JP7108424B2 - 保護膜形成装置 - Google Patents
保護膜形成装置 Download PDFInfo
- Publication number
- JP7108424B2 JP7108424B2 JP2018027830A JP2018027830A JP7108424B2 JP 7108424 B2 JP7108424 B2 JP 7108424B2 JP 2018027830 A JP2018027830 A JP 2018027830A JP 2018027830 A JP2018027830 A JP 2018027830A JP 7108424 B2 JP7108424 B2 JP 7108424B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- nozzle
- ring frame
- holding table
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 title claims description 40
- 239000011347 resin Substances 0.000 claims description 74
- 229920005989 resin Polymers 0.000 claims description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 58
- 238000004140 cleaning Methods 0.000 description 10
- 238000003754 machining Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000005406 washing Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Coating Apparatus (AREA)
- Laser Beam Processing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
12:加工テーブル 13:フレーム保持手段
14:加工送り手段 140:ボールネジ 141:モータ 142:ガイドレール
143:X軸ベース
15:割り出し送り手段 150:ボールネジ 151:モータ
152:ガイドレール 153:Y軸ベース
16:搬送手段 160:保持部 161:ボールネジ 162:モータ
163:ガイドレール 164:移動部
17:レーザー加工手段 170:ケーシング 171:加工ヘッド
18:制御手段
2:保護膜形成装置 200:加工室
20:保持テーブル 21:回転手段 22:フレーム保持手段
23,23A:供給手段
24,24a:樹脂ノズル 25,25a:水ノズル 26,26a:エアノズル
27:アーム 27a:第1アーム 27b:第2アーム 28:回転軸 29:アーム
Claims (1)
- リングフレームの開口を塞いで該リングフレームに貼着したテープにウェーハが貼着されて構成されるワークセットを保持する保持テーブルと、該保持テーブルの保持面の中心を軸に該保持テーブルを回転させる回転手段と、該保持テーブルが保持したウェーハの上面に水溶性樹脂を供給する供給手段とを備え、該保持テーブルを回転させてウェーハの上面に水溶性保護膜を形成する保護膜形成装置であって、
該供給手段は、該保持テーブルが保持したワークセットのウェーハの上面中央に水溶性樹脂を供給する樹脂ノズルと、
該保持テーブルが保持したワークセットのリングフレームの上面に水を供給する水ノズルと、
該保持テーブルが保持したワークセットの該リングフレームの上面にエアを供給するエアノズルと、を備え、
該樹脂ノズルと該水ノズルと該エアノズルとは、該保持テーブルの保持面方向に延在するアームに配設され、
該水ノズルより該保持テーブルの回転方向下流側に該エアノズルが配設され、
該アームは、一端を軸として該保持面に平行な方向に旋回可能であり、
該樹脂ノズルは、該アームを旋回させて該エアノズルからのエア及び該水ノズルからの水を該リングフレームの上面に供給する際に、該リングフレームの外側上方に位置するよう該アームに配設される
保護膜形成装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018027830A JP7108424B2 (ja) | 2018-02-20 | 2018-02-20 | 保護膜形成装置 |
SG10201900645RA SG10201900645RA (en) | 2018-02-20 | 2019-01-24 | Protective film forming apparatus |
CN201910123027.2A CN110176412B (zh) | 2018-02-20 | 2019-02-18 | 保护膜形成装置 |
TW108105373A TWI787466B (zh) | 2018-02-20 | 2019-02-19 | 保護膜形成裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018027830A JP7108424B2 (ja) | 2018-02-20 | 2018-02-20 | 保護膜形成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019145642A JP2019145642A (ja) | 2019-08-29 |
JP7108424B2 true JP7108424B2 (ja) | 2022-07-28 |
Family
ID=67689314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018027830A Active JP7108424B2 (ja) | 2018-02-20 | 2018-02-20 | 保護膜形成装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7108424B2 (ja) |
CN (1) | CN110176412B (ja) |
SG (1) | SG10201900645RA (ja) |
TW (1) | TWI787466B (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002270592A (ja) | 2000-12-04 | 2002-09-20 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2003045839A (ja) | 2001-08-02 | 2003-02-14 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2008270402A (ja) | 2007-04-18 | 2008-11-06 | Tokyo Electron Ltd | 基板洗浄装置および基板洗浄方法 |
JP2012018980A (ja) | 2010-07-06 | 2012-01-26 | Tokyo Electron Ltd | 基板洗浄装置および基板洗浄方法 |
JP2015138961A (ja) | 2014-01-24 | 2015-07-30 | 東京エレクトロン株式会社 | 処理液ノズル及び塗布処理装置 |
JP2017092379A (ja) | 2015-11-16 | 2017-05-25 | 株式会社ディスコ | 保護膜被覆方法 |
JP2017228728A (ja) | 2016-06-24 | 2017-12-28 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10199852A (ja) * | 1997-01-13 | 1998-07-31 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置 |
JP4871096B2 (ja) * | 2006-11-15 | 2012-02-08 | 株式会社ディスコ | 樹脂被覆装置及びレーザー加工装置 |
JP6494451B2 (ja) * | 2015-07-06 | 2019-04-03 | 株式会社ディスコ | チャックテーブル及び洗浄装置 |
-
2018
- 2018-02-20 JP JP2018027830A patent/JP7108424B2/ja active Active
-
2019
- 2019-01-24 SG SG10201900645RA patent/SG10201900645RA/en unknown
- 2019-02-18 CN CN201910123027.2A patent/CN110176412B/zh active Active
- 2019-02-19 TW TW108105373A patent/TWI787466B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002270592A (ja) | 2000-12-04 | 2002-09-20 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2003045839A (ja) | 2001-08-02 | 2003-02-14 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2008270402A (ja) | 2007-04-18 | 2008-11-06 | Tokyo Electron Ltd | 基板洗浄装置および基板洗浄方法 |
JP2012018980A (ja) | 2010-07-06 | 2012-01-26 | Tokyo Electron Ltd | 基板洗浄装置および基板洗浄方法 |
JP2015138961A (ja) | 2014-01-24 | 2015-07-30 | 東京エレクトロン株式会社 | 処理液ノズル及び塗布処理装置 |
JP2017092379A (ja) | 2015-11-16 | 2017-05-25 | 株式会社ディスコ | 保護膜被覆方法 |
JP2017228728A (ja) | 2016-06-24 | 2017-12-28 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN110176412B (zh) | 2024-05-31 |
JP2019145642A (ja) | 2019-08-29 |
TW201934207A (zh) | 2019-09-01 |
TWI787466B (zh) | 2022-12-21 |
CN110176412A (zh) | 2019-08-27 |
SG10201900645RA (en) | 2019-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6222903B2 (ja) | レーザ加工装置 | |
JP5881464B2 (ja) | ウェーハのレーザー加工方法 | |
JP5921373B2 (ja) | バイト切削装置 | |
KR20170057145A (ko) | 보호막 피복 방법 | |
KR20160105298A (ko) | 절삭 장치 | |
JP4777072B2 (ja) | ダイシング装置 | |
JP7108424B2 (ja) | 保護膜形成装置 | |
JP5637769B2 (ja) | レーザー加工装置 | |
JP2013008823A (ja) | 切断装置 | |
TWI745830B (zh) | 液處理裝置及液處理方法 | |
JP4721968B2 (ja) | スピンナ洗浄装置 | |
JP6305750B2 (ja) | 静電気除去装置を備えた加工機 | |
JP2004327613A (ja) | 洗浄方法および洗浄装置 | |
US20210346990A1 (en) | Workpiece processing method | |
JP2021034647A (ja) | 保護膜被覆装置、及び保護膜被覆装置を備えたレーザー加工装置 | |
KR101687423B1 (ko) | 가공 장치 | |
JP2016162769A (ja) | ウエーハの加工方法 | |
JP6987450B2 (ja) | 切削装置 | |
JP7471671B2 (ja) | 基板洗浄装置及び基板洗浄方法 | |
JP6276982B2 (ja) | スピンナー洗浄装置 | |
JP2013123775A (ja) | バイト切削装置 | |
JP2014220449A (ja) | 加工装置 | |
JP3290773B2 (ja) | 処理装置および処理方法 | |
JP2006041399A (ja) | ウエーハの分割方法および分割装置 | |
JPH118192A (ja) | 処理装置および処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201209 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20211111 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211214 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220210 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220621 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220715 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7108424 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |