JP7208091B2 - 基板処理方法および基板処理装置 - Google Patents

基板処理方法および基板処理装置 Download PDF

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Publication number
JP7208091B2
JP7208091B2 JP2019079465A JP2019079465A JP7208091B2 JP 7208091 B2 JP7208091 B2 JP 7208091B2 JP 2019079465 A JP2019079465 A JP 2019079465A JP 2019079465 A JP2019079465 A JP 2019079465A JP 7208091 B2 JP7208091 B2 JP 7208091B2
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Japan
Prior art keywords
liquid
substrate
film
liquid film
rinse
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Active
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JP2019079465A
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English (en)
Japanese (ja)
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JP2020178046A (ja
Inventor
世 根來
健司 小林
学 奥谷
博史 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2019079465A priority Critical patent/JP7208091B2/ja
Priority to KR1020217033017A priority patent/KR102638814B1/ko
Priority to CN202080028876.0A priority patent/CN113728416A/zh
Priority to PCT/JP2020/015689 priority patent/WO2020213481A1/ja
Priority to TW109112893A priority patent/TWI799695B/zh
Publication of JP2020178046A publication Critical patent/JP2020178046A/ja
Application granted granted Critical
Publication of JP7208091B2 publication Critical patent/JP7208091B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2019079465A 2019-04-18 2019-04-18 基板処理方法および基板処理装置 Active JP7208091B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019079465A JP7208091B2 (ja) 2019-04-18 2019-04-18 基板処理方法および基板処理装置
KR1020217033017A KR102638814B1 (ko) 2019-04-18 2020-04-07 기판 처리 방법 및 기판 처리 장치
CN202080028876.0A CN113728416A (zh) 2019-04-18 2020-04-07 衬底处理方法及衬底处理装置
PCT/JP2020/015689 WO2020213481A1 (ja) 2019-04-18 2020-04-07 基板処理方法および基板処理装置
TW109112893A TWI799695B (zh) 2019-04-18 2020-04-17 基板處理方法以及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019079465A JP7208091B2 (ja) 2019-04-18 2019-04-18 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
JP2020178046A JP2020178046A (ja) 2020-10-29
JP7208091B2 true JP7208091B2 (ja) 2023-01-18

Family

ID=72837785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019079465A Active JP7208091B2 (ja) 2019-04-18 2019-04-18 基板処理方法および基板処理装置

Country Status (5)

Country Link
JP (1) JP7208091B2 (zh)
KR (1) KR102638814B1 (zh)
CN (1) CN113728416A (zh)
TW (1) TWI799695B (zh)
WO (1) WO2020213481A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7301662B2 (ja) 2019-07-29 2023-07-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2022178469A (ja) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050143A (ja) 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2017117954A (ja) 2015-12-24 2017-06-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2018026402A (ja) 2016-08-08 2018-02-15 東京エレクトロン株式会社 液処理方法、基板処理装置及び記憶媒体
US20180144954A1 (en) 2016-11-18 2018-05-24 Applied Materials, Inc. Drying high aspect ratio features

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4767767B2 (ja) * 2006-06-19 2011-09-07 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP4763563B2 (ja) * 2006-09-20 2011-08-31 大日本スクリーン製造株式会社 基板処理方法
JP5043406B2 (ja) 2006-11-21 2012-10-10 大日本スクリーン製造株式会社 基板乾燥方法および基板乾燥装置
JP6521242B2 (ja) * 2015-06-16 2019-05-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6818607B2 (ja) * 2017-03-27 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050143A (ja) 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2017117954A (ja) 2015-12-24 2017-06-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2018026402A (ja) 2016-08-08 2018-02-15 東京エレクトロン株式会社 液処理方法、基板処理装置及び記憶媒体
US20180144954A1 (en) 2016-11-18 2018-05-24 Applied Materials, Inc. Drying high aspect ratio features

Also Published As

Publication number Publication date
TWI799695B (zh) 2023-04-21
TW202102314A (zh) 2021-01-16
CN113728416A (zh) 2021-11-30
KR102638814B1 (ko) 2024-02-20
JP2020178046A (ja) 2020-10-29
WO2020213481A1 (ja) 2020-10-22
KR20210137182A (ko) 2021-11-17

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