JP7154449B1 - 電子部品実装装置 - Google Patents

電子部品実装装置 Download PDF

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Publication number
JP7154449B1
JP7154449B1 JP2022027018A JP2022027018A JP7154449B1 JP 7154449 B1 JP7154449 B1 JP 7154449B1 JP 2022027018 A JP2022027018 A JP 2022027018A JP 2022027018 A JP2022027018 A JP 2022027018A JP 7154449 B1 JP7154449 B1 JP 7154449B1
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JP
Japan
Prior art keywords
tray
electronic component
protective sheet
stage
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022027018A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023066342A (ja
Inventor
圭剛 広瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2022159784A priority Critical patent/JP2023066378A/ja
Priority to CN202211258961.3A priority patent/CN116053181A/zh
Application granted granted Critical
Publication of JP7154449B1 publication Critical patent/JP7154449B1/ja
Priority to TW111139625A priority patent/TWI837893B/zh
Priority to KR1020220135718A priority patent/KR20230061259A/ko
Publication of JP2023066342A publication Critical patent/JP2023066342A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
  • Wire Bonding (AREA)
JP2022027018A 2021-10-28 2022-02-24 電子部品実装装置 Active JP7154449B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022159784A JP2023066378A (ja) 2021-10-28 2022-10-03 電子部品実装装置
CN202211258961.3A CN116053181A (zh) 2021-10-28 2022-10-14 电子零件安装装置
TW111139625A TWI837893B (zh) 2021-10-28 2022-10-19 電子零件安裝裝置
KR1020220135718A KR20230061259A (ko) 2021-10-28 2022-10-20 전자 부품 실장 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021176681 2021-10-28
JP2021176681 2021-10-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022159784A Division JP2023066378A (ja) 2021-10-28 2022-10-03 電子部品実装装置

Publications (2)

Publication Number Publication Date
JP7154449B1 true JP7154449B1 (ja) 2022-10-17
JP2023066342A JP2023066342A (ja) 2023-05-15

Family

ID=83637964

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022027018A Active JP7154449B1 (ja) 2021-10-28 2022-02-24 電子部品実装装置
JP2022159784A Pending JP2023066378A (ja) 2021-10-28 2022-10-03 電子部品実装装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022159784A Pending JP2023066378A (ja) 2021-10-28 2022-10-03 電子部品実装装置

Country Status (4)

Country Link
JP (2) JP7154449B1 (ko)
KR (1) KR20230061259A (ko)
CN (1) CN116053181A (ko)
TW (1) TWI837893B (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0955598A (ja) * 1995-08-11 1997-02-25 Shibuya Kogyo Co Ltd チップ供給装置
JP2019176028A (ja) * 2018-03-28 2019-10-10 芝浦メカトロニクス株式会社 電子部品実装装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3591679B2 (ja) * 1997-04-17 2004-11-24 株式会社アドバンテスト Ｉｃ用トレイ取出装置及びｉｃ用トレイ収納装置
JP5440479B2 (ja) * 2010-11-26 2014-03-12 パナソニック株式会社 部品実装装置およびトレイフィーダにおけるトレイ交換方法
TWI608562B (zh) * 2014-05-23 2017-12-11 矽創電子股份有限公司 Structure of wafer carrier

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0955598A (ja) * 1995-08-11 1997-02-25 Shibuya Kogyo Co Ltd チップ供給装置
JP2019176028A (ja) * 2018-03-28 2019-10-10 芝浦メカトロニクス株式会社 電子部品実装装置

Also Published As

Publication number Publication date
CN116053181A (zh) 2023-05-02
TWI837893B (zh) 2024-04-01
TW202318962A (zh) 2023-05-01
JP2023066342A (ja) 2023-05-15
JP2023066378A (ja) 2023-05-15
KR20230061259A (ko) 2023-05-08

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