JP7170879B2 - 処理装置及び処理方法 - Google Patents

処理装置及び処理方法 Download PDF

Info

Publication number
JP7170879B2
JP7170879B2 JP2021533019A JP2021533019A JP7170879B2 JP 7170879 B2 JP7170879 B2 JP 7170879B2 JP 2021533019 A JP2021533019 A JP 2021533019A JP 2021533019 A JP2021533019 A JP 2021533019A JP 7170879 B2 JP7170879 B2 JP 7170879B2
Authority
JP
Japan
Prior art keywords
wafer
modified layer
processed
eccentricity
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021533019A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021010286A5 (https=
JPWO2021010286A1 (https=
Inventor
弘明 森
陽平 山下
隼斗 田之上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JPWO2021010286A1 publication Critical patent/JPWO2021010286A1/ja
Publication of JPWO2021010286A5 publication Critical patent/JPWO2021010286A5/ja
Application granted granted Critical
Publication of JP7170879B2 publication Critical patent/JP7170879B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021533019A 2019-07-18 2020-07-09 処理装置及び処理方法 Active JP7170879B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019133106 2019-07-18
JP2019133106 2019-07-18
PCT/JP2020/026885 WO2021010286A1 (ja) 2019-07-18 2020-07-09 処理装置及び処理方法

Publications (3)

Publication Number Publication Date
JPWO2021010286A1 JPWO2021010286A1 (https=) 2021-01-21
JPWO2021010286A5 JPWO2021010286A5 (https=) 2022-03-28
JP7170879B2 true JP7170879B2 (ja) 2022-11-14

Family

ID=74210796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021533019A Active JP7170879B2 (ja) 2019-07-18 2020-07-09 処理装置及び処理方法

Country Status (6)

Country Link
US (1) US12397375B2 (https=)
JP (1) JP7170879B2 (https=)
KR (1) KR102847132B1 (https=)
CN (1) CN114096373B (https=)
TW (1) TWI857095B (https=)
WO (1) WO2021010286A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI877184B (zh) * 2019-07-18 2025-03-21 日商東京威力科創股份有限公司 處理裝置及處理方法
US20230234164A1 (en) * 2022-01-27 2023-07-27 Ii-Vi Delaware, Inc. Polycrystalline diamond (pcd) laser lapping machine
CN117182290A (zh) * 2022-06-01 2023-12-08 华为数字能源技术有限公司 激光加工设备、加工方法以及晶圆薄片
JP7843650B2 (ja) * 2022-06-08 2026-04-10 東京エレクトロン株式会社 基板処理装置及び位置調整方法
JP2024042807A (ja) * 2022-09-16 2024-03-29 キオクシア株式会社 レーザー加工装置、レーザー剥離方法および半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053341A (ja) 2006-08-23 2008-03-06 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2010247189A (ja) 2009-04-16 2010-11-04 Shin Etsu Polymer Co Ltd 半導体ウェーハの製造方法及びその装置
JP2014082296A (ja) 2012-10-16 2014-05-08 Disco Abrasive Syst Ltd 加工方法
JP2018043340A (ja) 2016-09-15 2018-03-22 株式会社荏原製作所 基板加工方法および基板加工装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP4732934B2 (ja) * 2006-03-20 2011-07-27 株式会社デンソー レーザダイシング方法
CN102317030B (zh) * 2009-04-07 2014-08-20 浜松光子学株式会社 激光加工装置以及激光加工方法
JP6044919B2 (ja) 2012-02-01 2016-12-14 信越ポリマー株式会社 基板加工方法
JP6523991B2 (ja) * 2015-04-14 2019-06-05 株式会社荏原製作所 基板処理装置および基板処理方法
JP6516184B2 (ja) * 2015-05-19 2019-05-22 パナソニックＩｐマネジメント株式会社 脆性基板のスライス装置及び方法
JP6552898B2 (ja) * 2015-07-13 2019-07-31 株式会社ディスコ 多結晶ＳｉＣウエーハの生成方法
JP6851040B2 (ja) * 2016-03-29 2021-03-31 国立大学法人埼玉大学 基板加工方法および基板加工装置
JP6779486B2 (ja) * 2016-08-16 2020-11-04 国立大学法人埼玉大学 基板加工方法および基板加工装置
JP6817761B2 (ja) * 2016-09-21 2021-01-20 株式会社ディスコ ウエーハの分割方法
JP6844901B2 (ja) * 2017-05-26 2021-03-17 株式会社ディスコ レーザ加工装置及びレーザ加工方法
JP6911277B2 (ja) * 2017-09-22 2021-07-28 株式会社東京精密 レーザー加工装置及びレーザー加工方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053341A (ja) 2006-08-23 2008-03-06 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2010247189A (ja) 2009-04-16 2010-11-04 Shin Etsu Polymer Co Ltd 半導体ウェーハの製造方法及びその装置
JP2014082296A (ja) 2012-10-16 2014-05-08 Disco Abrasive Syst Ltd 加工方法
JP2018043340A (ja) 2016-09-15 2018-03-22 株式会社荏原製作所 基板加工方法および基板加工装置

Also Published As

Publication number Publication date
KR20220034190A (ko) 2022-03-17
TWI857095B (zh) 2024-10-01
KR102847132B1 (ko) 2025-08-18
US20220314373A1 (en) 2022-10-06
CN114096373B (zh) 2023-12-01
US12397375B2 (en) 2025-08-26
WO2021010286A1 (ja) 2021-01-21
TW202106428A (zh) 2021-02-16
JPWO2021010286A1 (https=) 2021-01-21
CN114096373A (zh) 2022-02-25

Similar Documents

Publication Publication Date Title
JP7170879B2 (ja) 処理装置及び処理方法
JP7170880B2 (ja) 処理装置及び処理方法
JP7133715B2 (ja) 処理装置及び処理方法
JP7129558B2 (ja) 処理装置及び処理方法
JP7178491B2 (ja) 処理装置及び処理方法
CN114096372B (zh) 处理装置和处理方法
JP7127208B2 (ja) 処理装置及び処理方法
JP2021019056A (ja) 処理装置及び処理方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220106

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220106

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220802

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220928

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221004

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221101

R150 Certificate of patent or registration of utility model

Ref document number: 7170879

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250