JP7111140B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7111140B2
JP7111140B2 JP2020158041A JP2020158041A JP7111140B2 JP 7111140 B2 JP7111140 B2 JP 7111140B2 JP 2020158041 A JP2020158041 A JP 2020158041A JP 2020158041 A JP2020158041 A JP 2020158041A JP 7111140 B2 JP7111140 B2 JP 7111140B2
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JP
Japan
Prior art keywords
wire
electrode
semiconductor element
bonding
wiring member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020158041A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021061393A (ja
JP2021061393A5 (https=
Inventor
大輔 福岡
知巳 奥村
祐司 大谷
渉 小林
匠 野村
智明 満永
敬洋 平野
孝充 坂井
賢吾 岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to CN202511095690.8A priority Critical patent/CN120933255A/zh
Priority to PCT/JP2020/036372 priority patent/WO2021065736A1/ja
Priority to CN202080069629.5A priority patent/CN114503255B/zh
Publication of JP2021061393A publication Critical patent/JP2021061393A/ja
Publication of JP2021061393A5 publication Critical patent/JP2021061393A5/ja
Priority to US17/708,525 priority patent/US12315825B2/en
Application granted granted Critical
Publication of JP7111140B2 publication Critical patent/JP7111140B2/ja
Priority to US19/189,450 priority patent/US20250259946A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2020158041A 2019-10-04 2020-09-22 半導体装置 Active JP7111140B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202511095690.8A CN120933255A (zh) 2019-10-04 2020-09-25 半导体装置
PCT/JP2020/036372 WO2021065736A1 (ja) 2019-10-04 2020-09-25 半導体装置
CN202080069629.5A CN114503255B (zh) 2019-10-04 2020-09-25 半导体装置
US17/708,525 US12315825B2 (en) 2019-10-04 2022-03-30 Semiconductor device having wire pieces in bonding member
US19/189,450 US20250259946A1 (en) 2019-10-04 2025-04-25 Semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019184066 2019-10-04
JP2019184066 2019-10-04

Publications (3)

Publication Number Publication Date
JP2021061393A JP2021061393A (ja) 2021-04-15
JP2021061393A5 JP2021061393A5 (https=) 2021-10-14
JP7111140B2 true JP7111140B2 (ja) 2022-08-02

Family

ID=75381495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020158041A Active JP7111140B2 (ja) 2019-10-04 2020-09-22 半導体装置

Country Status (1)

Country Link
JP (1) JP7111140B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120356880B (zh) * 2021-08-09 2026-03-31 华为技术有限公司 一种功率模块、电源电路及芯片
JP7848487B2 (ja) * 2022-01-24 2026-04-21 富士電機株式会社 半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311577A (ja) 2006-05-18 2007-11-29 Rohm Co Ltd 半導体装置
JP2008153432A (ja) 2006-12-18 2008-07-03 Renesas Technology Corp 半導体装置およびその製造方法
JP2012069703A (ja) 2010-09-22 2012-04-05 Toshiba Corp 半導体モジュール及び半導体モジュールの製造方法
JP2014112608A (ja) 2012-12-05 2014-06-19 Denso Corp 半導体装置
WO2017187998A1 (ja) 2016-04-26 2017-11-02 三菱電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0397234A (ja) * 1989-09-11 1991-04-23 Nec Corp 半導体ペレット搭載基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311577A (ja) 2006-05-18 2007-11-29 Rohm Co Ltd 半導体装置
JP2008153432A (ja) 2006-12-18 2008-07-03 Renesas Technology Corp 半導体装置およびその製造方法
JP2012069703A (ja) 2010-09-22 2012-04-05 Toshiba Corp 半導体モジュール及び半導体モジュールの製造方法
JP2014112608A (ja) 2012-12-05 2014-06-19 Denso Corp 半導体装置
WO2017187998A1 (ja) 2016-04-26 2017-11-02 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JP2021061393A (ja) 2021-04-15

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