823418—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
- H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
- H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/30—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
- H01L29/32—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being within the semiconductor body
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/6609—Diodes
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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Description
特許文献1 米国特許出願公開第2018/0019306号明細書
NVOH1=NV+ξCOX+ηCCであり、
0.1≦NVOH1/NVOH2≦10であってよい。
NF=NB0+NVOH ・・・式(1)
ここで、VOH欠陥濃度NVOHは、水素で終端された空孔の濃度と、寄与酸素濃度NOX(すなわちξCOX)との和であるとする。平坦部150においては、VOH欠陥の濃度は水素で終端された空孔濃度と寄与酸素濃度に律速するためである。なお、本例では水素化学濃度CHが十分高いので、深さ位置Z1から深さ位置Z2までの実質的に(ほぼ)全ての空孔が、水素で終端されている。つまり、空孔濃度は水素で終端された空孔濃度NVであるとしてよい。従って、式(2)が得られる。
NVOH=NV+ξCOX ・・・式(2)
式(1)および式(2)から、式(3)が得られる。
NF=NB0+NV+ξCOX ・・・式(3)
NF1=NB0+NV+ξCOX1 ・・・式(4)
NF2=NB0+NV+ξCOX2 ・・・式(5)
ここで、NF2>NF1とする。
NF2-NF1=ΔNVOH
=ξ(COX2-COX1)
ξ=ΔNVOH/(COX2-COX1) ・・・式(6)
NV=NVOH-ξCOX
=NVOH-(ΔNVOH/(COX2-COX1))COX ・・・式(7)
式(7)から、酸素寄与率ξが与えられれば、任意のVOH欠陥濃度NVOHおよび酸素化学濃度COXに対して、空孔濃度NVを算出できる。
NVOH=a×COX+b ・・・式(8)
このとき、最小二乗法のフィッティングにより、各直線の傾きaおよび切片bは下記の通りである。
直線601:a=2.96303×10-4、b=2.18399×1013
直線602:a=1.87895×10-4、b=1.47920×1013
直線603:a=7.58824×10-5、b=6.38380×1012
なお、式(2)と式(8)を比べると、a=ξ、b=NVである。
ξ=c×(DH)d ・・・式(9)
ただし、c=3.11503×10-12、d=5.94169×10-1
NV=e×(DH)f ・・・式(10)
ただし、e=1.36398×106、f=5.36782×10-1
ξ=c×(DH)d ・・・式(11)
ただし、c=1.53343×10-12、d=6.25800×10-1
NV=e×(DH)f ・・・式(12)
ただし、e=3.11098×103、f=7.41056×10-1
NVOH=c×(DH)d+e×(DH)f×COX ・・・式(13)
また、式(1)から式(13)は式(14)となる。
NF-NB0=c×(DH)d+e×(DH)f×COX ・・・式(14)
NVOH1=7×1012+1.2×10-4×2×1017=3.1×1013(atoms/cm3)
NVOH2=7×1013-2×1012=6.8×1013(atoms/cm3)
算出したNVOH1が、実測値のNVOH2に十分一致していれば、算出した酸素寄与率ξ1および空孔濃度NV1が概ね正しいと判定できる。すなわち、水素ドナー濃度の第2の値NVOH2に対する、水素ドナー濃度の第1の値NVOH1の比NVOH1/NVOH2が、0.1≦NVOH1/NVOH2≦10であれば、十分一致しているとしてよい。上記の例の場合、NVOH1/NVOH2=(3.1×1013 )/(6.8×1013 )≒0.46であり、算出した酸素寄与率ξ1および空孔濃度NV1は正しい。
NVOH=NV+ξCOX+ηCC ・・・式(2a)
式(2a)のVOH欠陥濃度NVOHは、式(2)で説明したVOH欠陥濃度NVOHに、炭素化学濃度CCと炭素寄与率ηの積を加算している。つまり、炭素が存在することにより増加する水素ドナー濃度を、式(2)のVOH欠陥濃度NVOHに加算している。なお、炭素が寄与して生成される水素ドナーはVOH欠陥に限定されないが、式(2a)では、炭素が存在することにより増加する水素ドナー濃度を、VOH欠陥濃度NVOHに含めている。
NVOH=a×CC+b ・・・式(8a)
このとき、最小二乗法のフィッティングにより算出した各直線の傾きaおよび切片bは下記の通りである。
直線611:a=5.00851×10-2、b=6.46656×1013
直線612:a=2.35891×10-2、b=4.14509×1013
直線613:a=7.13212×10-3、b=2.26076×1013
直線631:a=3.64419×10-4、b=4.15739×1013
直線641:a=2.80673×10-4、b=4.15739×1013
直線632:a=2.04534×10-4、b=2.21483×1013
直線642:a=1.67965×10-4、b=2.21483×1013
直線633:a=8.60908×10-5、b=8.32518×1013
直線643:a=8.05915×10-5、b=8.32518×1013
水素イオンのドーズ量が等しい場合、切片である空孔濃度NVは実質的に(ほぼ)同じ値である。酸素の場合と同様に、炭素化学濃度が0に近づくと空孔濃度NVは一定値に収束すると考えるのが自然である。
NVOH=NV+αξCOX ・・・式(2b)
式(2a)と式(2b)を比較すると、式(15)が得られる。
ξCOX+ηCC=αξCOX
η=(α-1)(COX/CC)ξ ・・・式(15)
η=g×(DH)h ・・・式(15)
曲線811:g=2.57839×10-13、h=7.95528×10-1
曲線812:g=1.35314×10-21、h=1.38598
曲線813:g=3.49381×10-31、h=2.07102
NVOH=c×(DH)d+e×(DH)f×COX+g×(DH)h×CC ・・・式(13a)
また、式(1)から式(13a)は式(14a)となる。
NF-NB0=c×(DH)d+e×(DH)f×COX+g×(DH)h×CC ・・・式(14a)
NVOH1=NV+ξCOX+ηCC ・・・式(16)
上述したように、空孔濃度NV、酸素化学濃度COX、炭素化学濃度CC、酸素寄与率ξ、炭素寄与率ηは、半導体基板10を測定することで取得できる。また、実際に生成された水素ドナーの濃度NVOH2は、上述した製造方法による処理前の半導体基板10のドナー濃度NB0と、処理後の半導体基板10のドーピング濃度NFの差分から取得できる。当該ドナー濃度の差分は、平坦部150で測定してよい。半導体基板10のドナー濃度NB0は、SIMSまたはSRの測定で得られる。SIMSならば、処理後の半導体基板10からも半導体基板10のドナー濃度NB0を得ることができる。
深さ位置Z1が120μm、水素イオンドーズ量DHが5×1012ions/cm2の例を考える。また、酸素化学濃度COXは4.0×1017atoms/cm3、炭素化学濃度CCは2.0×1015atoms/cm3であり、最終ドーピング濃度NFは7×1013/cm3であり、バルク・ドナー濃度NB0は2×1012/cm3である。
NVOH1=6.0×1012+1.1×10-4×4.0×10172.1×10-4×2.0×1015=5.04×1013/cm3
また、NVOH2は下式のように計算できる。
NVOH2=NF-NB0=7×1013-2×1012=6.8×1013/cm3
したがって、NVOH1/NVOH2は下式のように計算できる。
NVOH1/NVOH2=5.04×1013/6.8×1013=0.74
上述した0.1≦NVOH1/NVOH2≦10の範囲内であるので、実施例1では、NVOH1とNVOH2とが、十分一致していると判定できる。
深さ位置Z1が23μm、水素イオンドーズ量DHが3×1012ions/cm2の例を考える。また、酸素化学濃度COXは1.5×1017atoms/cm3、炭素化学濃度CCは5.1×1014atoms/cm3であり、最終ドーピング濃度NFは1.4×1014/cm3であり、バルク・ドナー濃度NB0は7.4×1013/cm3である。
したがって、NVOH1/NVOH2は下式のように計算できる。
NVOH1/NVOH2=3.0×1013/6.6×1013=0.45
上述した0.1≦NVOH1/NVOH2≦10の範囲内であるので、実施例2では、NVOH1とNVOH2とが、十分一致していると判定できる。
NVOH=c×(DHe)d+e×(DHe)f×COX+g×(DHe)h×CC ・・・式(13b)
当該パラメータは、複数種類の深さ位置Z1について取得してよい。
F=Nv´+ξ´COX+η´CC
=c×(DHe)d+e×(DHe)f×COX+g×(DHe)h×CC… 式(15)
右辺の第一項は、ヘリウムイオン注入および熱処理によって形成された空孔濃度Nvに、電気特性Fに換算する係数をかけたNv´である。第二項のCoxの係数部分は、目標特性Fに対する酸素寄与率ξ´であり、上述の酸素寄与率ξに電気特性Fに換算する係数をかけた量である。第三項のCcの係数部分は、目標特性Fに対する炭素寄与率η´であり、上述の炭素寄与率ηに電気特性Fに換算する係数をかけた量である。式(15)は、あらかじめ、ヘリウムイオンの深さが2~3種類またはそれ以上について、図33A、図33B、図33Cの少なくとも一つのグラフを作成し、求めておく。すなわち、パラメータc、d、e、f、g、hは、実験的に予め取得できる。従って、式(15)の変数は、ヘリウムイオンの注入量のみであり、式(15)の右辺は当該注入量に対して変化しない定数となる。
VB=c×(DHe)d+e×(DHe)f×COX+g×(DHe)h×CC
VCE=c×(DHe)d+e×(DHe)f×COX+g×(DHe)h×CC
toff=c×(DHe)d+e×(DHe)f×COX+g×(DHe)h×CC
VF=c×(DHe)d+e×(DHe)f×COX+g×(DHe)h×CC
trr=c×(DHe)d+e×(DHe)f×COX+g×(DHe)h×CC
これらの式において、パラメータc~hは、目標特性に応じて異なる値となる。パラメータc~hの単位は、目標特性の単位、ヘリウムイオンのドーズ量の単位、酸素化学濃度の単位、炭素化学濃度の単位と整合のとれる単位であってよい。
Claims (29)
- 上面および下面を有し、酸素を含む半導体基板と、
前記半導体基板の前記下面側に配置された、水素化学濃度の第1のピークと、
前記第1のピークよりも前記半導体基板の前記上面側に配置され、水素ドナーを含み、前記半導体基板の深さ方向におけるドナー濃度分布が実質的に平坦な平坦部と
を備え、
前記酸素の酸素化学濃度のうち前記水素ドナーを生成するのに寄与する前記酸素化学濃度の割合を示す酸素寄与率が、1×10-5以上、7×10-4以下であり、
前記平坦部において、前記水素ドナーを生成するのに寄与する前記酸素の濃度が、前記水素化学濃度より低く、
前記平坦部における水素ドナー濃度が、2×1012/cm3以上、5×1014/cm3以下である
半導体装置。 - 前記半導体基板は、バルク・ドナーを含み、
前記平坦部のドナー濃度が、バルク・ドナー濃度よりも高い
請求項1に記載の半導体装置。 - 前記平坦部における酸素化学濃度に前記酸素寄与率を乗じた値と、前記平坦部の空孔濃度との和を前記水素ドナー濃度の第1の値とし、
前記平坦部のドナー濃度から、前記バルク・ドナー濃度を減じた差を前記水素ドナー濃度の第2の値とし、
前記水素ドナー濃度の第2の値に対する前記水素ドナー濃度の第1の値の比が、0.1以上10以下である
請求項2に記載の半導体装置。 - 上面および下面を有し、酸素を含む半導体基板と、
前記半導体基板の前記下面側に配置された、水素化学濃度の第1のピークと、
前記第1のピークよりも前記半導体基板の前記上面側に配置され、水素ドナーを含み、前記半導体基板の深さ方向におけるドナー濃度分布が実質的に平坦な平坦部と
を備え、
前記半導体基板は、バルク・ドナーを含み、
前記平坦部のドナー濃度が、バルク・ドナー濃度よりも高く、
前記酸素の酸素化学濃度のうち前記水素ドナーを生成するのに寄与する前記酸素化学濃度の割合を示す酸素寄与率を前記平坦部における酸素化学濃度に乗じた値と、前記平坦部の空孔濃度との和を水素ドナー濃度の第1の値とし、
前記平坦部のドナー濃度から、前記バルク・ドナー濃度を減じた差を前記水素ドナー濃度の第2の値とし、
前記水素ドナー濃度の第2の値に対する前記水素ドナー濃度の第1の値の比が、0.1以上10以下である
半導体装置。 - 上面および下面を有し、酸素および炭素を含む半導体基板と、
前記半導体基板の前記下面側に配置された、水素化学濃度の第1のピークと、
前記第1のピークよりも前記半導体基板の前記上面側に配置され、水素ドナーを含み、前記半導体基板の深さ方向におけるドナー濃度分布が実質的に平坦な平坦部と
を備え、
前記半導体基板は、バルク・ドナーを含み、
前記平坦部のドナー濃度が、バルク・ドナー濃度よりも高く、
前記酸素の酸素化学濃度のうち前記水素ドナーを生成するのに寄与する前記酸素化学濃度の割合を示す酸素寄与率を前記平坦部における酸素化学濃度に乗じた値と、前記炭素の炭素化学濃度のうち前記水素ドナーを生成するのに寄与する前記炭素化学濃度の割合を示す炭素寄与率を前記平坦部における炭素化学濃度に乗じた値と、前記平坦部の空孔濃度との和を水素ドナー濃度の第3の値とし、
前記平坦部のドナー濃度から、前記バルク・ドナー濃度を減じた差を前記水素ドナー濃度の第2の値とし、
前記水素ドナー濃度の第2の値に対する前記水素ドナー濃度の第3の値の比が、0.1以上10以下である
半導体装置。 - 前記半導体基板の前記上面側に配置された、水素またはヘリウムの化学濃度の第2のピークを更に備え、
前記平坦部は、前記第2のピークよりも前記半導体基板の前記下面側に配置されている
請求項1から5のいずれか一項に記載の半導体装置。 - 前記水素化学濃度のうち前記水素ドナーを生成するのに寄与する前記水素化学濃度の割合を示す水素寄与率が、0.001以上、0.3以下である
請求項1から6のいずれか一項に記載の半導体装置。 - 前記平坦部の空孔濃度が、1×1011/cm3以上、1×1014/cm3以下である
請求項1から7のいずれか一項に記載の半導体装置。 - 前記酸素寄与率が、5×10-4以下である
請求項1から8のいずれか一項に記載の半導体装置。 - 前記酸素寄与率が、1×10-4以上である
請求項1から9のいずれか一項に記載の半導体装置。 - 前記第1のピークの前記水素化学濃度は、前記第2のピークの前記水素化学濃度よりも高い
請求項6に記載の半導体装置。 - 前記平坦部における酸素化学濃度が、1×1017atoms/cm3以上である
請求項1から11のいずれか一項に記載の半導体装置。 - 前記平坦部における炭素化学濃度が、1×1013atoms/cm3以上、1×1016atoms/cm3以下である
請求項1から12のいずれか一項に記載の半導体装置。 - 上面および下面を有する半導体基板の酸素化学濃度を測定する濃度測定段階と、
前記半導体基板の前記下面から、前記半導体基板の深さ方向の厚みの半分以上を通過するように、荷電粒子線を注入する粒子注入段階と、
前記荷電粒子線を注入した後に、前記半導体基板を熱処理する熱処理段階と
を備え、
前記粒子注入段階における前記荷電粒子線の注入条件、および、前記熱処理段階における熱処理条件の少なくとも一方を、前記酸素化学濃度に応じて調整する
半導体装置の製造方法。 - 前記濃度測定段階において、前記半導体基板の炭素化学濃度を更に測定し、
前記粒子注入段階において、前記酸素化学濃度および前記炭素化学濃度に応じて前記荷電粒子線の前記注入条件を調整する
請求項14に記載の半導体装置の製造方法。 - 前記半導体基板の予め定められた深さ位置において、前記製造方法によって生成すべき水素ドナーの濃度をNVOH1、実際に生成された前記水素ドナーの濃度をNVOH2、前記粒子注入段階によって形成される空孔濃度をNV、酸素化学濃度をCOX、炭素化学濃度をCC、前記酸素化学濃度のうち前記水素ドナーを生成するのに寄与する前記酸素化学濃度の割合を示す酸素寄与率をξ、前記炭素化学濃度のうち前記水素ドナーを生成するのに寄与する前記炭素化学濃度の割合を示す炭素寄与率をηとして、
NVOH1=NV+ξCOX+ηCCであり、
0.1≦NVOH1/NVOH2≦10である
請求項15に記載の半導体装置の製造方法。 - 前記粒子注入段階において、前記荷電粒子線として水素イオンを注入する
請求項14から16のいずれか一項に記載の半導体装置の製造方法。 - 前記熱処理段階よりも前に、前記半導体基板の下面側に水素イオンを注入する水素注入段階を更に備える
請求項14から17のいずれか一項に記載の半導体装置の製造方法。 - 前記半導体基板の前記酸素化学濃度に基づいて、前記水素注入段階における前記水素イオンの注入条件を調整する
請求項18に記載の半導体装置の製造方法。 - 前記粒子注入段階における前記荷電粒子線の注入深さに基づいて、前記水素注入段階における前記水素イオンの注入条件、および、前記熱処理段階における前記熱処理条件を調整する
請求項18または19に記載の半導体装置の製造方法。 - 前記半導体基板に酸素を導入する酸素導入段階を更に備える
請求項14から20のいずれか一項に記載の半導体装置の製造方法。 - 前記半導体基板のバルク・ドナー濃度に更に基づいて、前記粒子注入段階における前記荷電粒子線の前記注入条件、および、前記熱処理段階における前記熱処理条件の少なくとも一方を調整する
請求項14から21のいずれか一項に記載の半導体装置の製造方法。 - 前記半導体基板を研削する研削段階と、
研削後の前記半導体基板の厚みを測定する基板厚測定段階と
を更に備え、
前記半導体基板の厚みに更に基づいて、前記粒子注入段階における前記荷電粒子線の前記注入条件、および、前記熱処理段階における前記熱処理条件の少なくとも一方を調整する
請求項14から22のいずれか一項に記載の半導体装置の製造方法。 - 前記粒子注入段階において、複数の前記半導体基板に対して、それぞれの前記半導体基板毎に前記注入条件を調整し、
前記熱処理段階において、前記複数の半導体基板に対して共通に前記熱処理条件を調整する
請求項14から23のいずれか一項に記載の半導体装置の製造方法。 - 前記半導体基板を研削する研削段階と、
研削後の前記半導体基板の厚みを測定する基板厚測定段階と
を更に備え、
前記半導体基板の厚みに基づいて、前記水素注入段階における前記水素イオンの注入条件を調整する
請求項18に記載の半導体装置の製造方法。 - 前記基板厚測定段階において、前記半導体基板のエッジ終端構造部における前記半導体基板の厚みを測定する
請求項23または25に記載の半導体装置の製造方法。 - 前記粒子注入段階において、前記酸素化学濃度のうち水素ドナーを生成するのに寄与する前記酸素化学濃度の割合を示す酸素寄与率ξ、および、前記半導体基板の炭素化学濃度のうち前記水素ドナーを生成するのに寄与する前記炭素化学濃度の割合を示す炭素寄与率ηの少なくとも一つに更に基づいて、前記荷電粒子線の前記注入条件を調整する
請求項14から26のいずれか一項に記載の半導体装置の製造方法。 - 上面および下面を有する半導体基板の不純物濃度を取得する濃度取得段階と、
前記半導体基板の前記下面から、前記半導体基板の深さ方向の厚みの半分以上を通過するように、荷電粒子線を注入する粒子注入段階と、
前記荷電粒子線を注入した後に、前記半導体基板を熱処理する熱処理段階と
を備え、
前記粒子注入段階において、前記不純物濃度に応じて前記荷電粒子線の注入深さを調整する
半導体装置の製造方法。 - 前記濃度取得段階において、前記半導体基板のバルク・ドナー濃度、酸素化学濃度および炭素化学濃度の少なくとも一つを取得する
請求項28に記載の半導体装置の製造方法。
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