JP7168796B2 - セラミック基板、複合基板及び回路基板並びにセラミック基板の製造方法、複合基板の製造方法、回路基板の製造方法及び複数の回路基板の製造方法 - Google Patents

セラミック基板、複合基板及び回路基板並びにセラミック基板の製造方法、複合基板の製造方法、回路基板の製造方法及び複数の回路基板の製造方法 Download PDF

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JP7168796B2
JP7168796B2 JP2021556170A JP2021556170A JP7168796B2 JP 7168796 B2 JP7168796 B2 JP 7168796B2 JP 2021556170 A JP2021556170 A JP 2021556170A JP 2021556170 A JP2021556170 A JP 2021556170A JP 7168796 B2 JP7168796 B2 JP 7168796B2
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ceramic substrate
manufacturing
firing chamber
metal layer
cutting
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JPWO2021095844A5 (https=
JPWO2021095844A1 (https=
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優太 津川
浩二 西村
聖治 小橋
善幸 江嶋
晃正 湯浅
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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JP2021556170A 2019-11-15 2020-11-13 セラミック基板、複合基板及び回路基板並びにセラミック基板の製造方法、複合基板の製造方法、回路基板の製造方法及び複数の回路基板の製造方法 Active JP7168796B2 (ja)

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PCT/JP2020/042421 WO2021095844A1 (ja) 2019-11-15 2020-11-13 セラミック基板、複合基板及び回路基板並びにセラミック基板の製造方法、複合基板の製造方法、回路基板の製造方法及び複数の回路基板の製造方法

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DE102023103508A1 (de) * 2023-02-14 2024-08-14 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats und ein Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren

Citations (4)

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JP2007019123A (ja) 2005-07-06 2007-01-25 Sumitomo Metal Electronics Devices Inc セラミック回路基板集合体
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