JP7134923B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
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- JP7134923B2 JP7134923B2 JP2019122320A JP2019122320A JP7134923B2 JP 7134923 B2 JP7134923 B2 JP 7134923B2 JP 2019122320 A JP2019122320 A JP 2019122320A JP 2019122320 A JP2019122320 A JP 2019122320A JP 7134923 B2 JP7134923 B2 JP 7134923B2
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- thin film
- connection pad
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- 239000000758 substrate Substances 0.000 claims description 104
- 239000004020 conductor Substances 0.000 claims description 69
- 239000011241 protective layer Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
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- 229910052802 copper Inorganic materials 0.000 description 3
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- 238000007740 vapor deposition Methods 0.000 description 1
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/22—Secondary treatment of printed circuits
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
- H10K59/1275—Electrical connections of the two substrates
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- H10K59/129—Chiplets
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L2021/775—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate comprising a plurality of TFTs on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
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Description
11、11’ 導電体
12、12a、12b、12c 表面実装素子
121、122、124、125 接続パッド
123 発光ダイオードチップ
2、2a~2e 薄膜回路基板
21 基板
22 薄膜回路
221a、221b 薄膜トランジスタ
222 導電配線
23 第1の接続パッド
24 保護層
25 第4の接続パッド
26 機能性チップ
27、28 絶縁層
3、3c~3g 駆動回路板
31 第2の接続パッド
32 導電配線
33 第3の接続パッド
34 第5の接続パッド
35 第6の接続パッド
4 硬質キャリア板
2E-2E、2F-2F、2G-2G 切断線
C キャパシタ
DL データ線
H 導電開口
S1 第1の表面
S2 第2の表面
S01ないしS05 ステップ
SL 走査線
Vdd、Vss 電圧
Claims (12)
- 電子装置であって、
対向する第1の表面と第2の表面とを有する基板と、
少なくとも一つの薄膜トランジスタと少なくとも一つの導電配線とを含み、前記基板の前記第1の表面上に設けられる薄膜回路と、
前記基板の前記第1の表面上に設けられ、前記導電配線を介して前記薄膜トランジスタに電気的に接続される少なくとも一つの第1の接続パッドと、
少なくとも一つの第2の接続パッドを含み、この上に、前記第2の表面が対向するように前記基板を設け、且つ前記第2の接続パッドは前記第1の接続パッドに隣接するとともに、前記第1の接続パッドに対応して設けられる、駆動回路板と、
前記第2の接続パッド及び前記第1の接続パッドの少なくとも一部分上を覆い、且つこれを介して前記第2の接続パッドは前記第1の接続パッドに電気的に接続される、導電体と、を備えると共に、
前記第1の接続パッドと前記第2の接続パッドの数はそれぞれ複数であり、各前記第1の接続パッドごとにこれらの前記第2の接続パッドのうちの一つを対応して設置され、電気的に接続されることを特徴とする電子装置。
- 複数の前記基板は前記駆動回路板上にアレイ配置されており、各前記基板は複数の前記薄膜回路と複数の前記第1の接続パッドとを有しており、各前記薄膜回路は対応する複数の前記第1の接続パッドに電気的に接続され、前記駆動回路板は複数の前記第2の接続パッドを有しており、前記導電体は複数であり、各前記薄膜回路が対応するうちの一つの前記第1の接続パッドは前記駆動回路板のうちの一つの前記第2の接続パッドに、そのうちの一つの前記導電体を介して互いに電気的に接続されており、このうち、二つの隣接する前記基板にそれぞれ設けられる二つの前記薄膜回路は、二つの前記第1の接続パッド及びその対応する少なくとも一つの前記第2の接続パッド、及び二つの前記導電体を介して互いに電気的に接続されることを特徴とする請求項1に記載の電子装置。
- 複数の前記基板は前記駆動回路板上にアレイ配置されており、各前記基板は複数の前記薄膜回路と複数の前記第1の接続パッドとを有しており、各前記薄膜回路は対応する複数の前記第1の接続パッドに電気的に接続され、前記駆動回路板は複数の前記第2の接続パッドを有しており、前記導電体は複数であり、各前記薄膜回路が対応するうちの一つの前記第1の接続パッドは前記駆動回路板のうちの一つの前記第2の接続パッドに、そのうちの一つの前記導電体を介して互いに電気的に接続されており、このうち、二つの隣接する前記基板にそれぞれ設けられる二つの前記薄膜回路は、二つの前記第1の接続パッド及びその対応する少なくとも一つの前記第2の接続パッド、及び一つの前記導電体を介して互いに電気的に接続されることを特徴とする請求項1に記載の電子装置。
- 前記基板はハードプレート又はソフトプレートであることを特徴とする請求項1ないし3のいずれか一項に記載の電子装置。
- 前記導電体の材料ははんだペースト、シルバーペースト、又は異方性導電性接着剤、又はそれらの組み合わせを含むことを特徴とする請求項1ないし3のいずれか一項に記載の電子装置。
- 前記薄膜回路上を覆う保護層を更に備えることを特徴とする請求項1ないし3のいずれか一項に記載の電子装置。
- 少なくとも一つの第3の接続パッドを更に含む前記駆動回路板上に設けられる表面実装素子を更に備えており、前記表面実装素子は前記第2の接続パッドを介して前記薄膜トランジスタに電気的に接続され、且つ前記第3の接続パッドを介して前記駆動回路板の回路に電気的に接続されることを特徴とする請求項1ないし3のいずれか一項に記載の電子装置。
- 前記基板の前記第1の表面上に設けられ、前記導電配線を介して前記薄膜トランジスタに電気的に接続される少なくとも一つの第4の接続パッドと、
前記基板の前記第1の表面上に設けられており、前記第4の接続パッドを介して前記薄膜トランジスタに電気的に接続される一つの表面実装素子と、
を備えることを特徴とする請求項1ないし3のいずれか一項に記載の電子装置。 - 前記基板の前記第1の表面上に設けられ、前記導電配線を介して前記薄膜トランジスタに電気的に接続される少なくとも一つの第4の接続パッドと、
前記基板の前記第1の表面上に設けられており、前記第4の接続パッドを介して前記薄膜トランジスタに電気的に接続される少なくとも一つの機能性チップと、
を備えることを特徴とする請求項1ないし3のいずれか一項に記載の電子装置。 - 前記薄膜回路及び前記機能性チップ上を覆う保護層を更に備えることを特徴とする請求項9に記載の電子装置。
- 前記表面実装素子は少なくとも一つの発光ダイオードチップ又はマイクロ発光ダイオードチップを含むパッケージであることを特徴とする請求項7又は8に記載の電子装置。
- 前記機能性チップは発光ダイオードチップ又はマイクロ発光ダイオードチップであることを特徴とする請求項9に記載の電子装置。
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