TWI857095B - 處理裝置及處理方法 - Google Patents

處理裝置及處理方法 Download PDF

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Publication number
TWI857095B
TWI857095B TW109122710A TW109122710A TWI857095B TW I857095 B TWI857095 B TW I857095B TW 109122710 A TW109122710 A TW 109122710A TW 109122710 A TW109122710 A TW 109122710A TW I857095 B TWI857095 B TW I857095B
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TW
Taiwan
Prior art keywords
wafer
processing
eccentricity
modified layer
processing object
Prior art date
Application number
TW109122710A
Other languages
English (en)
Chinese (zh)
Other versions
TW202106428A (zh
Inventor
森弘明
山下陽平
田之上隼斗
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW202106428A publication Critical patent/TW202106428A/zh
Application granted granted Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW109122710A 2019-07-18 2020-07-06 處理裝置及處理方法 TWI857095B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-133106 2019-07-18
JP2019133106 2019-07-18

Publications (2)

Publication Number Publication Date
TW202106428A TW202106428A (zh) 2021-02-16
TWI857095B true TWI857095B (zh) 2024-10-01

Family

ID=74210796

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109122710A TWI857095B (zh) 2019-07-18 2020-07-06 處理裝置及處理方法

Country Status (6)

Country Link
US (1) US12397375B2 (https=)
JP (1) JP7170879B2 (https=)
KR (1) KR102847132B1 (https=)
CN (1) CN114096373B (https=)
TW (1) TWI857095B (https=)
WO (1) WO2021010286A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI877184B (zh) * 2019-07-18 2025-03-21 日商東京威力科創股份有限公司 處理裝置及處理方法
US20230234164A1 (en) * 2022-01-27 2023-07-27 Ii-Vi Delaware, Inc. Polycrystalline diamond (pcd) laser lapping machine
CN117182290A (zh) * 2022-06-01 2023-12-08 华为数字能源技术有限公司 激光加工设备、加工方法以及晶圆薄片
JP7843650B2 (ja) * 2022-06-08 2026-04-10 東京エレクトロン株式会社 基板処理装置及び位置調整方法
JP2024042807A (ja) * 2022-09-16 2024-03-29 キオクシア株式会社 レーザー加工装置、レーザー剥離方法および半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106825940A (zh) * 2000-09-13 2017-06-13 浜松光子学株式会社 激光加工方法以及激光加工装置
JP2018043340A (ja) * 2016-09-15 2018-03-22 株式会社荏原製作所 基板加工方法および基板加工装置
TW201900317A (zh) * 2017-05-26 2019-01-01 日商迪思科股份有限公司 雷射加工裝置及雷射加工方法

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* Cited by examiner, † Cited by third party
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JP4732934B2 (ja) * 2006-03-20 2011-07-27 株式会社デンソー レーザダイシング方法
JP5065637B2 (ja) 2006-08-23 2012-11-07 株式会社ディスコ ウエーハの加工方法
CN102317030B (zh) * 2009-04-07 2014-08-20 浜松光子学株式会社 激光加工装置以及激光加工方法
JP5398332B2 (ja) * 2009-04-16 2014-01-29 信越ポリマー株式会社 半導体ウェーハの製造方法及びその装置
JP6044919B2 (ja) 2012-02-01 2016-12-14 信越ポリマー株式会社 基板加工方法
JP6124547B2 (ja) * 2012-10-16 2017-05-10 株式会社ディスコ 加工方法
JP6523991B2 (ja) * 2015-04-14 2019-06-05 株式会社荏原製作所 基板処理装置および基板処理方法
JP6516184B2 (ja) * 2015-05-19 2019-05-22 パナソニックＩｐマネジメント株式会社 脆性基板のスライス装置及び方法
JP6552898B2 (ja) * 2015-07-13 2019-07-31 株式会社ディスコ 多結晶ＳｉＣウエーハの生成方法
JP6851040B2 (ja) * 2016-03-29 2021-03-31 国立大学法人埼玉大学 基板加工方法および基板加工装置
JP6779486B2 (ja) * 2016-08-16 2020-11-04 国立大学法人埼玉大学 基板加工方法および基板加工装置
JP6817761B2 (ja) * 2016-09-21 2021-01-20 株式会社ディスコ ウエーハの分割方法
JP6911277B2 (ja) * 2017-09-22 2021-07-28 株式会社東京精密 レーザー加工装置及びレーザー加工方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106825940A (zh) * 2000-09-13 2017-06-13 浜松光子学株式会社 激光加工方法以及激光加工装置
JP2018043340A (ja) * 2016-09-15 2018-03-22 株式会社荏原製作所 基板加工方法および基板加工装置
TW201900317A (zh) * 2017-05-26 2019-01-01 日商迪思科股份有限公司 雷射加工裝置及雷射加工方法

Also Published As

Publication number Publication date
KR20220034190A (ko) 2022-03-17
KR102847132B1 (ko) 2025-08-18
US20220314373A1 (en) 2022-10-06
CN114096373B (zh) 2023-12-01
US12397375B2 (en) 2025-08-26
WO2021010286A1 (ja) 2021-01-21
TW202106428A (zh) 2021-02-16
JPWO2021010286A1 (https=) 2021-01-21
CN114096373A (zh) 2022-02-25
JP7170879B2 (ja) 2022-11-14

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