JP7140115B2 - エポキシ樹脂、製造方法、エポキシ樹脂組成物及びその硬化物 - Google Patents

エポキシ樹脂、製造方法、エポキシ樹脂組成物及びその硬化物 Download PDF

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JP7140115B2
JP7140115B2 JP2019523391A JP2019523391A JP7140115B2 JP 7140115 B2 JP7140115 B2 JP 7140115B2 JP 2019523391 A JP2019523391 A JP 2019523391A JP 2019523391 A JP2019523391 A JP 2019523391A JP 7140115 B2 JP7140115 B2 JP 7140115B2
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epoxy resin
mass
resin composition
resin
compounds
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JPWO2018225411A1 (ja
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陽祐 広田
信哉 中村
源祐 秋元
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DIC Corp
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/02—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising combinations of reinforcements, e.g. non-specified reinforcements, fibrous reinforcing inserts and fillers, e.g. particulate fillers, incorporated in matrix material, forming one or more layers and with or without non-reinforced or non-filled layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D301/00—Preparation of oxiranes
    • C07D301/27—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms
    • C07D301/28—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms by reaction with hydroxyl radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/28—Ethers with hydroxy compounds containing oxirane rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Compounds (AREA)
JP2019523391A 2017-06-07 2018-04-24 エポキシ樹脂、製造方法、エポキシ樹脂組成物及びその硬化物 Active JP7140115B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017112542 2017-06-07
JP2017112542 2017-06-07
PCT/JP2018/016549 WO2018225411A1 (ja) 2017-06-07 2018-04-24 エポキシ樹脂、製造方法、エポキシ樹脂組成物及びその硬化物

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JPWO2018225411A1 JPWO2018225411A1 (ja) 2020-04-09
JP7140115B2 true JP7140115B2 (ja) 2022-09-21

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JP (1) JP7140115B2 (ko)
KR (1) KR102409661B1 (ko)
CN (1) CN110719926B (ko)
TW (1) TWI794235B (ko)
WO (1) WO2018225411A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7249162B2 (ja) * 2019-02-01 2023-03-30 積水化学工業株式会社 樹脂組成物、硬化物、及び、ビルドアップフィルム
US10961208B1 (en) * 2019-12-24 2021-03-30 Chang Chun Plastics Co., Ltd. Product of glycidyl ether of a mono or polyhydric phenol
CN115678206A (zh) * 2022-11-11 2023-02-03 中南民族大学 一种可循环回收阻燃型环氧树脂及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004307686A (ja) 2003-04-08 2004-11-04 Japan Epoxy Resin Kk エポキシ樹脂、その製法、エポキシ樹脂組成物及び半導体装置
JP2006291094A (ja) 2005-04-13 2006-10-26 Yokohama Rubber Co Ltd:The 繊維強化複合材料用エポキシ樹脂組成物
JP2013107981A (ja) 2011-11-21 2013-06-06 Dic Corp 高分子量ウレタン樹脂、該ウレタン樹脂を含有するエポキシ樹脂組成物及びその硬化物
JP2016108562A (ja) 2014-12-04 2016-06-20 三菱化学株式会社 テトラメチルビフェノール型エポキシ樹脂、エポキシ樹脂組成物、硬化物及び半導体封止材

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62290717A (ja) * 1986-06-09 1987-12-17 Asahi Chem Ind Co Ltd 電子部品用エポキシ樹脂液状組成物
KR0168057B1 (ko) * 1990-04-12 1999-03-20 베르너 발데크 에폭시 수지의 제조방법
JP3760612B2 (ja) * 1997-12-18 2006-03-29 大日本インキ化学工業株式会社 エポキシ樹脂の製造方法
JP5551389B2 (ja) * 2009-08-06 2014-07-16 新日鉄住金化学株式会社 エポキシ樹脂粉体塗料組成物
JP5544184B2 (ja) * 2010-02-08 2014-07-09 新日鉄住金化学株式会社 リン含有エポキシ樹脂の製造方法、エポキシ樹脂組成物及びその硬化物
US20130052381A1 (en) * 2011-08-22 2013-02-28 Robert R. Gallucci Polyepoxides and epoxy resins and methods for the manufacture and use thereof
TWI641628B (zh) * 2014-10-24 2018-11-21 新日鐵住金化學股份有限公司 環氧樹脂組成物及其硬化物
JP6558671B2 (ja) 2014-11-07 2019-08-14 パナソニックＩｐマネジメント株式会社 封止用エポキシ樹脂組成物及び半導体装置
KR101854503B1 (ko) * 2015-07-20 2018-05-04 삼성에스디아이 주식회사 포스포늄계 화합물, 이를 포함하는 에폭시수지 조성물, 및 이를 사용하여 제조된 반도체 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004307686A (ja) 2003-04-08 2004-11-04 Japan Epoxy Resin Kk エポキシ樹脂、その製法、エポキシ樹脂組成物及び半導体装置
JP2006291094A (ja) 2005-04-13 2006-10-26 Yokohama Rubber Co Ltd:The 繊維強化複合材料用エポキシ樹脂組成物
JP2013107981A (ja) 2011-11-21 2013-06-06 Dic Corp 高分子量ウレタン樹脂、該ウレタン樹脂を含有するエポキシ樹脂組成物及びその硬化物
JP2016108562A (ja) 2014-12-04 2016-06-20 三菱化学株式会社 テトラメチルビフェノール型エポキシ樹脂、エポキシ樹脂組成物、硬化物及び半導体封止材

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WO2018225411A1 (ja) 2018-12-13
KR20200016216A (ko) 2020-02-14
CN110719926A (zh) 2020-01-21
JPWO2018225411A1 (ja) 2020-04-09
TWI794235B (zh) 2023-03-01
CN110719926B (zh) 2022-05-13
TW201902714A (zh) 2019-01-16
KR102409661B1 (ko) 2022-06-17

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