JP7114002B1 - めっき装置およびコンタクト洗浄方法 - Google Patents

めっき装置およびコンタクト洗浄方法 Download PDF

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Publication number
JP7114002B1
JP7114002B1 JP2022519586A JP2022519586A JP7114002B1 JP 7114002 B1 JP7114002 B1 JP 7114002B1 JP 2022519586 A JP2022519586 A JP 2022519586A JP 2022519586 A JP2022519586 A JP 2022519586A JP 7114002 B1 JP7114002 B1 JP 7114002B1
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Japan
Prior art keywords
substrate
cleaning
contact
substrate holder
plating
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English (en)
Japanese (ja)
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JPWO2023079636A1 (https=
JPWO2023079636A5 (https=
Inventor
健太郎 山本
正輝 富田
一仁 辻
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Ebara Corp
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Ebara Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022519586A 2021-11-04 2021-11-04 めっき装置およびコンタクト洗浄方法 Active JP7114002B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/040605 WO2023079636A1 (ja) 2021-11-04 2021-11-04 めっき装置およびコンタクト洗浄方法

Publications (3)

Publication Number Publication Date
JP7114002B1 true JP7114002B1 (ja) 2022-08-05
JPWO2023079636A1 JPWO2023079636A1 (https=) 2023-05-11
JPWO2023079636A5 JPWO2023079636A5 (https=) 2023-10-03

Family

ID=82740462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022519586A Active JP7114002B1 (ja) 2021-11-04 2021-11-04 めっき装置およびコンタクト洗浄方法

Country Status (5)

Country Link
US (1) US12378689B2 (https=)
JP (1) JP7114002B1 (https=)
KR (2) KR102544636B1 (https=)
CN (1) CN116324046B (https=)
WO (1) WO2023079636A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7745817B1 (ja) * 2025-03-26 2025-09-29 株式会社荏原製作所 メンテナンス治具、めっき装置、および、給電コンタクトのメンテナンス方法
KR20250167477A (ko) 2024-03-28 2025-12-01 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 기판 처리 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12590381B2 (en) * 2021-11-11 2026-03-31 Taiwan Semiconductor Manufacturing Company, Ltd. Electroplating system including an improved base structure
CN120291183A (zh) * 2024-01-10 2025-07-11 盛美半导体设备(上海)股份有限公司 电镀装置及清洗方法
CN120311280A (zh) * 2024-01-12 2025-07-15 盛美半导体设备(上海)股份有限公司 电镀装置及清洗方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002212784A (ja) * 2001-01-12 2002-07-31 Tokyo Electron Ltd 電解メッキ装置及び電解メッキ方法
JP2002212786A (ja) * 2001-01-17 2002-07-31 Ebara Corp 基板処理装置
JP2002220695A (ja) * 2001-01-30 2002-08-09 Tokyo Electron Ltd メッキ処理装置、メッキ処理方法
JP2004183042A (ja) * 2002-12-03 2004-07-02 Matsushita Electric Ind Co Ltd メッキ方法、メッキ装置及び電子デバイスの製造方法
US20130061875A1 (en) * 2011-09-14 2013-03-14 Daniel J. Woodruff Component cleaning in a metal plating apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280581B1 (en) * 1998-12-29 2001-08-28 David Cheng Method and apparatus for electroplating films on semiconductor wafers
JP6092653B2 (ja) 2012-02-27 2017-03-08 株式会社荏原製作所 基板洗浄装置及び洗浄方法
KR102112881B1 (ko) * 2012-03-28 2020-05-19 노벨러스 시스템즈, 인코포레이티드 전자도금 기판 홀더들을 세정하기 위한 방법들 및 장치들
US10307798B2 (en) * 2015-08-28 2019-06-04 Taiwan Semiconducter Manufacturing Company Limited Cleaning device for cleaning electroplating substrate holder
JP7034880B2 (ja) * 2018-10-05 2022-03-14 株式会社荏原製作所 洗浄装置、これを備えためっき装置、及び洗浄方法
JP7244408B2 (ja) * 2019-12-13 2023-03-22 株式会社荏原製作所 基板ホルダ
JP7455608B2 (ja) * 2020-02-25 2024-03-26 株式会社荏原製作所 洗浄方法及び洗浄装置
CN114981486B (zh) * 2020-12-22 2023-03-24 株式会社荏原制作所 镀覆装置、预湿处理方法以及清洗处理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002212784A (ja) * 2001-01-12 2002-07-31 Tokyo Electron Ltd 電解メッキ装置及び電解メッキ方法
JP2002212786A (ja) * 2001-01-17 2002-07-31 Ebara Corp 基板処理装置
JP2002220695A (ja) * 2001-01-30 2002-08-09 Tokyo Electron Ltd メッキ処理装置、メッキ処理方法
JP2004183042A (ja) * 2002-12-03 2004-07-02 Matsushita Electric Ind Co Ltd メッキ方法、メッキ装置及び電子デバイスの製造方法
US20130061875A1 (en) * 2011-09-14 2013-03-14 Daniel J. Woodruff Component cleaning in a metal plating apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250167477A (ko) 2024-03-28 2025-12-01 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 기판 처리 방법
JP7745817B1 (ja) * 2025-03-26 2025-09-29 株式会社荏原製作所 メンテナンス治具、めっき装置、および、給電コンタクトのメンテナンス方法

Also Published As

Publication number Publication date
KR102782656B1 (ko) 2025-03-19
US20240218552A1 (en) 2024-07-04
WO2023079636A1 (ja) 2023-05-11
KR20230088928A (ko) 2023-06-20
KR20230066271A (ko) 2023-05-15
JPWO2023079636A1 (https=) 2023-05-11
KR102544636B1 (ko) 2023-06-20
CN116324046A (zh) 2023-06-23
US12378689B2 (en) 2025-08-05
CN116324046B (zh) 2024-08-02

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