JP7156272B2 - 六ホウ化ランタン含有複合粒子の製造方法および成形品の製造方法 - Google Patents

六ホウ化ランタン含有複合粒子の製造方法および成形品の製造方法 Download PDF

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JP7156272B2
JP7156272B2 JP2019515701A JP2019515701A JP7156272B2 JP 7156272 B2 JP7156272 B2 JP 7156272B2 JP 2019515701 A JP2019515701 A JP 2019515701A JP 2019515701 A JP2019515701 A JP 2019515701A JP 7156272 B2 JP7156272 B2 JP 7156272B2
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composite particles
particles
reaction mixture
amino
lanthanum hexaboride
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JPWO2018203490A1 (ja
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肇 片山
広志 有賀
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AGC Inc
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Asahi Glass Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B35/00—Boron; Compounds thereof
    • C01B35/02—Boron; Borides
    • C01B35/04—Metal borides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/14—Pore volume
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/16—Pore diameter
    • C01P2006/17—Pore diameter distribution
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2019515701A 2017-05-01 2018-04-23 六ホウ化ランタン含有複合粒子の製造方法および成形品の製造方法 Active JP7156272B2 (ja)

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JP2017091393 2017-05-01
JP2017091393 2017-05-01
PCT/JP2018/016479 WO2018203490A1 (ja) 2017-05-01 2018-04-23 六ホウ化ランタン含有複合粒子の製造方法および成形品の製造方法

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JPWO2018203490A1 JPWO2018203490A1 (ja) 2020-05-21
JP7156272B2 true JP7156272B2 (ja) 2022-10-19

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US (1) US11479673B2 (de)
JP (1) JP7156272B2 (de)
CN (1) CN110546107B (de)
DE (1) DE112018002323T5 (de)
WO (1) WO2018203490A1 (de)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003321218A (ja) 2002-04-25 2003-11-11 Sumitomo Metal Mining Co Ltd 被覆六ホウ化物粒子及びこれを用いた光学部材
JP2004043764A (ja) 2002-05-14 2004-02-12 Asahi Glass Co Ltd 赤外線遮断性フッ素樹脂フィルム
JP2006008428A (ja) 2004-06-23 2006-01-12 Shin Etsu Chem Co Ltd 被覆六ホウ化物粒子及びその製造方法
JP2006213576A (ja) 2005-02-04 2006-08-17 Sumitomo Metal Mining Co Ltd 日射遮蔽用ホウ化物微粒子、このホウ化物微粒子を用いた日射遮蔽体形成用分散液および日射遮蔽体、並びに日射遮蔽用ホウ化物微粒子の製造方法および日射遮蔽体形成用分散液の製造方法
JP2007308341A (ja) 2006-05-19 2007-11-29 Sumitomo Metal Mining Co Ltd 表面被覆六ホウ化物粒子の製造方法
JP2009009602A (ja) 2008-08-25 2009-01-15 Dainippon Printing Co Ltd Ｉｃカード及びｉｃカードプログラム
JP2016169189A (ja) 2015-03-13 2016-09-23 帝人株式会社 近赤外線による生体組織の損傷を防止する方法
JP2017054902A (ja) 2015-09-09 2017-03-16 株式会社東芝 半導体発光装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3350341B2 (ja) * 1996-04-01 2002-11-25 信越化学工業株式会社 ポリシロキサン・ポリエーテルブロック共重合体及び該共重合体を製造する方法
JP4349779B2 (ja) * 2002-07-31 2009-10-21 住友金属鉱山株式会社 熱線遮蔽透明樹脂成形体と熱線遮蔽透明積層体
JP2004323764A (ja) * 2003-04-28 2004-11-18 Ge Toshiba Silicones Co Ltd 接着性ポリオルガノシロキサン組成物
JP2006193670A (ja) * 2005-01-17 2006-07-27 Sumitomo Metal Mining Co Ltd シリカ膜被覆６ホウ化物微粒子とその製造方法、これを用いた光学部材用塗布液及び光学部材
JP5102969B2 (ja) * 2006-04-14 2012-12-19 出光興産株式会社 ポリカーボネート樹脂組成物及びその成形板
JP5087783B2 (ja) * 2007-10-19 2012-12-05 住友金属鉱山株式会社 表面被覆六ホウ化物粒子前駆体の製造方法と表面被覆六ホウ化物粒子前駆体、表面被覆六ホウ化物粒子並びにその分散体、および、表面被覆六ホウ化物粒子が用いられた構造体と物品
JP5343058B2 (ja) * 2010-10-15 2013-11-13 リンテック株式会社 透明導電性フィルム、その製造方法、電子デバイス用部材及び電子デバイス
JP6557453B2 (ja) * 2014-06-11 2019-08-07 チタン工業株式会社 化粧品用黒酸化鉄及びその製造方法並びにそれを配合した化粧料
JP6126189B1 (ja) 2015-11-16 2017-05-10 Ｌｉｎｅ株式会社 表示制御方法、端末、情報処理装置、及びプログラム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003321218A (ja) 2002-04-25 2003-11-11 Sumitomo Metal Mining Co Ltd 被覆六ホウ化物粒子及びこれを用いた光学部材
JP2004043764A (ja) 2002-05-14 2004-02-12 Asahi Glass Co Ltd 赤外線遮断性フッ素樹脂フィルム
JP2006008428A (ja) 2004-06-23 2006-01-12 Shin Etsu Chem Co Ltd 被覆六ホウ化物粒子及びその製造方法
JP2006213576A (ja) 2005-02-04 2006-08-17 Sumitomo Metal Mining Co Ltd 日射遮蔽用ホウ化物微粒子、このホウ化物微粒子を用いた日射遮蔽体形成用分散液および日射遮蔽体、並びに日射遮蔽用ホウ化物微粒子の製造方法および日射遮蔽体形成用分散液の製造方法
JP2007308341A (ja) 2006-05-19 2007-11-29 Sumitomo Metal Mining Co Ltd 表面被覆六ホウ化物粒子の製造方法
JP2009009602A (ja) 2008-08-25 2009-01-15 Dainippon Printing Co Ltd Ｉｃカード及びｉｃカードプログラム
JP2016169189A (ja) 2015-03-13 2016-09-23 帝人株式会社 近赤外線による生体組織の損傷を防止する方法
JP2017054902A (ja) 2015-09-09 2017-03-16 株式会社東芝 半導体発光装置

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CN110546107A (zh) 2019-12-06
DE112018002323T5 (de) 2020-01-09
CN110546107B (zh) 2022-12-09
JPWO2018203490A1 (ja) 2020-05-21
US11479673B2 (en) 2022-10-25
WO2018203490A1 (ja) 2018-11-08
US20200010684A1 (en) 2020-01-09

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