JP7133762B2 - 電力変換装置とその製造方法 - Google Patents
電力変換装置とその製造方法 Download PDFInfo
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- JP7133762B2 JP7133762B2 JP2019107238A JP2019107238A JP7133762B2 JP 7133762 B2 JP7133762 B2 JP 7133762B2 JP 2019107238 A JP2019107238 A JP 2019107238A JP 2019107238 A JP2019107238 A JP 2019107238A JP 7133762 B2 JP7133762 B2 JP 7133762B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1094—Thermal management, e.g. cooling
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Description
12:半導体モジュール
14:冷却器
20:フレーム
30:第1フレーム
32:当接壁
34a、34b:側壁
36a、36b:屈曲部
40:第2フレーム
90:電力変換装置
Claims (9)
- 各々が半導体素子を有する複数の半導体モジュールと、
各々がその内部に冷媒の流路を有する複数の冷却器と、
前記複数の半導体モジュールと前記複数の冷却器とが交互に積層された積層体を、当該積層体の積層方向に沿って加圧保持するフレームと、
を備え、
前記フレームは、第1フレームと、前記第1フレームとの間で前記積層体を挟持する第2フレームとを備え、
前記第1フレームは、前記積層体を三方向から取り囲むように屈曲する板材であって、前記積層体の積層方向に沿って延びる一対の側壁と、前記一対の側壁の間を延びるとともに前記積層体に当接する当接壁とを有し、
前記当接壁は、前記フレームの外側に撓んでおり、
前記一対の側壁の各々は、前記フレームの内側に撓んでいる、
電力変換装置。 - 前記第2フレームの積層方向における曲げ剛性は、前記第1フレームの前記当接壁の積層方向における曲げ剛性よりも高い、請求項1に記載の電力変換装置。
- 前記第2フレームの積層方向における曲げ剛性は、前記第1フレームの前記側壁の板厚方向における曲げ剛性よりも高い、請求項1又は2に記載の電力変換装置。
- 前記第2フレームは、少なくとも一つの屈曲部を有する板材であり、当該屈曲部の屈曲ラインは、前記一対の側壁の間で前記積層方向に対して直角方向に曲がっている、請求項2又は3に記載の電力変換装置。
- 前記第1フレームは、金属で構成されている、請求項1から4のいずれか一項に記載の電力変換装置。
- 請求項1から5のいずれか一項に記載の電力変換装置を製造する製造方法であって、
前記第1フレームと前記第2フレームとの間に前記積層体を配置する工程と、
前記第1フレームの両端を固定した状態で、前記第2フレームを前記積層体に向けて加圧する工程と、
前記加圧する工程において前記積層体に第1加圧力を加えた状態で、前記第2フレームを前記第1フレームに対して固定する工程と、
を備え、
前記積層体に前記第1加圧力が加えられたときに、前記当接壁が前記フレームの外側に撓むとともに、前記一対の側壁の各々が前記フレームの内側に撓む、製造方法。 - 前記積層体において、隣り合う前記半導体モジュールと前記冷却器の間にはグリス状のサーマルインターフェースマテリアルが塗布される、請求項6に記載の製造方法。
- 前記加圧する工程を実施する前に、前記当接壁の外側に荷重受けを設置する工程をさらに備え、
前記加圧する工程では、前記積層体に加える加圧力を、前記第1加圧力よりも大きい第2加圧力まで上昇させた後に前記第1加圧力まで低下させる、請求項6又は請求項7に記載の製造方法。 - 前記加圧する工程では、前記積層体に加えられる加圧力を、前記第1加圧力よりも大きい第3加圧力まで上昇させた後に前記第1加圧力まで低下させ、前記第1フレームの屈曲部に塑性変形を生じさせる、請求項6から8のいずれか一項に記載の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019107238A JP7133762B2 (ja) | 2019-06-07 | 2019-06-07 | 電力変換装置とその製造方法 |
US16/830,975 US11562944B2 (en) | 2019-06-07 | 2020-03-26 | Power conversion device and manufacturing method thereof |
DE102020109507.4A DE102020109507A1 (de) | 2019-06-07 | 2020-04-06 | Energiewandelvorrichtung und ihr Herstellungsverfahren |
CN202010288088.7A CN112053998B (zh) | 2019-06-07 | 2020-04-14 | 电力转换装置及其制造方法 |
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JP2019107238A JP7133762B2 (ja) | 2019-06-07 | 2019-06-07 | 電力変換装置とその製造方法 |
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JP2020202254A JP2020202254A (ja) | 2020-12-17 |
JP7133762B2 true JP7133762B2 (ja) | 2022-09-09 |
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JP2019107238A Active JP7133762B2 (ja) | 2019-06-07 | 2019-06-07 | 電力変換装置とその製造方法 |
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US (1) | US11562944B2 (ja) |
JP (1) | JP7133762B2 (ja) |
CN (1) | CN112053998B (ja) |
DE (1) | DE102020109507A1 (ja) |
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US20220386516A1 (en) | 2021-05-26 | 2022-12-01 | Ferrari S.P.A. | Compact electronic power converter to control at least one electric motor of a vehicle |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001320005A (ja) | 2000-05-10 | 2001-11-16 | Denso Corp | 冷媒冷却型両面冷却半導体装置 |
Family Cites Families (18)
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JP4600413B2 (ja) * | 2007-03-28 | 2010-12-15 | 株式会社デンソー | 電力変換装置 |
US8593812B2 (en) * | 2009-05-11 | 2013-11-26 | Toyota Jidosha Kabushiki Kaisha | Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device |
JP5423654B2 (ja) * | 2010-02-05 | 2014-02-19 | 株式会社デンソー | 電力変換装置 |
JP5782845B2 (ja) | 2011-06-10 | 2015-09-24 | 株式会社デンソー | 電力変換装置及びその製造方法 |
WO2013111261A1 (ja) * | 2012-01-23 | 2013-08-01 | トヨタ自動車株式会社 | 電力変換装置及びその製造方法 |
JP2014010916A (ja) * | 2012-06-27 | 2014-01-20 | Sharp Corp | 二次電池 |
JP5935586B2 (ja) * | 2012-08-10 | 2016-06-15 | トヨタ自動車株式会社 | 半導体積層ユニットの製造方法 |
WO2015065470A1 (en) * | 2013-11-01 | 2015-05-07 | Longsand Limited | Asset browsing and restoration over a network using on demand staging |
JP2015186344A (ja) | 2014-03-24 | 2015-10-22 | トヨタ自動車株式会社 | 電力変換装置 |
DE112014006676B4 (de) | 2014-06-25 | 2021-01-07 | Hitachi, Ltd. | Leistungsmodulvorrichtung |
US10279653B2 (en) * | 2014-11-13 | 2019-05-07 | Hitachi Automotive Systems, Ltd. | Power converter |
JP2016123147A (ja) | 2014-12-24 | 2016-07-07 | トヨタ自動車株式会社 | 電力変換器 |
JP6187448B2 (ja) * | 2014-12-24 | 2017-08-30 | トヨタ自動車株式会社 | 積層ユニット |
JP2016127774A (ja) | 2015-01-08 | 2016-07-11 | トヨタ自動車株式会社 | 電力変換器 |
JP6258272B2 (ja) * | 2015-08-11 | 2018-01-10 | 株式会社東芝 | バッテリーモジュール |
US10506744B2 (en) * | 2016-07-08 | 2019-12-10 | Hitachi Automotive Systems, Ltd. | Power conversion device |
JP6635901B2 (ja) * | 2016-09-21 | 2020-01-29 | 本田技研工業株式会社 | 電力変換装置 |
US11637051B2 (en) * | 2019-10-18 | 2023-04-25 | Qualcomm Incorporated | Integrated device coupled to a step heat sink configured to provide shielding |
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2019
- 2019-06-07 JP JP2019107238A patent/JP7133762B2/ja active Active
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2020
- 2020-03-26 US US16/830,975 patent/US11562944B2/en active Active
- 2020-04-06 DE DE102020109507.4A patent/DE102020109507A1/de active Pending
- 2020-04-14 CN CN202010288088.7A patent/CN112053998B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001320005A (ja) | 2000-05-10 | 2001-11-16 | Denso Corp | 冷媒冷却型両面冷却半導体装置 |
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Publication number | Publication date |
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CN112053998A (zh) | 2020-12-08 |
CN112053998B (zh) | 2024-05-28 |
US11562944B2 (en) | 2023-01-24 |
US20200388559A1 (en) | 2020-12-10 |
DE102020109507A1 (de) | 2020-12-10 |
JP2020202254A (ja) | 2020-12-17 |
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