JP7113651B2 - 逆行的なプロファイルを有する凹状フィーチャのボイドのない充填方法 - Google Patents
逆行的なプロファイルを有する凹状フィーチャのボイドのない充填方法 Download PDFInfo
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- JP7113651B2 JP7113651B2 JP2018076139A JP2018076139A JP7113651B2 JP 7113651 B2 JP7113651 B2 JP 7113651B2 JP 2018076139 A JP2018076139 A JP 2018076139A JP 2018076139 A JP2018076139 A JP 2018076139A JP 7113651 B2 JP7113651 B2 JP 7113651B2
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- 238000000034 method Methods 0.000 title claims description 46
- 239000007789 gas Substances 0.000 claims description 65
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 42
- 239000003054 catalyst Substances 0.000 claims description 32
- 238000000151 deposition Methods 0.000 claims description 32
- 229910052736 halogen Inorganic materials 0.000 claims description 25
- 150000002367 halogens Chemical class 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 235000012239 silicon dioxide Nutrition 0.000 claims description 24
- 239000000377 silicon dioxide Substances 0.000 claims description 24
- 229910052681 coesite Inorganic materials 0.000 claims description 23
- 229910052906 cristobalite Inorganic materials 0.000 claims description 23
- 229910052682 stishovite Inorganic materials 0.000 claims description 23
- 229910052905 tridymite Inorganic materials 0.000 claims description 23
- 230000008021 deposition Effects 0.000 claims description 22
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims description 12
- ORJFXWYTRPGGRK-UHFFFAOYSA-N hydroxy-tris(2-methylbutan-2-yloxy)silane Chemical compound CCC(C)(C)O[Si](O)(OC(C)(C)CC)OC(C)(C)CC ORJFXWYTRPGGRK-UHFFFAOYSA-N 0.000 claims description 10
- 230000009849 deactivation Effects 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 230000003301 hydrolyzing effect Effects 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- MBMITMZVBNZJTQ-UHFFFAOYSA-N hydroxy-bis[(2-methylpropan-2-yl)oxy]-propan-2-yloxysilane Chemical compound CC(C)O[Si](O)(OC(C)(C)C)OC(C)(C)C MBMITMZVBNZJTQ-UHFFFAOYSA-N 0.000 claims description 4
- HLDBBQREZCVBMA-UHFFFAOYSA-N hydroxy-tris[(2-methylpropan-2-yl)oxy]silane Chemical compound CC(C)(C)O[Si](O)(OC(C)(C)C)OC(C)(C)C HLDBBQREZCVBMA-UHFFFAOYSA-N 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 229910015844 BCl3 Inorganic materials 0.000 claims description 3
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 claims description 3
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims 3
- 239000010936 titanium Substances 0.000 description 31
- 229910004298 SiO 2 Inorganic materials 0.000 description 15
- 239000002243 precursor Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 229910003074 TiCl4 Inorganic materials 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 4
- -1 SiCN Inorganic materials 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910011208 Ti—N Inorganic materials 0.000 description 1
- SYKNUAWMBRIEKB-UHFFFAOYSA-N [Cl].[Br] Chemical compound [Cl].[Br] SYKNUAWMBRIEKB-UHFFFAOYSA-N 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PQLAYKMGZDUDLQ-UHFFFAOYSA-K aluminium bromide Chemical compound Br[Al](Br)Br PQLAYKMGZDUDLQ-UHFFFAOYSA-K 0.000 description 1
- CECABOMBVQNBEC-UHFFFAOYSA-K aluminium iodide Chemical compound I[Al](I)I CECABOMBVQNBEC-UHFFFAOYSA-K 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 150000003983 crown ethers Chemical class 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 150000002240 furans Chemical class 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 150000003235 pyrrolidines Chemical class 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- MNWRORMXBIWXCI-UHFFFAOYSA-N tetrakis(dimethylamido)titanium Chemical compound CN(C)[Ti](N(C)C)(N(C)C)N(C)C MNWRORMXBIWXCI-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- 229910006400 μ-Cl Inorganic materials 0.000 description 1
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Description
この出願は、2017年4月11日に出願された米国仮特許出願番号第62/484,343号に関するものであり、この優先権を主張し、その全内容は、参照によって本願明細書に組み込まれる。
本発明は、基板を処理するための方法に関するものであり、特には、半導体デバイス内に見られる微細な凹状フィーチャのボイドのない材料充填のための方法に関するものである。
AlL1L2L3Dx
を有し、L1、L2、L3は、個々のアニオン性配位子であり、Dは、中性のドナー配位子であり、xは、0、1又は2とすることができる。L1、L2、L3配位子の各々は、アルコキシド、ハロゲン化物、アリールオキシド、アミド、シクロペンタジエニル、アルキル、シリル、アミジナート、β-ジケトナート、ケトイミナート、シラノエート及びカルボン酸塩の群から個々に選択されてもよい。D配位子は、エーテル、フラン、ピリジン、ピロール、ピロリジン、アミン、クラウンエーテル、グライム及びニトリルの群から選択されてもよい。
Claims (18)
- 基板処理方法であって、
開口、側壁及び底を有する凹状フィーチャを含むパターン化された基板を提供するステップであって、前記側壁は、前記凹状フィーチャの頂部から前記凹状フィーチャの前記底まで延在する方向に対して逆行的なプロファイルのエリアを含む、提供ステップと、
前記基板を金属含有触媒層でコーティングするステップであって、前記基板をAlMe3ガスに露出するステップを含む、コーティングステップと、
前記凹状フィーチャの前記開口に近い前記金属含有触媒層の一部を、ハロゲン含有ガスへの露出によって非活性化するステップであって、前記ハロゲン含有ガスは、Cl 2 、BCl 3 、CCl 4 、TiCl 4 又はそれらの組み合わせを含む、非活性化ステップ
と、
前記ハロゲン含有ガスによって非活性化されなかった、前記凹状フィーチャ内の前記金属含有触媒層上に材料を選択的に堆積する、選択的堆積ステップと、
を含む方法。 - 前記コーティングステップ、前記非活性化ステップ及び前記選択的堆積ステップを少なくとも1回繰り返し、追加の量の前記材料をボイドなしで前記凹状フィーチャ内に堆積するステップをさらに含む、
請求項1に記載の方法。 - 前記繰り返しは、前記材料が前記凹状フィーチャを完全に充填されるまで実行される、
請求項2に記載の方法。 - 前記材料は、SiO2を含む、
請求項1に記載の方法。 - 前記SiO2は、任意の酸化及び加水分解剤なしで、かつ、プラズマなしで、前記基板を、約150℃の以下の基板温度で、シラノールガスを含むプロセスガスに露出することによって堆積される、
請求項4に記載の方法。 - 前記プロセスガスは、シラノールガス及び不活性ガスからなる、
請求項5に記載の方法。 - 前記シラノールガスは、トリス(tert-ペントキシ)シラノール、トリス(tert-ブトキシ)シラノール及びビス(tert-ブトキシ)(イソプロポキシ)シラノールからなる群から選択される、
請求項5に記載の方法。 - 基板処理方法であって、
開口、側壁及び底を有する凹状フィーチャを含むパターン化された基板を提供するステップであって、前記側壁は、前記凹状フィーチャの頂部から前記凹状フィーチャの前記底まで延在する方向に対して逆行的なプロファイルのエリアを含む、提供ステップと、
前記基板をアルミニウム含有触媒層でコーティングする、コーティングステップと、
前記凹状フィーチャの前記開口に近い前記アルミニウム含有触媒層の一部を、Cl2を含むハロゲン含有ガスへの露出によって非活性化する、非活性化ステップと、
前記ハロゲン含有ガスによって非活性化されなかった、前記凹状フィーチャ内の前記アルミニウム含有触媒層上に、ある量のSiO2材料を選択的に堆積する、選択的堆積ステップと、
を含む方法。 - 前記コーティングステップ、前記非活性化ステップ及び前記選択的堆積ステップを少なくとも1回繰り返し、追加の量の前記SiO2材料をボイドなしで前記凹状フィーチャ内に堆積するステップをさらに含む、
請求項8に記載の方法。 - 前記繰り返しは、前記SiO2材料が前記凹状フィーチャを完全に充填するまで実行される、
請求項9に記載の方法。 - 前記SiO2材料は、任意の酸化及び加水分解剤なしで、かつ、プラズマなしで、前記基板を、約150℃以下の基板温度で、シラノールガスを含むプロセスガスに露出することによって堆積される、
請求項8に記載の方法。 - 前記プロセスガスは、シラノールガス及び不活性ガスからなる、
請求項11に記載の方法。 - 前記シラノールガスは、トリス(tert-ペントキシ)シラノール、トリス(tert-ブトキシ)シラノール及びビス(tert-ブトキシ)(イソプロポキシ)シラノールからなる群から選択される、
請求項11に記載の方法。 - 基板処理方法であって、
開口、側壁及び底を有する凹状フィーチャを含むパターン化された基板を提供するステップであって、前記側壁は、前記凹状フィーチャの頂部から前記凹状フィーチャの前記底まで延在する方向に対して逆行的なプロファイルのエリアを含む、提供ステップと、
前記基板をAlMe3含有触媒層でコーティングする、コーティングステップと、
前記凹状フィーチャの前記開口に近い前記AlMe3含有触媒層の一部を、ハロゲン含有ガスへの露出によって非活性化するステップであって、前記ハロゲン含有ガスは、Cl 2 、BCl 3 、CCl 4 、TiCl 4 又はそれらの組み合わせを含む、非活性化ステップと、
前記ハロゲン含有ガスによって非活性化されなかった、前記凹状フィーチャ内の前記AlMe3含有触媒層上に、ある量のSiO2材料を選択的に堆積する、選択的堆積ステップと、
前記コーティングステップ、前記非活性化ステップ及び前記選択的堆積ステップを少なくとも1回繰り返し、前記SiO2材料が前記凹状フィーチャを完全に充填するまで、追加の量の前記SiO2材料を堆積する、堆積ステップと、
を含む方法。 - 前記SiO2材料は、任意の酸化及び加水分解剤なしで、かつ、プラズマなしで、前記基板を、約150℃以下の基板温度で、シラノールガスを含むプロセスガスに露出することによって堆積され、前記シラノールガスは、トリス(tert-ペントキシ)シラノール、トリス(tert-ブトキシ)シラノール及びビス(tert-ブトキシ)(イソプロポキシ)シラノールからなる群から選択される、
請求項14に記載の方法。 - 前記コーティングステップは、前記基板をAlMe3ガスに露出するステップを含む、
請求項8記載の方法。 - 前記SiO2材料は、任意の酸化及び加水分解剤なしで、かつ、プラズマなしで、前記基板を、約150℃以下の基板温度で、シラノールガスを含むプロセスガスに露出することによって堆積される、
請求項14記載の方法。 - 前記ハロゲン含有ガスはCl2を含む、
請求項14記載の方法。
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