JP7113711B2 - エッチング方法、エッチング装置、および記憶媒体 - Google Patents
エッチング方法、エッチング装置、および記憶媒体 Download PDFInfo
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- 238000005530 etching Methods 0.000 title claims description 100
- 238000000034 method Methods 0.000 title claims description 41
- 238000003860 storage Methods 0.000 title claims description 14
- 239000007789 gas Substances 0.000 claims description 242
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 86
- 239000000758 substrate Substances 0.000 claims description 37
- 229910052731 fluorine Inorganic materials 0.000 claims description 36
- 239000011737 fluorine Substances 0.000 claims description 36
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 35
- 239000001257 hydrogen Substances 0.000 claims description 34
- 229910052739 hydrogen Inorganic materials 0.000 claims description 34
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 32
- 238000012545 processing Methods 0.000 claims description 26
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 229910052732 germanium Inorganic materials 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 229910020323 ClF3 Inorganic materials 0.000 claims description 10
- 101100441092 Danio rerio crlf3 gene Proteins 0.000 claims description 10
- JOHWNGGYGAVMGU-UHFFFAOYSA-N trifluorochlorine Chemical compound FCl(F)F JOHWNGGYGAVMGU-UHFFFAOYSA-N 0.000 claims description 10
- 229910006160 GeF4 Inorganic materials 0.000 claims description 9
- PPMWWXLUCOODDK-UHFFFAOYSA-N tetrafluorogermane Chemical compound F[Ge](F)(F)F PPMWWXLUCOODDK-UHFFFAOYSA-N 0.000 claims description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- QUZPNFFHZPRKJD-UHFFFAOYSA-N germane Chemical compound [GeH4] QUZPNFFHZPRKJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052986 germanium hydride Inorganic materials 0.000 claims description 4
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 71
- 238000012546 transfer Methods 0.000 description 19
- 238000010586 diagram Methods 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 9
- 239000011261 inert gas Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- 229910004014 SiF4 Inorganic materials 0.000 description 2
- 229940070337 ammonium silicofluoride Drugs 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- UHZZMRAGKVHANO-UHFFFAOYSA-M chlormequat chloride Chemical compound [Cl-].C[N+](C)(C)CCCl UHZZMRAGKVHANO-UHFFFAOYSA-M 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Description
最初に、本開示の一実施形態に係るエッチング方法の経緯および概要について説明する。
基板の表面部分にSiGeとSiとが存在する場合、例えばSiGeとSiとの積層構造が存在する場合、SiGeをSiに対して選択的にエッチングするために、従来は、上記特許文献1、2に記載されているように、ClF3ガスのようなフッ素含有ガスが用いられていた。
次に、具体的な実施形態について説明する。図1は、一実施形態に係るエッチング方法を示すフローチャートである。
まず、図5に示すように、図2の積層構造を有するチップ21をSiまたはSiGeからなるウエハ20に貼り付けたサンプルを作成し、ClF3ガスによりエッチングを行った。このときの温度は80℃とした。その結果、Siウエハの場合は、チップ21のうちSiGe膜のみエッチングされ、Si膜はほとんどエッチングされなかったのに対して、SiGeウエハの場合は、チップ21のSi膜が大きくエッチングされた。
図8は、図2に示すような、SiGe膜11とSi膜12の積層構造部13を有するウエハWに対して、ClF3ガスでSiGe膜11をエッチングする様子を示す模式図である。図8に示すように、ClF3ガスにより、例えば以下の(1)式でSiGe膜11がエッチングされる(ただし、(1)式では、価数は考慮せず、Cl含有生成物は記載していない)。
SiGe+ClF3→SiF4+GeF4 ・・・(1)
このとき、Si膜12は、ClF3ガスではほとんどエッチングされないが、図8に示すように、(1)式で生成されたGeF4により、Si膜12にダメージが生じる。
図9は、図2に示すような、SiGe膜11とSi膜12の積層構造部13を有するウエハWに対して、ClF3ガス+HFガスでSiGe膜11をエッチングする様子を示す模式図である。図9に示すように、ClF3ガス+HFガスにより、例えば以下の(2)式に従ってSiGe膜11がエッチングされる(ただし、(2)式では、価数は考慮せず、Cl含有生成物は記載していない)。
SiGe+ClF3+HF→SiF4+GeF4+SiH4+GeH4 ・・・(2)
このように、GeF4ガスは生成されるものの、HFガスにより生成されたSiH4ガスおよびGeH4ガスにより、GeF4ガスの濃度が低くなり、Si膜12に到達するGeF4ガスの量が減少してSiのダメージが抑制される。また、図10に示すように、Si膜12の表面が水素含有ガスによりH終端され、Si膜12がGeF4ガスから保護される。これらの作用により、SiGe膜11をエッチングする際のSi膜12のダメージを極めて効果的に抑制することができる。
次に、一実施形態に係るエッチング方法に用いる処理システムの一例について説明する。図11は、処理システムの一例を示す概略構成図である。
次に、一実施形態に係るエッチング方法を実施するためのエッチング装置105の一例について詳細に説明する。
図12はエッチング装置105の一例を示す断面図である。図12に示すように、エッチング装置105は、処理空間を規定する処理容器としての密閉構造のチャンバー140を備えており、チャンバー140の内部には、ウエハWを略水平にした状態で載置させる載置台142が設けられている。また、エッチング装置105は、チャンバー140にエッチングガスを供給するガス供給部143、チャンバー140内を排気する排気部144を備えている。
次に、実験例について説明する。
ここでは、上記図2に示す構造を有するウエハに対し、フッ素含有ガスとしてF2ガス、水素含有ガスとしてHFガス、不活性ガスとしてArガスを供給して、SiGe膜をエッチングした(ケース1)。また、比較のため、同様の構造を有するウエハに対し、HFガスを供給せず、F2ガスとArガスを供給して、SiGe膜をエッチングした(ケース2)。なお、エッチングは、図12に示すような構造のエッチング装置を用いた。このときの条件は以下のとおりとした。
圧力:6.6~66.6Pa(50~500mTorr)
ガス流量:F2=30~100sccm
HF=40~150sccm
Ar=100~250sccm
流量比F2/HF:0.5~5
ウエハ温度:20~120℃
・ケース2
圧力:6.6~66.6Pa(50~500mTorr)
ガス流量:F2=30~200sccm
Ar=100~500sccm
ウエハ温度:20~120℃
ここでは、上記図2に示す構造を有するウエハに対し、フッ素含有ガスとしてClF3ガス、水素含有ガスとしてHFガス、不活性ガスとしてArガスを供給して、SiGe膜をエッチングした(ケース3)。また、比較のため、同様の構造を有するウエハに対し、HFガスを供給せず、ClF3ガスとArガスを供給して、SiGe膜をエッチングした(ケース4)。なお、実験例1と同様、エッチングは、図12に示すような構造のエッチング装置を用いた。このときの条件は以下のとおりとした。
圧力:6.6~66.6Pa(50~500mTorr)
ガス流量:ClF3=1~50sccm
HF =100~500sccm
Ar =100~500sccm
流量比ClF3/HF:0.005~0.5
ウエハ温度:20~120℃
・ケース4
圧力:6.6~66.6Pa(50~500mTorr)
ガス流量:ClF3=1~50sccm
Ar =300~1000sccm
ウエハ温度:20~120℃
以上、実施形態について説明したが、今回開示された実施形態は、全ての点で例示であって制限的なものではないと考えられるべきである。上記の実施形態は、添付の特許請求の範囲およびその主旨を逸脱することなく、様々な形態で省略、置換、変更されてもよい。
11;SiGe膜
12;Si膜
13;積層構造部
14;凹部
100;処理システム
105;エッチング装置
142;載置台
143;処理ガス供給部
144;排気部
165;温度調節器
W;半導体ウエハ(基板)
Claims (13)
- 表面部分にSiGeまたはGeとSiとを有する基板を設ける工程と、
前記基板にフッ素含有ガスと水素含有ガスとを含む処理ガスをプラズマにより励起することなく供給し、前記SiGeまたはGeを前記Siに対して選択的にエッチングする工程と、
を有し、
前記エッチングする工程においては、前記フッ素含有ガスと前記SiGeまたはGeとの反応により生成されるGeF 4 ガスを、前記水素含有ガスと前記SiGeまたはGeとの反応により生成されるSiH 4 ガスおよびGeH 4 ガス、またはGeH 4 ガスにより低濃度化することによって、前記Siのダメージを抑制するエッチング方法。 - 前記エッチングする工程においては、前記水素含有ガスにより前記Siの表面を水素終端することによって、前記Siを前記GeF 4 から保護する、請求項1に記載のエッチング方法。
- 前記SiGeまたはGeが、SiGe膜またはGe膜であり、前記SiがSi膜である、請求項1または請求項2に記載のエッチング方法。
- 前記SiGe膜、前記Ge膜、および前記Si膜は、化学蒸着法により形成されたものである、請求項3に記載のエッチング方法。
- 前記基板は、表面部分に前記SiGe膜と前記Si膜とが交互に積層されてなる積層構造部を有する、請求項3または請求項4に記載のエッチング方法。
- 前記フッ素含有ガスは、ClF3ガス、F2ガス、SF6ガス、IF7ガスからなる群から選択されたものである、請求項1から請求項5のいずれか1項に記載のエッチング方法。
- 前記水素含有ガスは、HFガス、H2ガス、H2Sガスからなる群から選択されたものである、請求項1から請求項6のいずれか1項に記載のエッチング方法。
- 前記水素含有ガスの流量に対する前記フッ素含有ガスの比は、0.001~10の範囲である、請求項1から請求項7のいずれか1項に記載のエッチング方法。
- 前記エッチングする工程における圧力は、0.133~1330Paの範囲である、請求項1から請求項8のいずれか1項に記載のエッチング方法。
- 前記エッチングする工程における基板の温度は、0.1~150℃の範囲である、請求項1から請求項9のいずれか1項に記載のエッチング方法。
- 前記エッチングする工程に先立って行われる、基板の表面の自然酸化膜を除去する工程をさらに有する、請求項1から請求項10のいずれか1項に記載のエッチング方法。
- 表面部分にSiGeまたはGeとSiとを有する基板を収容するチャンバーと、
前記チャンバー内で基板を載置する載置台と、
前記チャンバー内にフッ素含有ガスと水素含有ガスとを含む処理ガスを供給するガス供給部と、
前記チャンバー内を排気する排気部と、
前記載置台上の基板の温度を調節する温調部と、
制御部と、
を具備し、
前記制御部は、
前記基板が前記載置台に載置された状態で、前記基板にフッ素含有ガスと水素含有ガスとを含む処理ガスがプラズマにより励起することなく供給され、前記SiGeまたはGeが前記Siに対して選択的にエッチングされ、前記フッ素含有ガスと前記SiGeまたはGeとの反応により生成されるGeF 4 ガスが、前記水素含有ガスと前記SiGeまたはGeとの反応により生成されるSiH 4 ガスおよびGeH 4 ガス、またはGeH 4 ガスにより低濃度化され、前記Siのダメージが抑制されるように、前記ガス供給部と、前記排気部と、前記温調部とを制御する、エッチング装置。 - コンピュータ上で動作し、エッチング装置を制御するためのプログラムが記憶された記憶媒体であって、前記プログラムは、実行時に、請求項1から請求項11のいずれかのエッチング方法が行われるように、コンピュータに前記エッチング装置を制御させることを特徴とする記憶媒体。
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