JP7107688B2 - 研磨方法および研磨装置 - Google Patents

研磨方法および研磨装置 Download PDF

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Publication number
JP7107688B2
JP7107688B2 JP2018009755A JP2018009755A JP7107688B2 JP 7107688 B2 JP7107688 B2 JP 7107688B2 JP 2018009755 A JP2018009755 A JP 2018009755A JP 2018009755 A JP2018009755 A JP 2018009755A JP 7107688 B2 JP7107688 B2 JP 7107688B2
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Japan
Prior art keywords
substrate
polishing
pressing
substrate holding
inclination
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JP2018009755A
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Japanese (ja)
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JP2018171698A (ja
JP2018171698A5 (enExample
Inventor
峯杰 杜
誠 柏木
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Ebara Corp
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Ebara Corp
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Priority to PCT/JP2018/007777 priority Critical patent/WO2018180170A1/ja
Priority to TW107109584A priority patent/TWI768011B/zh
Publication of JP2018171698A publication Critical patent/JP2018171698A/ja
Publication of JP2018171698A5 publication Critical patent/JP2018171698A5/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Disintegrating Or Milling (AREA)
JP2018009755A 2017-03-30 2018-01-24 研磨方法および研磨装置 Active JP7107688B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/007777 WO2018180170A1 (ja) 2017-03-30 2018-03-01 研磨方法および研磨装置
TW107109584A TWI768011B (zh) 2017-03-30 2018-03-21 研磨方法及研磨裝置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017068444 2017-03-30
JP2017068444 2017-03-30

Publications (3)

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JP2018171698A JP2018171698A (ja) 2018-11-08
JP2018171698A5 JP2018171698A5 (enExample) 2021-02-25
JP7107688B2 true JP7107688B2 (ja) 2022-07-27

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JP2018009755A Active JP7107688B2 (ja) 2017-03-30 2018-01-24 研磨方法および研磨装置

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JP (1) JP7107688B2 (enExample)
TW (1) TWI768011B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7235587B2 (ja) * 2019-05-14 2023-03-08 株式会社ディスコ 荷重センサの電圧調整方法
JP7278153B2 (ja) * 2019-06-04 2023-05-19 東京エレクトロン株式会社 基板加工装置、および基板加工方法
CN111922880A (zh) * 2020-09-09 2020-11-13 昆山欣建群精密工业有限公司 一种零件加工用抛光装置
CN112720246A (zh) * 2020-12-29 2021-04-30 安徽省旌德旌峰机械制造有限公司 一种基于气动控制机械加工用研磨设备
CN113488428A (zh) * 2021-06-04 2021-10-08 拓荆科技股份有限公司 一种晶圆载台垂直和水平位置的调节装置及其调节方法
JP2023127044A (ja) * 2022-03-01 2023-09-13 株式会社荏原製作所 研磨ヘッドおよび研磨装置
CN115502854A (zh) * 2022-09-14 2022-12-23 舟山中远海运重工有限公司 一种高压弥雾船舶除锈设备
KR20250116063A (ko) * 2022-12-02 2025-07-31 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 방법, 처리 헤드 및 기판 처리 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022059A (ja) 2003-07-02 2005-01-27 Ebara Corp 研削盤及び研削方法
JP2009119537A (ja) 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP2010131687A (ja) 2008-12-03 2010-06-17 Disco Abrasive Syst Ltd 研削装置および研削方法
JP2015196211A (ja) 2014-03-31 2015-11-09 株式会社荏原製作所 研磨装置及び研磨方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3166146B2 (ja) * 1995-05-26 2001-05-14 株式会社東京精密 表面研削方法及びその装置
US10702972B2 (en) * 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
JP2016046341A (ja) * 2014-08-21 2016-04-04 株式会社荏原製作所 研磨方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022059A (ja) 2003-07-02 2005-01-27 Ebara Corp 研削盤及び研削方法
JP2009119537A (ja) 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP2010131687A (ja) 2008-12-03 2010-06-17 Disco Abrasive Syst Ltd 研削装置および研削方法
JP2015196211A (ja) 2014-03-31 2015-11-09 株式会社荏原製作所 研磨装置及び研磨方法

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Publication number Publication date
JP2018171698A (ja) 2018-11-08
TWI768011B (zh) 2022-06-21
TW201838017A (zh) 2018-10-16

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