JP7153574B2 - 上部電極構造、プラズマ処理装置、及び上部電極構造を組み立てる方法 - Google Patents

上部電極構造、プラズマ処理装置、及び上部電極構造を組み立てる方法 Download PDF

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JP7153574B2
JP7153574B2 JP2019006074A JP2019006074A JP7153574B2 JP 7153574 B2 JP7153574 B2 JP 7153574B2 JP 2019006074 A JP2019006074 A JP 2019006074A JP 2019006074 A JP2019006074 A JP 2019006074A JP 7153574 B2 JP7153574 B2 JP 7153574B2
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electrode
plate
gas
hole
plasma processing
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JP2020115419A5 (https=
JP2020115419A (ja
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元 玉虫
一也 永関
地塩 輿水
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2019006074A priority Critical patent/JP7153574B2/ja
Priority to KR1020200002434A priority patent/KR102839616B1/ko
Priority to CN202010020933.2A priority patent/CN111446143B/zh
Priority to US16/738,369 priority patent/US11443924B2/en
Priority to TW109100728A priority patent/TWI850309B/zh
Publication of JP2020115419A publication Critical patent/JP2020115419A/ja
Publication of JP2020115419A5 publication Critical patent/JP2020115419A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32559—Protection means, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2019006074A 2019-01-17 2019-01-17 上部電極構造、プラズマ処理装置、及び上部電極構造を組み立てる方法 Active JP7153574B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019006074A JP7153574B2 (ja) 2019-01-17 2019-01-17 上部電極構造、プラズマ処理装置、及び上部電極構造を組み立てる方法
KR1020200002434A KR102839616B1 (ko) 2019-01-17 2020-01-08 상부 전극 구조, 플라즈마 처리 장치, 및 상부 전극 구조를 조립하는 방법
CN202010020933.2A CN111446143B (zh) 2019-01-17 2020-01-09 上部电极结构、等离子体处理装置及组装上部电极结构的方法
US16/738,369 US11443924B2 (en) 2019-01-17 2020-01-09 Upper electrode and plasma processing apparatus
TW109100728A TWI850309B (zh) 2019-01-17 2020-01-09 電漿處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019006074A JP7153574B2 (ja) 2019-01-17 2019-01-17 上部電極構造、プラズマ処理装置、及び上部電極構造を組み立てる方法

Publications (3)

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JP2020115419A JP2020115419A (ja) 2020-07-30
JP2020115419A5 JP2020115419A5 (https=) 2021-11-11
JP7153574B2 true JP7153574B2 (ja) 2022-10-14

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Country Link
US (1) US11443924B2 (https=)
JP (1) JP7153574B2 (https=)
KR (1) KR102839616B1 (https=)
CN (1) CN111446143B (https=)
TW (1) TWI850309B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7454407B2 (ja) * 2020-03-02 2024-03-22 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US12451331B2 (en) * 2020-09-22 2025-10-21 Applied Materials, Inc. Showerhead assembly with recursive gas channels
WO2022123615A1 (ja) * 2020-12-07 2022-06-16 東芝三菱電機産業システム株式会社 活性ガス生成装置
CN118043945A (zh) 2021-10-05 2024-05-14 东京毅力科创株式会社 上部电极构造和等离子体处理装置
JP7611127B2 (ja) * 2021-12-13 2025-01-09 東京エレクトロン株式会社 上部電極及びプラズマ処理装置
CN116994936A (zh) * 2022-01-18 2023-11-03 江苏天芯微半导体设备有限公司 一种衬套及晶圆预处理装置
JP7717015B2 (ja) * 2022-03-18 2025-08-01 東京エレクトロン株式会社 上部電極及びプラズマ処理装置
WO2025193681A1 (en) * 2024-03-11 2025-09-18 University Of Maryland, College Park Thermal plasma systems and methods for gas phase reactions

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009301802A (ja) 2008-06-11 2009-12-24 Tokyo Electron Ltd プラズマ処理装置
JP2011009249A (ja) 2009-06-23 2011-01-13 Hitachi High-Technologies Corp プラズマ処理装置
JP2015216261A (ja) 2014-05-12 2015-12-03 東京エレクトロン株式会社 プラズマ処理装置の上部電極構造、プラズマ処理装置、及びプラズマ処理装置の運用方法
US20170352567A1 (en) 2016-06-07 2017-12-07 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
JP2018056248A (ja) 2016-09-28 2018-04-05 株式会社日立ハイテクノロジーズ プラズマ処理装置の運転方法

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US5572398A (en) * 1994-11-14 1996-11-05 Hewlett-Packard Co. Tri-polar electrostatic chuck
TW492135B (en) * 2000-05-25 2002-06-21 Tomoegawa Paper Co Ltd Adhesive sheets for static electricity chuck device, and static electricity chuck device
US7993489B2 (en) * 2005-03-31 2011-08-09 Tokyo Electron Limited Capacitive coupling plasma processing apparatus and method for using the same
US9520276B2 (en) * 2005-06-22 2016-12-13 Tokyo Electron Limited Electrode assembly and plasma processing apparatus
WO2009031566A1 (ja) * 2007-09-06 2009-03-12 Creative Technology Corporation 静電チャック装置におけるガス供給構造の製造方法及び静電チャック装置ガス供給構造並びに静電チャック装置
JP2010182763A (ja) * 2009-02-04 2010-08-19 Hitachi High-Technologies Corp プラズマ処理装置
JP5683822B2 (ja) * 2009-03-06 2015-03-11 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理装置用の電極
US9449859B2 (en) * 2009-10-09 2016-09-20 Applied Materials, Inc. Multi-gas centrally cooled showerhead design
JP5762798B2 (ja) * 2011-03-31 2015-08-12 東京エレクトロン株式会社 天井電極板及び基板処理載置
KR20150143793A (ko) * 2013-04-17 2015-12-23 도쿄엘렉트론가부시키가이샤 균일한 플라즈마 밀도를 가진 용량 결합형 플라즈마 장비
JP7073098B2 (ja) * 2017-12-27 2022-05-23 株式会社日立ハイテク ウエハ処理方法およびウエハ処理装置

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2009301802A (ja) 2008-06-11 2009-12-24 Tokyo Electron Ltd プラズマ処理装置
JP2011009249A (ja) 2009-06-23 2011-01-13 Hitachi High-Technologies Corp プラズマ処理装置
JP2015216261A (ja) 2014-05-12 2015-12-03 東京エレクトロン株式会社 プラズマ処理装置の上部電極構造、プラズマ処理装置、及びプラズマ処理装置の運用方法
US20170352567A1 (en) 2016-06-07 2017-12-07 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
JP2018056248A (ja) 2016-09-28 2018-04-05 株式会社日立ハイテクノロジーズ プラズマ処理装置の運転方法

Also Published As

Publication number Publication date
TWI850309B (zh) 2024-08-01
CN111446143A (zh) 2020-07-24
CN111446143B (zh) 2024-11-05
KR20200089608A (ko) 2020-07-27
TW202032618A (zh) 2020-09-01
KR102839616B1 (ko) 2025-07-30
US20200234930A1 (en) 2020-07-23
JP2020115419A (ja) 2020-07-30
US11443924B2 (en) 2022-09-13

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