JPWO2023079636A1 - - Google Patents
Info
- Publication number
- JPWO2023079636A1 JPWO2023079636A1 JP2022519586A JP2022519586A JPWO2023079636A1 JP WO2023079636 A1 JPWO2023079636 A1 JP WO2023079636A1 JP 2022519586 A JP2022519586 A JP 2022519586A JP 2022519586 A JP2022519586 A JP 2022519586A JP WO2023079636 A1 JPWO2023079636 A1 JP WO2023079636A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/040605 WO2023079636A1 (ja) | 2021-11-04 | 2021-11-04 | めっき装置およびコンタクト洗浄方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7114002B1 JP7114002B1 (ja) | 2022-08-05 |
| JPWO2023079636A1 true JPWO2023079636A1 (https=) | 2023-05-11 |
| JPWO2023079636A5 JPWO2023079636A5 (https=) | 2023-10-03 |
Family
ID=82740462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022519586A Active JP7114002B1 (ja) | 2021-11-04 | 2021-11-04 | めっき装置およびコンタクト洗浄方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12378689B2 (https=) |
| JP (1) | JP7114002B1 (https=) |
| KR (2) | KR102544636B1 (https=) |
| CN (1) | CN116324046B (https=) |
| WO (1) | WO2023079636A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12590381B2 (en) * | 2021-11-11 | 2026-03-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electroplating system including an improved base structure |
| CN120291183A (zh) * | 2024-01-10 | 2025-07-11 | 盛美半导体设备(上海)股份有限公司 | 电镀装置及清洗方法 |
| CN120311280A (zh) * | 2024-01-12 | 2025-07-15 | 盛美半导体设备(上海)股份有限公司 | 电镀装置及清洗方法 |
| KR20250167477A (ko) | 2024-03-28 | 2025-12-01 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 장치 및 기판 처리 방법 |
| JP7745817B1 (ja) * | 2025-03-26 | 2025-09-29 | 株式会社荏原製作所 | メンテナンス治具、めっき装置、および、給電コンタクトのメンテナンス方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6280581B1 (en) * | 1998-12-29 | 2001-08-28 | David Cheng | Method and apparatus for electroplating films on semiconductor wafers |
| JP2002212784A (ja) * | 2001-01-12 | 2002-07-31 | Tokyo Electron Ltd | 電解メッキ装置及び電解メッキ方法 |
| JP2002212786A (ja) | 2001-01-17 | 2002-07-31 | Ebara Corp | 基板処理装置 |
| JP2002220695A (ja) * | 2001-01-30 | 2002-08-09 | Tokyo Electron Ltd | メッキ処理装置、メッキ処理方法 |
| JP3741682B2 (ja) * | 2002-12-03 | 2006-02-01 | 松下電器産業株式会社 | メッキ方法、メッキ装置及び電子デバイスの製造方法 |
| US9309603B2 (en) * | 2011-09-14 | 2016-04-12 | Applied Materials, Inc | Component cleaning in a metal plating apparatus |
| JP6092653B2 (ja) | 2012-02-27 | 2017-03-08 | 株式会社荏原製作所 | 基板洗浄装置及び洗浄方法 |
| KR102112881B1 (ko) * | 2012-03-28 | 2020-05-19 | 노벨러스 시스템즈, 인코포레이티드 | 전자도금 기판 홀더들을 세정하기 위한 방법들 및 장치들 |
| US10307798B2 (en) * | 2015-08-28 | 2019-06-04 | Taiwan Semiconducter Manufacturing Company Limited | Cleaning device for cleaning electroplating substrate holder |
| JP7034880B2 (ja) * | 2018-10-05 | 2022-03-14 | 株式会社荏原製作所 | 洗浄装置、これを備えためっき装置、及び洗浄方法 |
| JP7244408B2 (ja) * | 2019-12-13 | 2023-03-22 | 株式会社荏原製作所 | 基板ホルダ |
| JP7455608B2 (ja) * | 2020-02-25 | 2024-03-26 | 株式会社荏原製作所 | 洗浄方法及び洗浄装置 |
| CN114981486B (zh) * | 2020-12-22 | 2023-03-24 | 株式会社荏原制作所 | 镀覆装置、预湿处理方法以及清洗处理方法 |
-
2021
- 2021-11-04 CN CN202180040817.XA patent/CN116324046B/zh active Active
- 2021-11-04 WO PCT/JP2021/040605 patent/WO2023079636A1/ja not_active Ceased
- 2021-11-04 KR KR1020227041038A patent/KR102544636B1/ko active Active
- 2021-11-04 KR KR1020237019868A patent/KR102782656B1/ko active Active
- 2021-11-04 JP JP2022519586A patent/JP7114002B1/ja active Active
- 2021-11-04 US US17/923,412 patent/US12378689B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102782656B1 (ko) | 2025-03-19 |
| US20240218552A1 (en) | 2024-07-04 |
| WO2023079636A1 (ja) | 2023-05-11 |
| JP7114002B1 (ja) | 2022-08-05 |
| KR20230088928A (ko) | 2023-06-20 |
| KR20230066271A (ko) | 2023-05-15 |
| KR102544636B1 (ko) | 2023-06-20 |
| CN116324046A (zh) | 2023-06-23 |
| US12378689B2 (en) | 2025-08-05 |
| CN116324046B (zh) | 2024-08-02 |
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