JP7154449B1 - 電子部品実装装置 - Google Patents
電子部品実装装置 Download PDFInfo
- Publication number
- JP7154449B1 JP7154449B1 JP2022027018A JP2022027018A JP7154449B1 JP 7154449 B1 JP7154449 B1 JP 7154449B1 JP 2022027018 A JP2022027018 A JP 2022027018A JP 2022027018 A JP2022027018 A JP 2022027018A JP 7154449 B1 JP7154449 B1 JP 7154449B1
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- Prior art keywords
- tray
- electronic component
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
- Wire Bonding (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022159784A JP2023066378A (ja) | 2021-10-28 | 2022-10-03 | 電子部品実装装置 |
CN202211258961.3A CN116053181A (zh) | 2021-10-28 | 2022-10-14 | 电子零件安装装置 |
TW111139625A TWI837893B (zh) | 2021-10-28 | 2022-10-19 | 電子零件安裝裝置 |
KR1020220135718A KR20230061259A (ko) | 2021-10-28 | 2022-10-20 | 전자 부품 실장 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021176681 | 2021-10-28 | ||
JP2021176681 | 2021-10-28 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022159784A Division JP2023066378A (ja) | 2021-10-28 | 2022-10-03 | 電子部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP7154449B1 true JP7154449B1 (ja) | 2022-10-17 |
JP2023066342A JP2023066342A (ja) | 2023-05-15 |
Family
ID=83637964
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022027018A Active JP7154449B1 (ja) | 2021-10-28 | 2022-02-24 | 電子部品実装装置 |
JP2022159784A Pending JP2023066378A (ja) | 2021-10-28 | 2022-10-03 | 電子部品実装装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022159784A Pending JP2023066378A (ja) | 2021-10-28 | 2022-10-03 | 電子部品実装装置 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP7154449B1 (ko) |
KR (1) | KR20230061259A (ko) |
CN (1) | CN116053181A (ko) |
TW (1) | TWI837893B (ko) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0955598A (ja) * | 1995-08-11 | 1997-02-25 | Shibuya Kogyo Co Ltd | チップ供給装置 |
JP2019176028A (ja) * | 2018-03-28 | 2019-10-10 | 芝浦メカトロニクス株式会社 | 電子部品実装装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3591679B2 (ja) * | 1997-04-17 | 2004-11-24 | 株式会社アドバンテスト | Ic用トレイ取出装置及びic用トレイ収納装置 |
JP5440479B2 (ja) * | 2010-11-26 | 2014-03-12 | パナソニック株式会社 | 部品実装装置およびトレイフィーダにおけるトレイ交換方法 |
TWI608562B (zh) * | 2014-05-23 | 2017-12-11 | 矽創電子股份有限公司 | Structure of wafer carrier |
-
2022
- 2022-02-24 JP JP2022027018A patent/JP7154449B1/ja active Active
- 2022-10-03 JP JP2022159784A patent/JP2023066378A/ja active Pending
- 2022-10-14 CN CN202211258961.3A patent/CN116053181A/zh active Pending
- 2022-10-19 TW TW111139625A patent/TWI837893B/zh active
- 2022-10-20 KR KR1020220135718A patent/KR20230061259A/ko unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0955598A (ja) * | 1995-08-11 | 1997-02-25 | Shibuya Kogyo Co Ltd | チップ供給装置 |
JP2019176028A (ja) * | 2018-03-28 | 2019-10-10 | 芝浦メカトロニクス株式会社 | 電子部品実装装置 |
Also Published As
Publication number | Publication date |
---|---|
CN116053181A (zh) | 2023-05-02 |
TWI837893B (zh) | 2024-04-01 |
TW202318962A (zh) | 2023-05-01 |
JP2023066342A (ja) | 2023-05-15 |
JP2023066378A (ja) | 2023-05-15 |
KR20230061259A (ko) | 2023-05-08 |
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