JPWO2021095844A1 - - Google Patents

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Publication number
JPWO2021095844A1
JPWO2021095844A1 JP2021556170A JP2021556170A JPWO2021095844A1 JP WO2021095844 A1 JPWO2021095844 A1 JP WO2021095844A1 JP 2021556170 A JP2021556170 A JP 2021556170A JP 2021556170 A JP2021556170 A JP 2021556170A JP WO2021095844 A1 JPWO2021095844 A1 JP WO2021095844A1
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Japan
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JP2021556170A
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JPWO2021095844A5 (https=
JP7168796B2 (ja
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/581Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • C04B35/587Fine ceramics
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    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
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    • C04B35/593Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering
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    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/638Removal thereof
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    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
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    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
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    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2021556170A 2019-11-15 2020-11-13 セラミック基板、複合基板及び回路基板並びにセラミック基板の製造方法、複合基板の製造方法、回路基板の製造方法及び複数の回路基板の製造方法 Active JP7168796B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019206751 2019-11-15
JP2019206751 2019-11-15
PCT/JP2020/042421 WO2021095844A1 (ja) 2019-11-15 2020-11-13 セラミック基板、複合基板及び回路基板並びにセラミック基板の製造方法、複合基板の製造方法、回路基板の製造方法及び複数の回路基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021095844A1 true JPWO2021095844A1 (https=) 2021-05-20
JPWO2021095844A5 JPWO2021095844A5 (https=) 2022-06-23
JP7168796B2 JP7168796B2 (ja) 2022-11-09

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JP2021556170A Active JP7168796B2 (ja) 2019-11-15 2020-11-13 セラミック基板、複合基板及び回路基板並びにセラミック基板の製造方法、複合基板の製造方法、回路基板の製造方法及び複数の回路基板の製造方法

Country Status (5)

Country Link
EP (1) EP4059912B1 (https=)
JP (1) JP7168796B2 (https=)
KR (1) KR20220100916A (https=)
CN (1) CN114830837B (https=)
WO (1) WO2021095844A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023103508A1 (de) * 2023-02-14 2024-08-14 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats und ein Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02141476A (ja) * 1988-11-21 1990-05-30 Murata Mfg Co Ltd セラミック基板の製造方法
JP2007019123A (ja) * 2005-07-06 2007-01-25 Sumitomo Metal Electronics Devices Inc セラミック回路基板集合体
JP2007198626A (ja) * 2006-01-24 2007-08-09 Tdk Corp 焼成炉
JP2008186897A (ja) * 2007-01-29 2008-08-14 Tdk Corp 多層セラミック基板の製造方法
JP2017178715A (ja) * 2016-03-31 2017-10-05 日立金属株式会社 セラミック焼結板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3722573B2 (ja) * 1996-12-11 2005-11-30 電気化学工業株式会社 セラミックス基板及びそれを用いた回路基板とその製造方法
JP4483161B2 (ja) * 2002-08-13 2010-06-16 住友電気工業株式会社 窒化アルミニウム焼結体、メタライズ基板、ヒータ、治具および窒化アルミニウム焼結体の製造方法
JP4082610B2 (ja) * 2004-05-07 2008-04-30 Tdk株式会社 セラミック基板及びその製造方法
WO2013146789A1 (ja) * 2012-03-26 2013-10-03 日立金属株式会社 窒化珪素焼結体基板及びその製造方法
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