JP7159861B2 - 両頭研削方法 - Google Patents
両頭研削方法 Download PDFInfo
- Publication number
- JP7159861B2 JP7159861B2 JP2018245302A JP2018245302A JP7159861B2 JP 7159861 B2 JP7159861 B2 JP 7159861B2 JP 2018245302 A JP2018245302 A JP 2018245302A JP 2018245302 A JP2018245302 A JP 2018245302A JP 7159861 B2 JP7159861 B2 JP 7159861B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- ground
- thickness
- wafer
- nanotopography
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018245302A JP7159861B2 (ja) | 2018-12-27 | 2018-12-27 | 両頭研削方法 |
TW108140396A TWI702115B (zh) | 2018-12-27 | 2019-11-07 | 兩頭研磨方法 |
CN201980086217.XA CN113396030B (zh) | 2018-12-27 | 2019-11-08 | 两头磨削方法 |
DE112019006452.5T DE112019006452T5 (de) | 2018-12-27 | 2019-11-08 | Doppel-schleifverfahren |
KR1020217018567A KR102517771B1 (ko) | 2018-12-27 | 2019-11-08 | 양두 연삭 방법 |
PCT/JP2019/043882 WO2020137187A1 (ja) | 2018-12-27 | 2019-11-08 | 両頭研削方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018245302A JP7159861B2 (ja) | 2018-12-27 | 2018-12-27 | 両頭研削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020104211A JP2020104211A (ja) | 2020-07-09 |
JP7159861B2 true JP7159861B2 (ja) | 2022-10-25 |
Family
ID=71128947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018245302A Active JP7159861B2 (ja) | 2018-12-27 | 2018-12-27 | 両頭研削方法 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP7159861B2 (zh) |
KR (1) | KR102517771B1 (zh) |
CN (1) | CN113396030B (zh) |
DE (1) | DE112019006452T5 (zh) |
TW (1) | TWI702115B (zh) |
WO (1) | WO2020137187A1 (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000024892A (ja) | 1998-07-15 | 2000-01-25 | Nippei Toyama Corp | 両頭平面研削装置 |
JP2009016842A (ja) | 2007-07-04 | 2009-01-22 | Siltronic Ag | 半導体ウェハを研削する方法 |
JP5439217B2 (ja) | 2010-02-15 | 2014-03-12 | 信越半導体株式会社 | 両頭研削装置用リング状ホルダーおよび両頭研削装置 |
JP5494552B2 (ja) | 2011-04-15 | 2014-05-14 | 信越半導体株式会社 | 両頭研削方法及び両頭研削装置 |
JP6040947B2 (ja) | 2014-02-20 | 2016-12-07 | 信越半導体株式会社 | ワークの両頭研削方法 |
WO2017061486A1 (ja) | 2015-10-09 | 2017-04-13 | 株式会社Sumco | キャリアリング、研削装置および研削方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5256018A (en) * | 1975-11-05 | 1977-05-09 | Kouka Kuroomu Kougiyou Kk | Method of manufacturing continuous casting mould for steel |
JP2006040947A (ja) * | 2004-07-22 | 2006-02-09 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP4752475B2 (ja) * | 2005-12-08 | 2011-08-17 | 信越半導体株式会社 | 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法 |
EP1981685B1 (en) * | 2006-01-30 | 2012-05-30 | MEMC Electronic Materials, Inc. | Double side wafer grinder and methods for assessing workpiece nanotopology |
CN100467219C (zh) * | 2006-07-10 | 2009-03-11 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨方法 |
JP4985451B2 (ja) * | 2008-02-14 | 2012-07-25 | 信越半導体株式会社 | ワークの両頭研削装置およびワークの両頭研削方法 |
JP5463570B2 (ja) * | 2008-10-31 | 2014-04-09 | Sumco Techxiv株式会社 | ウェハ用両頭研削装置および両頭研削方法 |
JP5357672B2 (ja) * | 2009-09-07 | 2013-12-04 | 株式会社ディスコ | 研削方法 |
DE102009048436B4 (de) * | 2009-10-07 | 2012-12-20 | Siltronic Ag | Verfahren zum Schleifen einer Halbleiterscheibe |
CN101722477B (zh) * | 2009-10-16 | 2011-09-14 | 青岛理工大学 | 一种纳米流体磨削工艺 |
US8712575B2 (en) * | 2010-03-26 | 2014-04-29 | Memc Electronic Materials, Inc. | Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder |
DE102010013520B4 (de) * | 2010-03-31 | 2013-02-07 | Siltronic Ag | Verfahren zur beidseitigen Politur einer Halbleiterscheibe |
DE102010013519B4 (de) * | 2010-03-31 | 2012-12-27 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
DE102011082777A1 (de) * | 2011-09-15 | 2012-02-09 | Siltronic Ag | Verfahren zum beidseitigen Polieren einer Halbleiterscheibe |
JP5724958B2 (ja) * | 2012-07-03 | 2015-05-27 | 信越半導体株式会社 | 両頭研削装置及びワークの両頭研削方法 |
SG2012096699A (en) * | 2012-12-31 | 2014-07-30 | Agency Science Tech & Res | Amphiphilic linear peptide/peptoid and hydrogel comprising the same |
JP2014204092A (ja) * | 2013-04-10 | 2014-10-27 | 株式会社岡本工作機械製作所 | 被研削材を研削加工する方法 |
JP6316652B2 (ja) * | 2014-05-14 | 2018-04-25 | 株式会社ディスコ | 研削装置 |
-
2018
- 2018-12-27 JP JP2018245302A patent/JP7159861B2/ja active Active
-
2019
- 2019-11-07 TW TW108140396A patent/TWI702115B/zh active
- 2019-11-08 WO PCT/JP2019/043882 patent/WO2020137187A1/ja active Application Filing
- 2019-11-08 CN CN201980086217.XA patent/CN113396030B/zh active Active
- 2019-11-08 DE DE112019006452.5T patent/DE112019006452T5/de active Pending
- 2019-11-08 KR KR1020217018567A patent/KR102517771B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000024892A (ja) | 1998-07-15 | 2000-01-25 | Nippei Toyama Corp | 両頭平面研削装置 |
JP2009016842A (ja) | 2007-07-04 | 2009-01-22 | Siltronic Ag | 半導体ウェハを研削する方法 |
JP5439217B2 (ja) | 2010-02-15 | 2014-03-12 | 信越半導体株式会社 | 両頭研削装置用リング状ホルダーおよび両頭研削装置 |
JP5494552B2 (ja) | 2011-04-15 | 2014-05-14 | 信越半導体株式会社 | 両頭研削方法及び両頭研削装置 |
JP6040947B2 (ja) | 2014-02-20 | 2016-12-07 | 信越半導体株式会社 | ワークの両頭研削方法 |
WO2017061486A1 (ja) | 2015-10-09 | 2017-04-13 | 株式会社Sumco | キャリアリング、研削装置および研削方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20210089770A (ko) | 2021-07-16 |
TWI702115B (zh) | 2020-08-21 |
CN113396030A (zh) | 2021-09-14 |
TW202037456A (zh) | 2020-10-16 |
DE112019006452T5 (de) | 2021-09-09 |
CN113396030B (zh) | 2023-07-21 |
JP2020104211A (ja) | 2020-07-09 |
WO2020137187A1 (ja) | 2020-07-02 |
KR102517771B1 (ko) | 2023-04-03 |
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